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AR0140AT3C00XUEA0-DRBR1

Onsemi

AR0140AT3C00XUEA0-DRBR1 by Onsemi

Onsemi's AR0140AT3C00XUEA0-DRBR1 is a 1/4 inch CMOS image sensor with 1280x800 pixels. It features a 9mm square body, solder termination, and 2-wire interface. Ideal for surface mount applications in various imaging devices like cameras and scanners.

Median Price

$15.132

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 217 parts In-Stock

1+ parts

-

100+ parts

$13.450

1k+ parts

$12.040

10k+ parts

$11.330

217

-

$13.450

$12.040

$11.330

Verical

USA . 217 parts In-Stock

1+ parts

-

100+ parts

$16.813

1k+ parts

$15.050

10k+ parts

$14.162

217

-

$16.813

$15.050

$14.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 66 parts In-Stock

1+ parts

$14.240

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-

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66

$14.240

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Vyrian

USA . 5,141 parts In-Stock

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5,141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 513 parts In-Stock

1+ parts

$0.099

100+ parts

-

1k+ parts

-

10k+ parts

$0.095

513

$0.099

-

-

$0.095

Northwest PG Solutions

USA . 1,854 parts In-Stock

1+ parts

$0.109

100+ parts

-

1k+ parts

-

10k+ parts

$0.096

1,854

$0.109

-

-

$0.096

AZTECH Wire

Italy . 823 parts In-Stock

1+ parts

$8.530

100+ parts

-

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823

$8.530

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Corphita

USA . 1,255 parts In-Stock

1+ parts

$13.491

100+ parts

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1,255

$13.491

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Corohmni

South Africa . 480 parts In-Stock

1+ parts

$14.990

100+ parts

-

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480

$14.990

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Problanco Electronics

Mexico . 7,507 parts In-Stock

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7,507

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TANS Electronics

Latvia . 3,691 parts In-Stock

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3,691

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Kulean Microsystems

USA . 2,410 parts In-Stock

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2,410

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SupplyDigital Components

Austria . 1,321 parts In-Stock

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1,321

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UHIMA Technologies

Türkiye . 755 parts In-Stock

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755

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Continental Prestige Electronics

USA . 217 parts In-Stock

1+ parts

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100+ parts

$12.720

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217

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$12.720

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Overview

Capture every moment with the AR0140AT3C00XUEA0-DRBR1 image sensor by Onsemi. Known for its superior quality and cutting-edge technology, Onsemi delivers top-of-the-line sensors that excel in a variety of applications. From security cameras to automotive systems, this image sensor offers unmatched value and performance. With high pixel resolution and advanced features, this sensor guarantees crisp and clear images every time. Trust Onsemi to provide you with the best in imaging technology.

Feature Benefit Bullets

Body Width: 9 inch

Larger body width allows for more space for advanced technology and features, leading to better performance.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high integration capability, making them efficient for various applications.

Body Height: 1.55 mm

A slim body height allows for easy integration into compact devices without adding bulk.

Package Shape or Style: SQUARE

Square package shape provides stability and ease of mounting, ensuring reliable performance.

Horizontal Pixel: 1280

Higher horizontal pixel count allows for sharper and more detailed images, improving overall image quality.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Multiple terminal finishes offer durability and reliability, ensuring long-lasting performance.

Vertical Pixel: 800

The vertical pixel count contributes to the resolution and clarity of the images captured.

Body Length/Diameter: 9 mm

Compact body length/diameter allows for easy integration and versatile placement in different devices.

Optical Format (inch): 1/4

The optical format of 1/4 inch is ideal for capturing high-quality images and videos with good depth of field.

Termination Type: SOLDER

Solder termination ensures secure and stable connections, leading to reliable performance under various conditions.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface offers simple and efficient communication between the sensor and other components, enhancing overall functionality.

Array Type: FRAME

Frame array type enables precise and accurate image capturing, resulting in high-quality output.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy installation and replacement, making the product user-friendly and versatile.

Technical Specifications

Image Sensors AR0140AT3C00XUEA0-DRBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

Horizontal Pixel:

1280

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

800

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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