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OMAPL137DZKB3

Texas Instruments

OMAPL137DZKB3 by Texas Instruments

OMAPL137DZKB3 by Texas Instruments is a DSP with integrated cache and 8-bit data RAM. It operates at a max clock frequency of 30 MHz, suitable for applications requiring high-speed processing. With 40 DMA channels and low power mode, it is ideal for power-efficient digital signal processing tasks in commercial-grade environments.

Median Price

$28.750

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 453 parts In-Stock

1+ parts

$18.406

100+ parts

$16.078

1k+ parts

$11.088

10k+ parts

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453

$18.406

$16.078

$11.088

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DigiKey

USA . 977 parts In-Stock

1+ parts

$28.750

100+ parts

$20.400

1k+ parts

$19.526

10k+ parts

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977

$28.750

$20.400

$19.526

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Mouser Electronics

USA . 73 parts In-Stock

1+ parts

$28.750

100+ parts

$19.810

1k+ parts

$19.520

10k+ parts

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73

$28.750

$19.810

$19.520

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,859 parts In-Stock

1+ parts

$17.486

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4,859

$17.486

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Vyrian

USA . 5,310 parts In-Stock

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5,310

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Elcom Components

USA . 751 parts In-Stock

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751

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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1

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Bristol Electronics

USA . 1 parts In-Stock

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1

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Dan-Mar Components

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,150 parts In-Stock

1+ parts

$16.565

100+ parts

-

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1,150

$16.565

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Corohmni

South Africa . 463 parts In-Stock

1+ parts

$17.740

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463

$17.740

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Parana Technologies

USA . 1,500 parts In-Stock

1+ parts

$56.913

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1,500

$56.913

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ChromeModa Solutions

Germany . 2,236 parts In-Stock

1+ parts

$63.947

100+ parts

$52.437

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2,236

$63.947

$52.437

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IDEA Electronic Components Group

UK . 773 parts In-Stock

1+ parts

$63.947

100+ parts

$60.750

1k+ parts

$57.552

10k+ parts

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773

$63.947

$60.750

$57.552

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Lixinc

USA . 5,486 parts In-Stock

1+ parts

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5,486

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A-Z Elektronik GmbH

Germany . 2,180 parts In-Stock

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2,180

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DigiPath Technology Company

USA . 1,603 parts In-Stock

1+ parts

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100+ parts

$57.655

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1,603

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$57.655

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Overview

Experience unparalleled performance with the OMAPL137DZKB3 by Texas Instruments, a cutting-edge Digital Signal Processor that delivers exceptional quality and reliability. Manufactured by the industry leader in semiconductor technology, this processor is versatile and efficient, making it ideal for a wide range of applications. From advanced audio processing to industrial automation, this DSP offers unmatched value, benefits, and advantages to customers looking for top-notch performance and innovation. Upgrade your systems with the OMAPL137DZKB3 and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the DSP by reducing memory access time and increasing processing speed.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures safe operation of the DSP without risking damage due to overvoltage.

Surface Mount: YES

Being surface mountable makes the DSP easy to install on a circuit board, saving space and providing a clean and organized layout.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures allows the DSP to function efficiently in various environments.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, this DSP can handle complex signal processing tasks quickly and efficiently.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137DZKB3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

3

On Chip Data RAM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

499712

Maximum Seated Height:

2.05 mm

Speed:

456 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137DZKB3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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