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STGB20H65FB2

STMicroelectronics

STGB20H65FB2 by STMicroelectronics

STGB20H65FB2 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.1V, 650V collector-emitter voltage, and operates at temperatures up to 175 °C. Ideal for high-performance applications in energy conversion systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,235 parts In-Stock

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8,235

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Anansix

USA . 1,323 parts In-Stock

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1,323

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Digiode

USA . 376 parts In-Stock

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376

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 85 parts In-Stock

1+ parts

$0.685

100+ parts

-

1k+ parts

$0.617

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85

$0.685

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$0.617

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MKK Technologies

India . 1,296 parts In-Stock

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$1.289

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1,296

$1.289

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DigiPath Technology Company

USA . 1,296 parts In-Stock

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$1.289

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1,296

$1.289

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Microchip USA

USA . 6,521 parts In-Stock

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$5.802

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6,521

$5.802

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AZTECH Wire

Italy . 289 parts In-Stock

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$9.720

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289

$9.720

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Corphita

USA . 4,749 parts In-Stock

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4,749

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Parana Technologies

USA . 1,665 parts In-Stock

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$0.820

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1,665

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$0.820

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Overview

Elevate your power control applications with the STGB20H65FB2 from STMicroelectronics, a leader in semiconductor technology. This top-tier N-channel IGBT combines robust performance with exceptional thermal management, ensuring reliability even in demanding environments. With its compact design and rapid switching capabilities, it’s perfect for industrial automation, renewable energy systems, and more. Choose STMicroelectronics for unparalleled quality and innovation that empowers your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and can handle higher currents, making this IGBT efficient for power control applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces footprint, allowing for easier integration into various systems.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can manage high voltage and current efficiently, making it ideal for a range of power electronics applications.

Surface Mount: YES

Surface mount technology allows for higher density electronic designs and automated assembly, reducing manufacturing complexity and cost.

Maximum VCEsat: 2.1 V

A low VCEsat indicates lower power loss during operation, leading to higher efficiency and reduced thermal management requirements in applications.

Package Shape: RECTANGULAR

Rectangular packaging offers efficient space utilization on PCBs and facilitates better thermal performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering strength and reliability, enhancing durability in applications subject to vibration.

Nominal Turn Off Time (toff): 178 ns

A fast turn off time enables quicker response in power control applications, improving overall system performance and efficiency.

No. of Terminals: 2

With only two terminals, this IGBT allows for straightforward connections, leading to faster assembly and simpler circuit designs.

Maximum Power Dissipation (Abs): 147 W

High power dissipation capability allows the IGBT to handle significant power loads, making it suitable for demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save space on PCBs, enabling compact designs without compromising performance.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature enhances reliability in high-temperature environments, suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 650 V

A high VCE capability supports applications that require high voltage operation, expanding its usability in various sectors.

Transistor Element Material: SILICON

Silicon is a robust material commonly used for semiconductors, known for its efficiency, effectiveness, and reliability in high-performance applications.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage allows for more flexibility in driving conditions, improving the versatility of the device in power applications.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures reliable performance in extreme conditions, making it ideal for harsh environments.

Maximum Collector Current (IC): 40 A

High collector current handling helps in applications requiring significant current flows, improving overall performance in power circuits.

Maximum Gate-Emitter Threshold Voltage: 7 V

A manageable threshold voltage means easier control in gate driving circuits, enhancing overall performance and efficiency.

Terminal Position: SINGLE

Single terminal position simplifies the integration process with existing circuits, reducing design complexity.

Case Connection: COLLECTOR

Collector case connection helps optimize thermal performance, improving reliability in power conditioning applications.

Nominal Turn On Time (ton): 26 ns

Fast turn on time contributes to quick switching capabilities, enhancing efficiency in high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB20H65FB2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

178 ns

Nominal Turn On Time (ton):

26 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGB20H65FB2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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