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OMAPL137DZKB4

Texas Instruments

OMAPL137DZKB4 by Texas Instruments

OMAPL137DZKB4 by Texas Instruments is a DSP with integrated cache, 8-bit data RAM width, and 15-bit address bus width. It is used in applications requiring high-speed processing such as digital signal processing, featuring a max clock frequency of 30 MHz and low power mode for energy efficiency.

Median Price

$25.984

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,463 parts In-Stock

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$20.358

100+ parts

$18.096

1k+ parts

$13.306

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$20.358

$18.096

$13.306

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Mouser Electronics

USA . 61 parts In-Stock

1+ parts

$31.610

100+ parts

$21.800

1k+ parts

$21.580

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61

$31.610

$21.800

$21.580

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Distributors (In-Stock)

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Digiode

USA . 531 parts In-Stock

1+ parts

$19.340

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531

$19.340

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Vyrian

USA . 4,328 parts In-Stock

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4,328

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Distributors (Availability)

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Corphita

USA . 339 parts In-Stock

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$18.322

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339

$18.322

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Corohmni

South Africa . 2,657 parts In-Stock

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$24.260

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2,657

$24.260

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Microchip USA

USA . 1,703 parts In-Stock

1+ parts

$48.840

100+ parts

$47.990

1k+ parts

$47.570

10k+ parts

$47.140

1,703

$48.840

$47.990

$47.570

$47.140

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$59.897

100+ parts

$54.506

1k+ parts

$49.116

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3,000

$59.897

$54.506

$49.116

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Parana Technologies

USA . 2,376 parts In-Stock

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$66.708

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2,376

$66.708

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ChromeModa Solutions

Germany . 6,271 parts In-Stock

1+ parts

$74.953

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$61.461

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6,271

$74.953

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IDEA Electronic Components Group

UK . 2,128 parts In-Stock

1+ parts

$74.953

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$71.205

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$67.458

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2,128

$74.953

$71.205

$67.458

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Lixinc

USA . 18,132 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,247 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 540 parts In-Stock

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$67.578

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540

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$67.578

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Perfect Parts

USA . 101 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the OMAPL137DZKB4 by Texas Instruments, a top-tier manufacturer renowned for its quality and innovation in digital signal processors. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking high-performance solutions. With integrated cache, low power mode, and advanced features, the OMAPL137DZKB4 is the perfect choice for those looking to elevate their projects to the next level. Experience the advantages of this top-of-the-line DSP and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having integrated cache helps improve the performance and efficiency of the DSP.

Maximum Supply Voltage: 1.35 V

Operating at a maximum supply voltage of 1.35V ensures power efficiency and reliability.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data processing and storage capabilities.

Address Bus Width: 15

With a wider address bus width, the DSP can handle larger memory addressing for complex algorithms.

Power Supplies (V): 1.3, 1.8/3.3

Support for multiple power supply options gives flexibility in different operating environments.

No. of Terminals: 256

Having a high number of terminals allows for connectivity with a variety of external devices.

Maximum Operating Temperature: 70 °C

Being able to operate at high temperatures makes the DSP suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Operating at low temperatures enables the DSP to be used in diverse environments.

RAM Words: 499712

The large RAM capacity allows for efficient storage and processing of data.

Maximum Clock Frequency: 30 MHz

Support for high clock frequencies enables fast signal processing and response times.

Internal Bus Architecture: SINGLE

A single internal bus architecture simplifies the design and operation of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity in signal processing.

No. of DMA Channels: 40

Having a high number of DMA channels allows for efficient data transfer and processing.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137DZKB4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

3

On Chip Data RAM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

499712

Maximum Seated Height:

2.05 mm

Speed:

456 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137DZKB4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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