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STGB20N40LZ

STMicroelectronics

STGB20N40LZ by STMicroelectronics

STGB20N40LZ IGBT from STMicroelectronics features a max VCEsat of 1.8V, supports automotive ignition applications, and operates at up to 175 °C. It offers a max collector current of 25A and includes built-in TVS diode for enhanced protection. Ideal for compact designs with its surface mount configuration.

Median Price

$1.012

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,107 parts In-Stock

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Vyrian

USA . 3,060 parts In-Stock

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Bristol Electronics

USA . 907 parts In-Stock

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$1.012

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$0.891

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Dan-Mar Components

USA . 907 parts In-Stock

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Anansix

USA . 886 parts In-Stock

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LWI Electronics Inc

India . 26 parts In-Stock

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IDEA Electronic Components Group

UK . 1,608 parts In-Stock

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$0.491

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$0.442

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MKK Technologies

India . 1,554 parts In-Stock

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$0.924

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DigiPath Technology Company

USA . 1,554 parts In-Stock

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$0.924

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Microchip USA

USA . 151 parts In-Stock

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$9.381

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AZTECH Wire

Italy . 654 parts In-Stock

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$9.490

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 2,083 parts In-Stock

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Corphita

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Overview

Unlock unparalleled performance with the STGB20N40LZ from STMicroelectronics, a trusted leader in semiconductor innovation. This advanced IGBT is designed for automotive ignition applications, ensuring reliable functionality even in extreme conditions. With built-in TVS diode protection and impressive thermal management, it enhances safety and efficiency while minimizing downtime. Experience enhanced longevity and performance that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this IGBT suitable for automotive applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and fast switching capabilities, making them ideal for automotive ignition applications.

Configuration: SINGLE WITH BUILT-IN TVS DIODE AND RESISTOR

The built-in TVS diode and resistor provide additional protection against voltage spikes and enhance overall circuit reliability.

Transistor Application: AUTOMOTIVE IGNITION

Designed specifically for automotive ignition systems, this IGBT can handle the demanding conditions typically found in vehicles.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient utilization of space on printed circuit boards.

Maximum VCEsat: 1.8 V

A low maximum collector-emitter saturation voltage contributes to improved efficiency and reduced power losses during operation.

Package Shape: RECTANGULAR

Rectangular package shape offers versatile mounting options and efficient heat dissipation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections in surface-mounted applications.

Nominal Turn Off Time (toff): 8200 ns

A nominal turn-off time of 8200 ns allows for effective switching control, ideal for applications that demand quick response times.

No. of Terminals: 2

The simple 2-terminal design makes it easy to integrate into various automotive circuits and minimizes complexity.

Maximum Power Dissipation (Abs): 150 W

With a maximum power dissipation of 150 W, this IGBT is capable of handling significant loads without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, making it suitable for compact automotive electronic designs.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature of 175 °C allows for reliable performance in extreme automotive environments.

Maximum Collector-Emitter Voltage: 425 V

With a maximum collector-emitter voltage of 425 V, this IGBT can manage high voltage conditions, enhancing its suitability for automotive applications.

Transistor Element Material: SILICON

Silicon material is standard for IGBTs, providing good thermal conductivity and reliable mechanical properties.

Maximum Gate-Emitter Voltage: 16 V

A maximum gate-emitter voltage of 16 V ensures compatibility with standard drive circuits while maintaining safe operation.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55 °C ensures reliable performance in harsh automotive climates.

Maximum Collector Current (IC): 25 A

The capability to handle a maximum collector current of 25 A makes this IGBT effective for powerful automotive applications.

Maximum Gate-Emitter Threshold Voltage: 2.5 V

A low gate-emitter threshold voltage allows for easier drive requirements and reduces the risk of unintended switching.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and helps maintain a compact layout.

Case Connection: COLLECTOR

Collector case connection enhances thermal management and facilitates efficient heat dissipation.

Nominal Turn On Time (ton): 5200 ns

With a nominal turn-on time of 5200 ns, this IGBT provides fast switching speeds, increasing the overall efficiency of the circuit.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures that this IGBT meets rigorous automotive industry quality and reliability requirements.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB20N40LZ attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

425 V

Maximum Gate-Emitter Threshold Voltage:

2.5 V

Maximum Gate-Emitter Voltage:

16 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

8200 ns

Nominal Turn On Time (ton):

5200 ns

Maximum VCEsat:

1.8 V

Trade Compliance

STGB20N40LZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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