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TMS27C020-15JL

Texas Instruments

TMS27C020-15JL by Texas Instruments

TMS27C020-15JL by Texas Instruments is a 256KX8 EPROM with 150 ns access time, operating at 5V. It features 3-STATE output and CMOS technology, suitable for commercial applications requiring fast memory access in a 32-terminal package style.

Median Price

$7.295

Lifecycle Status

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DF Sales Co.

USA . 578 parts In-Stock

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DF Sales Co.

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Freelance Electronics

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Ace Electronics

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Forefront Electronics and Design

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American Microsemiconductor Inc.

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Digiode

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MRC Electronics

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First Choice Components Inc.

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Inland Empire Components Inc.

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ECAB

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J & M Industries LLC

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Global Solutions Electronics Company

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Pegasus Components GmbH

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Holdelec - ElecDif-Pro

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GES GmbH

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Component Electronics Inc.

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Cyclops Electronics Ltd

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PC Components Company LLC

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Kronex Distribution GmbH

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Parana Technologies

USA . 2 parts In-Stock

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$5.045

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DigiPath Technology Company

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$4.646

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ChromeModa Solutions

Germany . 5,955 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

Italy . 739 parts In-Stock

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One Stop Electronics

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Corphita

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Glotronic Ltd.

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Assy Fe

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A-Plus Industry Inc.

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Overview

Unlock the power of advanced memory technology with the Texas Instruments TMS27C020-15JL EPROM. Manufactured with precision and expertise, this innovative product offers unparalleled reliability and performance for a wide range of applications. Whether you're looking to enhance your system's capabilities or streamline your processes, the TMS27C020-15JL delivers exceptional value, benefits, and advantages that will exceed your expectations. Trust in Texas Instruments for cutting-edge solutions that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides durability and protection for the EPROM, making it resistant to external elements and ensuring long-term reliability.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent access to data, ensuring flexibility and efficient performance in various applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies the integration of the EPROM into existing systems.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window package style provides ease of installation and visibility of the EPROM's status, facilitating maintenance and troubleshooting.

Memory Density: 2097152 bit

With a high memory density, this EPROM offers ample storage capacity for data and programs, making it suitable for complex applications that require extensive memory.

Technical Specifications

EPROM TMS27C020-15JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T32

Length:

41.91 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.91 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C020-15JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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