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AR0143ATSC00XUEA0-TRBR

Onsemi

AR0143ATSC00XUEA0-TRBR by Onsemi

Onsemi's AR0143ATSC00XUEA0-TRBR is a 9mm x 1.55mm CMOS image sensor with 1344x968 resolution, suitable for frame array applications. It features a 2-WIRE interface, solder termination, and operates at 30fps. Ideal for surface mount installations in various imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,653 parts In-Stock

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Digiode

USA . 452 parts In-Stock

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Native Components

USA . 175 parts In-Stock

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$0.860

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Northwest PG Solutions

USA . 1,336 parts In-Stock

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AZTECH Wire

Italy . 627 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 6,460 parts In-Stock

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Kulean Microsystems

USA . 6,343 parts In-Stock

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SupplyDigital Components

Austria . 6,290 parts In-Stock

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TANS Electronics

Latvia . 1,624 parts In-Stock

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UHIMA Technologies

Türkiye . 845 parts In-Stock

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Corohmni

South Africa . 365 parts In-Stock

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Corphita

USA . 234 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0143ATSC00XUEA0-TRBR image sensor by Onsemi. Known for their quality and reliability, Onsemi delivers cutting-edge technology that exceeds industry standards. This image sensor is perfect for a wide range of applications, from security cameras to automotive systems, providing unmatched performance and precision. Elevate your projects with the value and benefits this product offers, delivering crisp and detailed images that will impress even the most discerning customers.

Feature Benefit Bullets

Body Width: 9 inch

The wide body width allows for more space to embed the image sensor into various devices, making it versatile for different applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high image quality, providing efficient performance for capturing images.

Body Height: 1.55 mm

The low body height allows for a slim profile, making it suitable for thin devices or applications where space is limited.

Package Shape or Style: SQUARE

The square package shape provides a compact design, making it easier to integrate the image sensor into various electronic devices.

Horizontal Pixel: 1344

With a high horizontal pixel count, the image sensor can capture detailed images with sharp resolution, ideal for applications requiring high image quality.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish options provide flexibility for different soldering methods, ensuring a reliable connection for the image sensor.

Vertical Pixel: 968

The high vertical pixel count allows for capturing images with good depth and clarity, enhancing the overall image quality.

Body Length/Diameter: 9 mm

The compact body length or diameter makes the image sensor suitable for smaller devices or applications where space is limited.

Optical Format (inch): 1/4

The 1/4 inch optical format provides a good balance between size and image quality, making it a versatile choice for various imaging applications.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable connection, preventing connectivity issues during operation.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connection process and allows for easy integration with other electronic components, enhancing the overall functionality of the image sensor.

Frame Rate: 30 fps

The high frame rate of 30 fps enables smooth and fluid video recording or image capture, suitable for applications requiring real-time image processing.

Array Type: FRAME

The frame array type allows for capturing images in a structured grid pattern, enabling efficient image processing and analysis.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and allows for secure attachment to the device, ensuring stability during operation.

Technical Specifications

Image Sensors AR0143ATSC00XUEA0-TRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

Frame Rate:

30 fps

Horizontal Pixel:

1344

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

968

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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