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AR0140AT3C00XUEA0-TPBR

Onsemi

AR0140AT3C00XUEA0-TPBR by Onsemi

Onsemi's AR0140AT3C00XUEA0-TPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution. It features a square package, solder termination, and 2-wire interface. Ideal for surface mount applications in various imaging systems like cameras and scanners.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 5,050 parts In-Stock

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Vyrian

USA . 6,472 parts In-Stock

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USA . 5,050 parts In-Stock

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Digiode

USA . 1,278 parts In-Stock

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Native Components

USA . 600 parts In-Stock

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AZTECH Wire

Italy . 76 parts In-Stock

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$10.170

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TANS Electronics

Latvia . 8,358 parts In-Stock

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Problanco Electronics

Mexico . 6,527 parts In-Stock

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Corphita

USA . 1,936 parts In-Stock

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Northwest PG Solutions

USA . 1,489 parts In-Stock

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Kulean Microsystems

USA . 1,040 parts In-Stock

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SupplyDigital Components

Austria . 653 parts In-Stock

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UHIMA Technologies

Türkiye . 545 parts In-Stock

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Corohmni

South Africa . 87 parts In-Stock

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Overview

Capture every moment in stunning detail with the AR0140AT3C00XUEA0-TPBR image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This cutting-edge image sensor is perfect for a wide range of applications, from automotive to security cameras. With its high resolution and advanced features, customers can expect unparalleled performance and exceptional value. Don't settle for anything less than the best - choose the AR0140AT3C00XUEA0-TPBR for all your imaging needs.

Feature Benefit Bullets

Body Width: 9 inch

The product has a compact and slim design, making it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high quality image capture, providing efficient and reliable performance.

Body Height: 1.55 mm

The low height of the sensor enables it to be easily integrated into compact devices while maintaining a sleek profile.

Package Shape or Style: SQUARE

The square package shape allows for easy mounting and alignment in electronic product designs, simplifying the manufacturing process.

Horizontal Pixel: 1280

Higher horizontal pixel count results in better image resolution and sharpness, enhancing the overall image quality captured by the sensor.

Terminal Finish: Tin/Silver/Copper

The use of high-quality terminal finishes like Tin/Silver/Copper ensures reliable electrical connections and long-term performance of the sensor.

Vertical Pixel: 800

The vertical pixel count contributes to the overall image detail and clarity, allowing for precise image capture in a wide range of applications.

Body Length/Diameter: 9 mm

The small body length/diameter of the sensor makes it suitable for compact devices and minimizes the space required for mounting.

Optical Format (inch): 1/4

The 1/4 inch optical format offers a good balance between image quality and sensor size, making it versatile for various imaging applications.

Termination Type: SOLDER

The solder termination type ensures a secure and durable connection, contributing to the reliability and longevity of the sensor in different operating conditions.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface provides a simple and effective way to connect the sensor to external devices, offering flexibility and ease of integration in diverse systems.

Array Type: FRAME

The frame array type enables efficient image capture and processing, allowing for high-speed data transfer and real-time image analysis in the sensor.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the installation and assembly of the sensor on PCBs, saving time and effort during the manufacturing process.

Technical Specifications

Image Sensors AR0140AT3C00XUEA0-TPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

Horizontal Pixel:

1280

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

800

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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