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M50LPW002K5

STMicroelectronics

M50LPW002K5 by STMicroelectronics

M50LPW002K5 by STMicroelectronics is a 256K x 8 NOR Flash memory with a synchronous operating mode and a max access time of 11 ns. It operates at a nominal voltage of 3.3V, suitable for various embedded applications. Its compact chip carrier design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,638 parts In-Stock

1+ parts

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3,638

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Anansix

USA . 1,625 parts In-Stock

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1,625

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Vyrian

USA . 78 parts In-Stock

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78

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$2.951

100+ parts

-

1k+ parts

$2.656

10k+ parts

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1,584

$2.951

-

$2.656

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MKK Technologies

India . 474 parts In-Stock

1+ parts

$5.550

100+ parts

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474

$5.550

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DigiPath Technology Company

USA . 474 parts In-Stock

1+ parts

$5.550

100+ parts

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474

$5.550

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Corphita

USA . 2,471 parts In-Stock

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2,471

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Parana Technologies

USA . 925 parts In-Stock

1+ parts

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$3.529

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925

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$3.529

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Overview

Unlock the power of innovation with the M50LPW002K5 from STMicroelectronics—a leader in cutting-edge flash memory solutions. This versatile NOR-type flash memory is designed for seamless integration, delivering reliability and efficiency across various applications, from consumer electronics to industrial systems. With low power consumption and a broad operating temperature range, it ensures optimal performance while maximizing value for your projects. Trust in STMicroelectronics' commitment to quality and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures protection against environmental elements, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuit designs, optimizing space and improving performance.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized footprint, making it suitable for a wide range of circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3 V is common in modern electronics, ensuring compatibility with many devices.

Power Supplies: 3.3 V

Utilizing a single power supply voltage simplifies design and reduces component count.

No. of Terminals: 32

With 32 terminals, this product supports multiple connections, enabling versatile use in various applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging enables robust connections while facilitating surface mounting.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-heat environments.

Organization: 256KX8

The memory organization allows for efficient data management, making it suitable for both reads and writes.

Minimum Operating Temperature: -20 °C

The ability to operate at -20 °C allows for deployment in colder environments, increasing application versatility.

No. of Sectors/Size: 1,2,1,3

Multiple sectors provide flexibility in memory allocation, optimizing space for various data types.

Terminal Finish: TIN LEAD

A tin-lead terminal finish ensures good soldering performance and durability in connections.

Terminal Position: QUAD

Quad terminal positioning improves the accessibility and density of connections on a circuit board.

Maximum Seated Height: 3.56 mm

A low maximum seated height enables compatibility with slim devices, suitable for modern handheld electronics.

Width: 11.455 mm

An optimal width ensures compatibility with existing PCB layouts while allowing for efficient space utilization.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures low power consumption, maximizing battery life in portable applications.

Type: NOR TYPE

NOR flash memories are known for their fast random access speeds, making this product ideal for applications requiring quick data retrieval.

Length: 13.995 mm

Compact dimensions facilitate integration into small electronic devices.

Programming Voltage: 3 V

A programming voltage of 3 V ensures more efficient programming operations and compatibility with a wide range of devices.

Technology: CMOS

CMOS technology offers lower power consumption and higher density, making it ideal for battery-operated devices.

Parallel or Serial: PARALLEL

Parallel interface facilitates faster data transmission rates, improving overall performance in data-intensive applications.

Terminal Form: J BEND

J bend terminals provide robust soldering and connection options for increased durability in operational environments.

Sector Size: 16K, 8K, 32K, 64K Words

Flexible sector sizes allow for optimized memory use based on specific application needs.

Maximum Supply Current: 60 mA

A maximum supply current of 60 mA provides enough power to drive demanding applications efficiently.

No. of Words: 262144 words

This memory capacity supports a significant amount of data storage, suitable for numerous applications.

Memory Width: 8

An 8-bit memory width balances performance and complexity, ensuring effective data handling.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides adequate spacing for soldering, ensuring ease of manufacturing.

No. of Words Code: 256K

The 256K word code indicates ample storage capacity, enabling broader use across various applications.

Command User Interface: YES

A command user interface simplifies interaction with the memory device, facilitating easier integration.

Ready or Busy: YES

The ready/busy signal provides clear indicators for data processing, which aids in efficient operation management.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V offers flexibility in power supply configurations while preventing over-voltage damage.

Boot Block: TOP

A top boot block configuration enhances security for boot operations, making it suitable for embedded applications.

Memory Density: 2097152 bit

The memory density indicates substantial storage capacity, accommodating large data sets.

Memory IC Type: FLASH

Flash memory is known for its non-volatile characteristics, making it ideal for applications requiring persistent data storage.

Maximum Standby Current: 0.0001 Amp

Minimal standby current consumption supports energy efficiency, particularly in battery-powered devices.

Maximum Access Time: 11 ns

An access time of 11 ns ensures quick data retrieval, enhancing the responsiveness of systems that use this memory.

Technical Specifications

Flash Memory M50LPW002K5 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Additional Features:

TOP BOOT BLOCK

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

1,2,1,3

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

3.56 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.455 mm

Trade Compliance

M50LPW002K5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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