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M50LPW041K1

STMicroelectronics

M50LPW041K1 by STMicroelectronics

M50LPW041K1 from STMicroelectronics is a 512Kx8 NOR Flash memory with a synchronous operating mode and a supply voltage of 3.3V. It features an access time of 11 ns, operates b/w 0 °C to 70 °C, and comes in a compact chip carrier package. Ideal for embedded applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,877 parts In-Stock

1+ parts

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100+ parts

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4,877

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Vyrian

USA . 4,287 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,287

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Anansix

USA . 2,638 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,638

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,271 parts In-Stock

1+ parts

$5.006

100+ parts

-

1k+ parts

$4.505

10k+ parts

-

1,271

$5.006

-

$4.505

-

MKK Technologies

India . 33 parts In-Stock

1+ parts

$9.413

100+ parts

-

1k+ parts

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10k+ parts

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33

$9.413

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DigiPath Technology Company

USA . 33 parts In-Stock

1+ parts

$9.413

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$9.413

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-

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Corphita

USA . 1,344 parts In-Stock

1+ parts

-

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1,344

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Parana Technologies

USA . 1,264 parts In-Stock

1+ parts

-

100+ parts

$5.985

1k+ parts

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10k+ parts

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1,264

-

$5.985

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Metaverse IC Inc.

Canada . 274 parts In-Stock

1+ parts

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274

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Overview

Unlock the potential of your designs with the M50LPW041K1 flash memory from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance NOR type memory is perfect for a wide range of applications, from consumer electronics to industrial automation, delivering reliable operation even in challenging environments. With its compact design and low power consumption, it ensures efficient performance while enhancing your product's value. Choose STMicroelectronics for quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliability and longevity in various environments.

Surface Mount: YES

Facilitates compact design, enabling high-density PCB layouts and efficient use of space.

Package Shape: RECTANGULAR

Offers standard dimensions that fit well in a variety of applications.

Operating Mode: SYNCHRONOUS

Provides faster data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 3.3 V

Common voltage level ensures compatibility with a wide range of devices.

Power Supplies: 3.3 V

Compatibility with many systems, minimizing power supply design complexity.

No. of Terminals: 32

Offers sufficient connectivity options for robust performance in various applications.

Package Style (Meter): CHIP CARRIER

Designed for high density mounting, ideal for space-constrained designs.

Maximum Operating Temperature: 70 °C

Suitable for industrial and commercial use, ensuring reliability in warmer environments.

Organization: 512KX8

Provides ample storage capacity for various applications, enabling flexible designs.

Minimum Operating Temperature: 0 °C

Enhances adaptability for diverse environmental conditions.

No. of Sectors/Size: 8

Facilitates efficient memory management and data organization in applications.

Terminal Finish: TIN LEAD

Ensures good solderability and reliable electrical connections.

Terminal Position: QUAD

Optimizes layout for effective PCB routing.

Maximum Seated Height: 3.55 mm

Compact design allows for high-density assembly in tight spaces.

Width: 11.43 mm

Standard dimension fits well with existing design layouts.

Minimum Supply Voltage (Vsup): 3 V

Operational flexibility with a lower supply voltage option.

Type: NOR TYPE

Ideal for applications requiring fast random access and efficient read operations.

Length: 13.97 mm

Compact size enhances versatility in various design settings.

Programming Voltage (V): 3

Standard voltage level simplifies integration into a variety of circuits.

Temperature Grade: COMMERCIAL

Reliable operation in typical commercial conditions increases product lifespan.

Technology: CMOS

Lower power consumption per operation and higher performance, beneficial for energy-sensitive applications.

Parallel or Serial: PARALLEL

Provides higher speed data access, improving overall system responsiveness.

Terminal Form: J BEND

Designed for effective PCB mounting and soldering process.

Sector Size (Words): 64K

Allows efficient data block management and faster access times.

Maximum Supply Current: 60 mA

Moderate power consumption keeps overall system efficiency in check.

No. of Words: 524288 words

Provides substantial memory capacity for data storage needs.

Memory Width: 8

Standard width supports compatibility with common data buses.

Terminal Pitch: 1.27 mm

Allows for easy mounting on standard PCBs, while maintaining a compact size.

No. of Words Code: 512K

Generates substantial capacity to meet robust data storage requirements.

Command User Interface: YES

Enables straightforward control and operations, simplifying user experience.

Maximum Supply Voltage (Vsup): 3.6 V

Provides flexibility in high-demand applications requiring slightly higher voltages.

Boot Block: TOP

Enhances firmware stability and accelerates system boot times.

Memory Density: 4194304 bit

Provides high-density storage, enabling storage of more data in a compact form.

Memory IC Type: FLASH

Offers non-volatile storage ideal for applications requiring data retention without power.

Maximum Standby Current: 0.000005 Amp

Ensures minimal power consumption in standby mode, enhancing battery life in portable devices.

Maximum Access Time: 11 ns

Allows rapid data retrieval, improving application performance significantly.

Technical Specifications

Flash Memory M50LPW041K1 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

3.55 mm

Sector Size (Words):

64K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M50LPW041K1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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