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M50LPW040N5T

STMicroelectronics

M50LPW040N5T by STMicroelectronics

M50LPW040N5T from STMicroelectronics is a 4Mbit NOR Flash memory with a 3.3V supply, featuring an 11ns max access time and operating in synchronous mode. Its compact SOIC package (10mm x 18.4mm) makes it ideal for space-constrained applications. With 8 sectors of 64K words each, it's perfect for embedded systems requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,794 parts In-Stock

1+ parts

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4,794

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Digiode

USA . 2,667 parts In-Stock

1+ parts

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2,667

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Anansix

USA . 283 parts In-Stock

1+ parts

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283

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,015 parts In-Stock

1+ parts

$3.030

100+ parts

-

1k+ parts

$2.727

10k+ parts

-

1,015

$3.030

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$2.727

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MKK Technologies

India . 317 parts In-Stock

1+ parts

$5.699

100+ parts

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317

$5.699

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DigiPath Technology Company

USA . 317 parts In-Stock

1+ parts

$5.699

100+ parts

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317

$5.699

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Corphita

USA . 3,073 parts In-Stock

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3,073

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Parana Technologies

USA . 563 parts In-Stock

1+ parts

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$3.623

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563

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$3.623

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Overview

Elevate your designs with the M50LPW040N5T flash memory from STMicroelectronics—where quality meets innovation. As a trusted leader in semiconductor solutions, STMicroelectronics offers unmatched reliability and performance. This compact, high-speed NOR flash memory is perfect for applications ranging from consumer electronics to industrial systems, providing rapid data access and robust storage capabilities. Experience superior efficiency and longevity that empower your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures good protection against environmental factors, enhancing longevity.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact PCB designs.

Package Shape: RECTANGULAR

Rectangular shape is optimal for space efficiency on PCB layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates and overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Standard nominal voltage of 3.3V makes it compatible with a wide range of systems.

Power Supplies (V): 3.3

Compatible with common power supply designs, making integration easier.

No. of Terminals: 40

A higher number of terminals allows for more functionality and connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile saves space on PCBs, ideal for applications requiring compact designs.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable operation in demanding environments.

Organization: 512KX8

This organization provides a good balance of memory size and access speed.

Minimum Operating Temperature: -20 °C

Ability to operate in low temperatures enhances versatility in various applications.

No. of Sectors/Size: 8

Multiple sectors improve data management and organization within the memory.

Terminal Finish: TIN LEAD

Titanium lead finish aids in reliable soldering and connection integrity.

Terminal Position: DUAL

Dual terminal positioning improves installation flexibility on PCBs.

Maximum Seated Height: 1.2 mm

Low seated height allows for optimal space usage in shallow designs.

Width: 10 mm

Compact width makes it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage broadens the compatibility with various systems.

Type: NOR TYPE

NOR type is beneficial for high-speed random access applications.

Length: 18.4 mm

Moderate length allows for balance between size and performance.

Programming Voltage (V): 3

Standard programming voltage simplifies the design and implementation process.

Technology: CMOS

CMOS technology implies lower power consumption and enhanced performance.

Parallel or Serial: PARALLEL

Parallel access allows for faster read/write operations compared to serial methods.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and enhance reliability.

Sector Size (Words): 64K

Large sector size allows for efficient data storage and management.

Maximum Supply Current: 60 mA

Reasonable supply current aids in minimizing power consumption during operation.

No. of Words: 524288 words

A substantial number of words provides ample storage capacity for various applications.

Memory Width: 8

The 8-bit memory width allows for efficient data processing and management.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables higher density layouts, great for modern compact designs.

No. of Words Code: 512K

A 512K word capacity means more data can be stored, making it suitable for intensive applications.

Command User Interface: YES

User-friendly command interface simplifies programming and memory management.

Maximum Supply Voltage (Vsup): 3.6 V

Wide voltage range allows flexibility in power supply systems.

Memory Density: 4194304 bit

High memory density caters to data-intensive applications.

Memory IC Type: FLASH

Flash memory offers non-volatile storage, ensuring data retention without power.

Maximum Standby Current: 0.0001 Amp

Low standby current helps in energy-saving applications, enhancing overall efficiency.

Maximum Access Time: 11 ns

Fast access time improves performance, making it suitable for high-speed applications.

Technical Specifications

Flash Memory M50LPW040N5T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G40

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

40

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP40,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M50LPW040N5T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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