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OMAPL138AZCEA3

Texas Instruments

OMAPL138AZCEA3 by Texas Instruments

The Texas Instruments OMAPL138AZCEA3 is a DSP with max clock freq of 300MHz, operating temp range -40 to 105°C, and low power mode. It's used in industrial applications requiring floating point format, featuring multiple internal bus architecture for efficient processing.

Median Price

$31.534

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 394 parts In-Stock

1+ parts

-

100+ parts

$28.030

1k+ parts

$25.080

10k+ parts

$23.610

394

-

$28.030

$25.080

$23.610

DigiKey

USA . 394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

394

-

-

-

-

Verical

USA . 394 parts In-Stock

1+ parts

-

100+ parts

$35.038

1k+ parts

$31.350

10k+ parts

$29.512

394

-

$35.038

$31.350

$29.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,694 parts In-Stock

1+ parts

$29.592

100+ parts

-

1k+ parts

-

10k+ parts

-

4,694

$29.592

-

-

-

Vyrian

USA . 8,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,698

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 510 parts In-Stock

1+ parts

$27.770

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$27.770

-

-

-

Corphita

USA . 1,280 parts In-Stock

1+ parts

$28.035

100+ parts

-

1k+ parts

-

10k+ parts

-

1,280

$28.035

-

-

-

Parana Technologies

USA . 1,616 parts In-Stock

1+ parts

$54.658

100+ parts

$5,075.784

1k+ parts

$49.192

10k+ parts

-

1,616

$54.658

$5,075.784

$49.192

-

DigiPath Technology Company

USA . 349 parts In-Stock

1+ parts

$60.185

100+ parts

-

1k+ parts

-

10k+ parts

-

349

$60.185

-

-

-

IDEA Electronic Components Group

UK . 1,269 parts In-Stock

1+ parts

$61.413

100+ parts

$58.342

1k+ parts

$55.272

10k+ parts

-

1,269

$61.413

$58.342

$55.272

-

ChromeModa Solutions

Germany . 1,089 parts In-Stock

1+ parts

$61.413

100+ parts

$50.359

1k+ parts

-

10k+ parts

-

1,089

$61.413

$50.359

-

-

Microchip USA

USA . 4,008 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,008

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 3,529 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,529

-

-

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Kepictronics

USA . 145 parts In-Stock

1+ parts

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100+ parts

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145

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Overview

Unlock the power of cutting-edge technology with the OMAPL138AZCEA3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments offers unparalleled quality and reliability. This versatile DSP is perfect for a wide range of applications, providing customers with superior performance and efficiency. Experience the value and benefits of this product as it delivers outstanding results in industrial settings, communication systems, and more. Trust Texas Instruments to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier automated assembly, making the product suitable for modern electronic devices.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square packages offer efficient use of space on circuit boards.

No. of Terminals: 361

Having a large number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): GRID ARRAY

Grid array packages provide high pin counts and good electrical performance, making them suitable for complex systems.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and assembly processes.

Boundary Scan: YES

Boundary Scan feature facilitates testing and debugging of the product during manufacturing and maintenance.

Maximum Clock Frequency: 300 MHz

The high maximum clock frequency allows for fast processing of digital signals.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature helps in preventing damage to the components during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering of the component to the PCB.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enables efficient data transfer within the component, enhancing performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable operation in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Having a dedicated digital signal processor along with other peripheral ICs provides additional functionality and processing power.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure connections and good thermal conductivity.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable operation and compatibility with standard power supplies.

Format: FLOATING POINT

Using floating-point format allows for precise numerical calculations, important for signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the component has intermediate moisture sensitivity, suitable for standard manufacturing processes.

Low Power Mode: YES

Having a low power mode option enables energy-saving operation and extends the product's battery life.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138AZCEA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

OMAPL138AZCEA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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