Loading...

KAI-50140-AXA-JD-AE

Onsemi

KAI-50140-AXA-JD-AE by Onsemi

KAI-50140-AXA-JD-AE by Onsemi is an image sensor with 4.5X4.5 um pixel size, 60 MHz master clock, and 15.5 V max supply voltage. Ideal for applications requiring high-resolution imaging in environments with temperatures ranging from -50 to 60 °C, such as industrial machine vision systems or medical imaging devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

487

-

-

-

-

Digiode

USA . 118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

118

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 8,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,132

-

-

-

-

Problanco Electronics

Mexico . 4,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,480

-

-

-

-

Kulean Microsystems

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,600

-

-

-

-

TANS Electronics

Latvia . 2,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,301

-

-

-

-

UHIMA Technologies

Türkiye . 763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

763

-

-

-

-

Corphita

USA . 423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

423

-

-

-

-

Corohmni

South Africa . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

296

-

-

-

-

Overview

Upgrade your imaging systems with the KAI-50140-AXA-JD-AE image sensor by Onsemi. With its high-quality manufacturing and cutting-edge technology, this sensor delivers unparalleled performance in a wide range of applications. From industrial machine vision to medical imaging, this sensor offers exceptional value with its superior image quality, precise output, and reliable operation. Trust Onsemi for all your imaging needs and experience the difference with the KAI-50140-AXA-JD-AE.

Feature Benefit Bullets

Pixel Size (um): 4.5X4.5

Smaller pixel size allows for higher resolution images to be captured, making this sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power input, allowing for stable operation even in fluctuating voltage conditions.

Master Clock: 60 MHz

High master clock frequency enables fast data readout and processing, making this sensor suitable for applications requiring real-time image capture.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high image quality and low noise levels, making them ideal for applications requiring accurate and clear image capture.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy integration into various devices or systems, providing flexibility in design and implementation.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in reducing power consumption and extending the operating life of the sensor, making it energy-efficient.

Maximum Operating Temperature: 60 °C

Wide operating temperature range enables this sensor to be used in various environmental conditions, from extreme cold to moderate heat.

Horizontal Pixel: 10440

High horizontal pixel count allows for wider image capture, providing detailed, high-resolution images suitable for various applications.

Output Type: DIGITAL OUTPUT

Digital output simplifies integration and processing of captured data, making it easier to connect this sensor to other digital systems or devices.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures reliable performance even in extremely cold environments, making this sensor versatile and suitable for diverse applications.

Maximum Operating Current: 11 mA

Low operating current consumption helps in reducing power usage, making this sensor energy-efficient and cost-effective in long-term operation.

Housing: GLASS

Glass housing provides durability and protection to the sensor components, ensuring long-term reliability and performance in various operating conditions.

Dynamic Range: 60 dB

Wide dynamic range allows this sensor to capture both bright and dark areas in the same scene accurately, providing high-quality images with detailed contrast.

Vertical Pixel: 4800

High vertical pixel count allows for tall image capture, enabling this sensor to capture detailed images with accurate vertical resolution for various applications.

Termination Type: SOLDER

Solder termination provides secure connection and stability in mounting the sensor, ensuring reliable performance in various operating conditions.

Array Type: FRAME

Frame array type allows for structured image capture with precise alignment, producing high-quality images suitable for applications requiring accurate imaging.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mount feature allows for secure installation and integration of the sensor into devices or systems, providing stability and reliability in operation.

Technical Specifications

Image Sensors KAI-50140-AXA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Dynamic Range:

60 dB

Horizontal Pixel:

10440

Housing:

GLASS

Master Clock:

60 MHz

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

4.5X4.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4800

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12