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OMAPL137CZKBA3

Texas Instruments

OMAPL137CZKBA3 by Texas Instruments

OMAPL137CZKBA3 by Texas Instruments is a Digital Signal Processor with 256 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial applications. This CMOS technology device has power supplies of 1.2V and 1.8/3.3V, making it ideal for various signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,588 parts In-Stock

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Vyrian

USA . 4,142 parts In-Stock

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One Stop Electronics

USA . 784 parts In-Stock

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$3.000

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784

$3.000

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Ampacity Inc.

Singapore . 1,436 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 784 parts In-Stock

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$13.197

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$13.197

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Parana Technologies

USA . 2,221 parts In-Stock

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$14.324

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$14.773

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$14.773

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DigiPath Technology Company

USA . 999 parts In-Stock

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$15.772

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$14.510

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999

$15.772

$14.510

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ChromeModa Solutions

Germany . 2,713 parts In-Stock

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$16.094

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$13.197

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$16.094

$13.197

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IDEA Electronic Components Group

UK . 687 parts In-Stock

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$16.094

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$15.289

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$14.485

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687

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$14.485

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Corohmni

South Africa . 5,196 parts In-Stock

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$73.400

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QUARKTWIN TECHNOLOGY LTD

USA . 19,517 parts In-Stock

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Corphita

USA . 2,737 parts In-Stock

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Microchip USA

USA . 432 parts In-Stock

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Overview

Unlock the power of digital signal processing with the OMAPL137CZKBA3 by Texas Instruments. This high-quality DSP offers unparalleled performance and reliability, backed by the trusted name of Texas Instruments. Whether you're designing audio systems, industrial control applications, or telecommunications equipment, the OMAPL137CZKBA3 delivers exceptional value and benefits. Take your projects to the next level with this versatile and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the DSP, making it reliable in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Power Supplies (V): 1.2,1.8/3.3

Multiple power supply options allow for flexibility in different applications, ensuring compatibility with various voltage requirements.

No. of Terminals: 256

The high number of terminals provides ample connectivity options for interfacing with other devices and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the DSP to function reliably even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the DSP can operate in extreme cold conditions without any performance issues.

Terminal Finish: TIN SILVER COPPER

The combination of Tin, Silver, and Copper terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high-speed processing capabilities, making the DSP efficient and suitable for various applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137CZKBA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

OMAPL137CZKBA3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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