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M50LPW020K5T

STMicroelectronics

M50LPW020K5T by STMicroelectronics

M50LPW020K5T from STMicroelectronics is a 256Kx8 NOR Flash memory with a synchronous operating mode, ideal for embedded applications. It operates at 3.3V and features a fast access time of 11 ns. With a compact chip carrier package, it supports high-density data storage in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,170 parts In-Stock

1+ parts

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1,170

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Anansix

USA . 1,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,009

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Digiode

USA . 432 parts In-Stock

1+ parts

-

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-

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432

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 999 parts In-Stock

1+ parts

$3.428

100+ parts

-

1k+ parts

$3.085

10k+ parts

-

999

$3.428

-

$3.085

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MKK Technologies

India . 414 parts In-Stock

1+ parts

$6.446

100+ parts

-

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10k+ parts

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414

$6.446

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DigiPath Technology Company

USA . 414 parts In-Stock

1+ parts

$6.446

100+ parts

-

1k+ parts

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10k+ parts

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414

$6.446

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Corphita

USA . 931 parts In-Stock

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931

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Parana Technologies

USA . 860 parts In-Stock

1+ parts

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100+ parts

$4.099

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860

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$4.099

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Overview

Unlock the potential of your designs with the M50LPW020K5T Flash Memory from STMicroelectronics, a leader in innovation and quality. This compact, high-performance memory solution delivers fast access times and robust reliability, perfect for applications in consumer electronics, automotive, and industrial sectors. Enjoy lower power consumption and enhanced efficiency, ensuring your projects thrive while benefiting from ST’s trusted expertise and commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material increases reliability in various applications.

Surface Mount: YES

Facilitates easy integration into compact designs, saving board space.

Package Shape: RECTANGULAR

Standard shape allows for compatibility with a wide range of PCB layouts.

Operating Mode: SYNCHRONOUS

Enables higher performance and data transfer rates, making it efficient for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Standard voltage level ensures compatibility with most electronic systems.

Power Supplies (V): 3.3

Power-efficient design suitable for battery-operated devices.

No. of Terminals: 32

Adequate number of terminals supports complex bus systems for enhanced performance.

Package Style (Meter): CHIP CARRIER

Optimized for effective thermal dissipation and electrical performance.

Maximum Operating Temperature: 85 °C

High operating temperature range suited for demanding environments.

Organization: 256KX8

Efficient memory organization allows for effective data storage and retrieval.

Minimum Operating Temperature: -20 °C

Suitable for outdoor and harsh environment applications.

No. of Sectors/Size: 4

Flexibility in memory management, allowing for optimized performance in data handling.

Terminal Finish: Matte Tin (Sn)

Good solderability and corrosion resistance ensure reliability in connections.

Terminal Position: QUAD

Quad terminal position helps in enhanced performance through parallel processing.

Maximum Seated Height: 3.56 mm

Low profile enables it to fit in compact designs without compromising on performance.

Width: 11.455 mm

Compact width fits easily into various board layouts.

Minimum Supply Voltage (Vsup): 3 V

Flexibility in supply voltage allows for use in various power scenarios.

Type: NOR TYPE

NOR flash memory allows for random access, making it suitable for code storage and data integrity.

Length: 13.995 mm

Compact length aids in efficient PCB space utilization.

Programming Voltage (V): 3

Standard programming voltage enhances compatibility with existing programming tools.

Technology: CMOS

Low power consumption and high speed make this technology ideal for portable applications.

Parallel or Serial: PARALLEL

Parallel communication enables faster data transfer rates, improving overall performance.

Terminal Form: J BEND

J-bend terminals provide robust mechanical stability during PCB assembly.

Sector Size (Words): 64K

Optimal sector size for efficient data management and flexibility in firmware updates.

Maximum Supply Current: 60 mA

Moderate current consumption allows efficient use of power, crucial for battery-operated devices.

No. of Words: 262144 words

Adequate memory size to store critical applications and data.

Memory Width: 8

8-bit memory width suitable for various applications requiring moderate data throughput.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB design and assembly.

No. of Words Code: 256K

Provides sufficient capacity for firmware and configuration storage in embedded systems.

Command User Interface: YES

User-friendly command interface enhances ease of use and programming flexibility.

Ready or Busy: YES

Indicates the status of memory operations, enhancing reliability in data handling.

Maximum Supply Voltage (Vsup): 3.6 V

Provides a buffer for power supply variations, ensuring stable operation.

Memory Density: 2097152 bit

Denser memory allows for increased storage capacity in a compact form factor.

Memory IC Type: FLASH

Non-volatile memory type retains data without power, crucial for many applications.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current ensures minimal power consumption when idle.

Maximum Access Time: 11 ns

Fast access time ensures quick data retrieval, enhancing overall system performance.

Technical Specifications

Flash Memory M50LPW020K5T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.995 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

4

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

3.56 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.455 mm

Trade Compliance

M50LPW020K5T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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