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AM1806EZWT3

Texas Instruments

AM1806EZWT3 by Texas Instruments

AM1806EZWT3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 23-bit address bus width. It operates at a max clock frequency of 30 MHz, suitable for low power applications in various industries like automotive and industrial automation. With a package style of grid array, it features 80 DMA channels and boundary scan capability.

Median Price

$16.319

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 770 parts In-Stock

1+ parts

$12.218

100+ parts

$10.672

1k+ parts

$7.360

10k+ parts

-

770

$12.218

$10.672

$7.360

-

Mouser Electronics

USA . 172 parts In-Stock

1+ parts

$20.420

100+ parts

$12.360

1k+ parts

$12.020

10k+ parts

-

172

$20.420

$12.360

$12.020

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,144 parts In-Stock

1+ parts

$11.607

100+ parts

-

1k+ parts

-

10k+ parts

-

2,144

$11.607

-

-

-

Vyrian

USA . 4,692 parts In-Stock

1+ parts

$12.218

100+ parts

-

1k+ parts

-

10k+ parts

-

4,692

$12.218

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,666 parts In-Stock

1+ parts

$10.996

100+ parts

-

1k+ parts

-

10k+ parts

-

1,666

$10.996

-

-

-

Parana Technologies

USA . 1,375 parts In-Stock

1+ parts

$55.445

100+ parts

-

1k+ parts

-

10k+ parts

-

1,375

$55.445

-

-

-

DigiPath Technology Company

USA . 633 parts In-Stock

1+ parts

$61.052

100+ parts

-

1k+ parts

-

10k+ parts

-

633

$61.052

-

-

-

ChromeModa Solutions

Germany . 3,607 parts In-Stock

1+ parts

$62.298

100+ parts

$51.084

1k+ parts

-

10k+ parts

-

3,607

$62.298

$51.084

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-

IDEA Electronic Components Group

UK . 1,830 parts In-Stock

1+ parts

$62.298

100+ parts

$59.183

1k+ parts

$56.068

10k+ parts

-

1,830

$62.298

$59.183

$56.068

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Lixinc

USA . 5,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,177

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-

-

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Northwest PG Solutions

USA . 1,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.440

10k+ parts

-

1,420

-

-

$3.440

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Native Components

USA . 593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.405

10k+ parts

-

593

-

-

$3.405

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Overview

Experience the power and reliability of the AM1806EZWT3 by Texas Instruments, a leading manufacturer in the industry. This microprocessor boasts integrated cache, a wide address bus, and low power mode, making it perfect for a variety of applications. From industrial automation to consumer electronics, this product offers unmatched performance and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade to the AM1806EZWT3 today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and ensuring long-term reliability.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance and efficiency of the microprocessor by reducing access times to frequently used data.

Surface Mount: YES

Surface mount technology allows for easy installation and a compact design, making the product suitable for various applications where space is limited.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage tolerance of 1.32 V ensures stable and safe operation of the microprocessor within specified limits.

Address Bus Width: 23

The wide address bus width of 23 bits allows the microprocessor to access a larger memory space and handle complex calculations efficiently.

Bit Size: 32

With a 32-bit architecture, this microprocessor can process data in larger chunks, leading to improved performance and speed.

No. of Terminals: 361

Having a high number of terminals provides ample interfaces for connecting various components, allowing for versatility in system integration.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature tolerance of 90°C ensures that the microprocessor can perform reliably even under demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the microprocessor energy-efficient and suitable for portable devices.

Speed: 375 rpm

With a speed of 375 rpm, this microprocessor can process instructions quickly and effectively, enhancing overall system performance.

Technical Specifications

Microprocessors AM1806EZWT3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.4 mm

Speed:

375 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1806EZWT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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