Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-50140-AXB-JD-B1 by Onsemi is an image sensor with 4.5x4.5 um pixel size, 60 MHz master clock, and 10440 horizontal pixels. It operates b/w -50 to 60 °C and has a max supply voltage of 15.5 V. Ideal for digital output applications in various industries due to its high dynamic range and frame array type design.
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The small pixel size allows for high resolution and sharp images to be captured, making this image sensor ideal for applications where detailed images are crucial.
The high maximum supply voltage ensures that the image sensor can operate reliably even under demanding conditions, providing stability and consistency in performance.
The fast master clock speed of 60 MHz allows for rapid processing and data transfer, enabling quick and efficient image capture and output.
CCD sensors are known for their high-quality image capture and low noise levels, making this image sensor a great choice for applications requiring superior image quality.
The relatively low minimum supply voltage ensures efficient power usage and helps in reducing overall power consumption, making this image sensor a cost-effective option.
With a high maximum operating temperature of 60 °C, this image sensor can withstand heat and harsh environmental conditions, ensuring durability and reliability in various applications.
The high horizontal pixel count allows for wide and detailed image capture, making this image sensor suitable for applications requiring expansive coverage and high resolution.
Digital output simplifies data processing and transmission, making it easier to integrate this image sensor with other digital systems and devices for seamless operation.
The low minimum operating temperature of -50 °C ensures that this image sensor can function effectively even in extremely cold environments, expanding its versatility in different applications.
The low maximum operating current of 11 mA indicates efficient power usage and helps in prolonging battery life, making this image sensor a practical choice for portable or battery-powered devices.
The use of glass housing provides protection and durability to the image sensor, safeguarding its internal components and ensuring long-lasting performance in various operating conditions.
With a dynamic range of 60 dB, this image sensor can capture a wide range of light intensities accurately, resulting in well-balanced and detailed images with enhanced contrast and clarity.
The high vertical pixel count allows for detailed and high-resolution image capture in the vertical direction, making this image sensor suitable for applications requiring precise vertical alignment and clarity.
Solder termination ensures secure and reliable connections, minimizing the risk of disconnections or signal loss, and contributing to the overall stability and performance of the image sensor.
The frame array type allows for organized and structured image capture, enabling efficient processing and analysis of image data, making this image sensor a versatile and practical choice for various applications.
The through-hole mounting feature provides secure and stable attachment of the image sensor to a circuit board or mounting surface, ensuring reliable operation and minimizing the risk of physical damage or dislodgement.
Image Sensors KAI-50140-AXB-JD-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi
Array Type:
Dynamic Range:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM555CM
Fairchild Semiconductor
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Central Semiconductor
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
LM317TG
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
Secos
TC281
TC281 by Texas Instruments is an image sensor with 8x8 um pixel size, 13V power supply, and max operating temp of 45°C. With 1010 horizontal pixels and 1030 vertical pixels, it's ideal for THROUGH HOLE MOUNT applications in various industries.
KAI-0330-ABA-CB-BA-SINGLE
Image Sensors;
MT9V022177ATMC
The Onsemi MT9V022177ATMC image sensor features 6x6 um pixel size, 26.6 MHz master clock, and 752x480 resolution. Ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.
AR0134CSSM00SPCA0-TPBR
Onsemi's AR0134CSSM00SPCA0-TPBR is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70°C, with a max supply voltage of 1.95V and data rate of 700Mbps. Ideal for applications requiring high-resolution imaging in compact devices.
KAI-02050-FBA-JB-B2-T
Onsemi's KAI-02050-FBA-JB-B2-T is a 5.5x5.5 um pixel size CCD image sensor with 1600H x 1200V resolution and 64 dB dynamic range. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-quality images in varying temperatures.
MT9V032C12STM-DP
Onsemi's MT9V032C12STM-DP is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It operates at 26.6 MHz master clock, offering 752 (H) x 480 (V) resolution for applications requiring high-quality digital imaging at up to 60 fps frame rate. Ideal for surface mounting in devices needing -30 to 70 °C temperature range and a dynamic range of 54.4 dB.
KAI-04050-CBA-JD-BA
KAI-04050-CBA-JD-BA by Onsemi is an image sensor with 5.5x5.5um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates at temperatures from -50 to 70 °C and has a dynamic range of 64 dB. Ideal for applications requiring high-quality imaging in various environments.
NOIP1FN5000A-QTI
NOIP1FN5000A-QTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592H x 2048V pixels, offering a dynamic range of 60 dB and sensitivity of 7.5 V/lx.s. It operates b/w -40 to 85 °C, has a max supply voltage of 1.9 V, and supports a frame rate of up to 100 fps. Ideal for applications requiring high-resolution imaging in various lighting conditions.
KAF-8300-AXC-CD-AE
The Onsemi KAF-8300-AXC-CD-AE is a CCD image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, making it suitable for high-resolution imaging applications in various industries such as astronomy and microscopy.
AR0135CS2M00SUEA0-DPBR2
Onsemi's AR0135CS2M00SUEA0-DPBR2 is a 1/3 inch CMOS image sensor with a 9mm square package. It features solder termination, frame array type, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact spaces like mobile devices and security cameras.
AR0238CSSC12SPRA0-DR
Onsemi's AR0238CSSC12SPRA0-DR image sensor features 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality digital imaging with a frame rate of 30 fps in a compact square package.
KAI-2001-ABA-CP-BA
KAI-2001-ABA-CP-BA by Onsemi is an Image Sensor with 7.4X7.4 um pixel size, 1600H x 1200V resolution, and 60 dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V, outputs analog voltage at a rate of 40 Mbps, and is suitable for applications requiring high-quality image capture in various industries.
MT9V131C12STC-TR
MT9V131C12STC-TR by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size and 27 MHz master clock. Ideal for digital cameras, it offers a dynamic range of 60 dB and operates at temperatures ranging from -20 to 70 °C.
KAI-2001-AAA-CF-AE
KAI-2001-AAA-CF-AE by Onsemi is an Image Sensor with 7.4X7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 15.5 V and has a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AS0149ATSC00XUEA0-DPBR-E
IMAGE SENSOR,CMOS;
CYIL1SM4000AA-GDC
CYIL1SM4000AA-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and a 33 MHz master clock. It operates at temperatures from 0 to 60 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-47051-FXA-JD-B1
KAI-47051-FXA-JD-B1 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
KAI-08051-AAA-JP-AE
Onsemi's KAI-08051-AAA-JP-AE is a 5.5x5.5 um pixel size CCD image sensor with 3364H x 2520V resolution, offering a dynamic range of 66 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and is ideal for industrial imaging applications due to its high-quality image capture capabilities.
11KAI-04070-QBA-JD-BA
The Onsemi 11KAI-04070-QBA-JD-BA is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 70.5dB dynamic range. Ideal for applications requiring high-resolution imaging in industrial cameras or machine vision systems due to its rectangular package style and through-hole mounting feature.
NOIL2SM1300A-GDC
NOIL2SM1300A-GDC by Onsemi is an image sensor with 14x14 um pixel size, 315 MHz master clock, and 1280 horizontal pixels. Ideal for digital output applications in cameras, offering a max supply voltage of 2.625 V and operating temperature range of 0-70 °C.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-50140-AXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 60 MHz; Minimum Supply Voltage: 14.5 V;
KAI-50140-AXA-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 4800; Housing: GLASS;
KAI-50140-AXA-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 10440; Master Clock: 60 MHz;
KAI-50140-AXA-JP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Maximum Operating Current: 11 mA;
KAI-50140-AXA-JP-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Horizontal Pixel: 10440;
KAI-50140-AXA-JP-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 60 MHz; Housing: GLASS;
KAI-50140-AXB-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 60 MHz; Dynamic Range: 60 dB;
KAI-50140-AXB-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Horizontal Pixel: 10440;
KAI-50140-FXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Maximum Operating Temperature: 60 Cel;
KAI-50140-FXA-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Vertical Pixel: 4800;
KAI-50140-FXA-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Housing: GLASS;
KAI-50140-QXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Vertical Pixel: 4800;
Supply Digital Components
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12,000 In-Stock
Total price ≈ $80,197.29
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