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M50LPW020K5

STMicroelectronics

M50LPW020K5 by STMicroelectronics

M50LPW020K5 from STMicroelectronics is a 256Kx8 NOR flash memory with a max access time of 11 ns, operating b/w -20 °C to 85°C. It features a synchronous mode and operates at a nominal voltage of 3.3V. Ideal for compact applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,051 parts In-Stock

1+ parts

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3,051

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Vyrian

USA . 2,763 parts In-Stock

1+ parts

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1k+ parts

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2,763

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Anansix

USA . 1,106 parts In-Stock

1+ parts

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1,106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,723 parts In-Stock

1+ parts

$4.981

100+ parts

-

1k+ parts

$4.483

10k+ parts

-

1,723

$4.981

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$4.483

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MKK Technologies

India . 2,011 parts In-Stock

1+ parts

$9.366

100+ parts

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2,011

$9.366

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DigiPath Technology Company

USA . 2,011 parts In-Stock

1+ parts

$9.366

100+ parts

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10k+ parts

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2,011

$9.366

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Corphita

USA . 3,435 parts In-Stock

1+ parts

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3,435

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Parana Technologies

USA . 1,321 parts In-Stock

1+ parts

-

100+ parts

$5.955

1k+ parts

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1,321

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$5.955

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Overview

Unlock unparalleled performance with the M50LPW020K5 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality flash memory delivers exceptional reliability and speed, perfect for applications ranging from consumer electronics to industrial systems. With its compact design and robust temperature range, it ensures seamless operation in diverse environments, empowering your projects with enhanced efficiency and longevity. Experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic-epoxy material ensures protection against environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, enabling more compact designs and easier integration into devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and ensures efficient component placement.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances the read/write speed, resulting in better performance for data-intensive applications.

Nominal Supply Voltage / Vsup: 3.3 V

The 3.3 V nominal supply voltage is a standard in many electronic circuits, making it easy to integrate into existing designs.

No. of Terminals: 32

Having 32 terminals allows for versatile connection options, accommodating a range of application requirements.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging facilitates better thermal management and reliability in performance under different operational conditions.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability in harsh environments, making it suitable for industrial applications.

Organization: 256KX8

The 256K x 8 organization provides ample memory space and efficient data storage for a variety of applications.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, this product is suitable for use in colder climates and applications.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing on circuit boards, enhancing design flexibility.

Maximum Seated Height: 3.56 mm

A maximum seated height of 3.56 mm contributes to a lower profile in designs, ideal for space-constrained applications.

Width: 11.455 mm

A compact width facilitates efficient stacking and placement on PCBs, optimizing space utilization.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3 V provides flexibility in various circuit designs and power management.

Type: NOR TYPE

NOR type flash memory offers fast read times and is well-suited for applications requiring quick data access.

Length: 13.995 mm

A length of 13.995 mm ensures compatibility with standardized mounting methods for easier integration.

Programming Voltage: 3 V

The programming voltage of 3 V enhances compatibility with various programming and operational systems.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making it energy-efficient.

Parallel or Serial: PARALLEL

Parallel operation allows for faster data transfers, which is beneficial for applications needing high throughput.

Terminal Form: J BEND

J bend terminals offer an efficient method for mounting, leading to reliable connections on the PCB.

No. of Words: 262144 words

With 262,144 words, this flash memory can store substantial data, making it ideal for a variety of applications.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and alignment with most microcontroller architectures.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports compact PCB designs while still allowing for easy soldering.

No. of Words Code: 256K

The 256K word capacity provides a solid amount of memory for storing program code and data.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V ensures a robust power range, accommodating various device needs.

Memory Density: 2097152 bit

With a memory density of 2,097,152 bits, this product can handle large data requirements efficiently.

Memory IC Type: FLASH

Being a Flash memory IC allows for reprogrammability and data retention, making it versatile for many applications.

Maximum Access Time: 11 ns

With a maximum access time of 11 ns, fast data retrieval is ensured, making it suitable for high-speed applications.

Technical Specifications

Flash Memory M50LPW020K5 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

11.455 mm

Trade Compliance

M50LPW020K5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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