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S29GL128P11FFI010

Infineon Technologies

S29GL128P11FFI010 by Infineon Technologies

S29GL128P11FFI010 by Infineon is a 128Mx1 NOR flash memory with 128 sectors, operating at 3V. It features a parallel interface, 110ns access time, and supports common flash interface. Ideal for industrial applications requiring fast data access and reliable storage in a compact grid array package.

Median Price

$5.404

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$5.389

100+ parts

-

1k+ parts

-

10k+ parts

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30

$5.389

-

-

-

DigiKey

USA . 5,429 parts In-Stock

1+ parts

$5.420

100+ parts

$4.477

1k+ parts

$4.162

10k+ parts

-

5,429

$5.420

$4.477

$4.162

-

Arrow

USA . 390 parts In-Stock

1+ parts

$6.675

100+ parts

$5.054

1k+ parts

$4.417

10k+ parts

$4.417

390

$6.675

$5.054

$4.417

$4.417

Mouser Electronics

USA . 696 parts In-Stock

1+ parts

$6.840

100+ parts

$5.450

1k+ parts

$4.860

10k+ parts

-

696

$6.840

$5.450

$4.860

-

Flip Electronics (Authorized)

USA . 2,472 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,472

-

-

-

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Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$5.213

1k+ parts

$4.662

10k+ parts

$4.388

250

-

$5.213

$4.662

$4.388

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$4.170

1k+ parts

$3.730

10k+ parts

$3.510

250

-

$4.170

$3.730

$3.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 471 parts In-Stock

1+ parts

$4.398

100+ parts

-

1k+ parts

-

10k+ parts

-

471

$4.398

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.265

100+ parts

-

1k+ parts

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300

$6.265

-

-

-

Chip Stock

USA . 18,720 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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18,720

-

-

-

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Flip Electronics

USA . 2,472 parts In-Stock

1+ parts

-

100+ parts

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2,472

-

-

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Vyrian

USA . 1,686 parts In-Stock

1+ parts

-

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1,686

-

-

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EMSNET

USA . 29 parts In-Stock

1+ parts

-

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29

-

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Speed Components Ltd

Israel . 7 parts In-Stock

1+ parts

-

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7

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 5,445 parts In-Stock

1+ parts

$3.575

100+ parts

$3.432

1k+ parts

$3.289

10k+ parts

-

5,445

$3.575

$3.432

$3.289

-

Corohmni

South Africa . 338 parts In-Stock

1+ parts

$3.596

100+ parts

-

1k+ parts

-

10k+ parts

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338

$3.596

-

-

-

Semicontronic

India . 1,078 parts In-Stock

1+ parts

$3.940

100+ parts

$3.842

1k+ parts

$3.822

10k+ parts

-

1,078

$3.940

$3.842

$3.822

-

Corphita

USA . 828 parts In-Stock

1+ parts

$4.167

100+ parts

-

1k+ parts

-

10k+ parts

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828

$4.167

-

-

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Aztec Data Supply Inc.

USA . 1,214 parts In-Stock

1+ parts

$4.762

100+ parts

-

1k+ parts

-

10k+ parts

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1,214

$4.762

-

-

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Continental Prestige Electronics

USA . 4,227 parts In-Stock

1+ parts

$5.535

100+ parts

-

1k+ parts

-

10k+ parts

$5.424

4,227

$5.535

-

-

$5.424

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$7.173

100+ parts

$6.599

1k+ parts

$6.184

10k+ parts

-

1,000

$7.173

$6.599

$6.184

-

Microchip USA

USA . 2,478 parts In-Stock

1+ parts

$19.264

100+ parts

-

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2,478

$19.264

-

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Component Stockers USA

USA . 619 parts In-Stock

1+ parts

$99.990

100+ parts

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619

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 6,732 parts In-Stock

1+ parts

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6,732

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Argo Parts USA

USA . 3,394 parts In-Stock

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3,394

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Metaverse IC Inc.

Canada . 3,166 parts In-Stock

1+ parts

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3,166

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Lixinc

USA . 2,411 parts In-Stock

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2,411

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 696 parts In-Stock

1+ parts

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696

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Futuretech Components

Singapore . 180 parts In-Stock

1+ parts

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180

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Kepictronics

USA . 180 parts In-Stock

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180

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$6.140

1k+ parts

$5.952

10k+ parts

$5.827

100

-

$6.140

$5.952

$5.827

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

-

-

-

-

Overview

Unleash the power of reliable and high-performance flash memory with the S29GL128P11FFI010 by Infineon Technologies. As a leading manufacturer in the industry, Infineon offers top-notch quality and cutting-edge technology in their products. Ideal for a wide range of applications, this flash memory provides seamless operation and efficient data storage solutions. With fast access time, low standby current, and a durable package body material, customers can trust in the value and benefits that this product brings to their projects. Upgrade your systems with the S29GL128P11FFI010 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for portable electronic devices.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent operation of the flash memory, providing flexibility and efficiency in data access and storage.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V ensures compatibility with a wide range of electronic devices, making it versatile and easy to integrate.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C indicates excellent soldering capability and reliability during the manufacturing process.

Memory Density: 134217728 bit

With a high memory density of 134217728 bits, this flash memory offers ample storage capacity for data-intensive applications.

Technical Specifications

Flash Memory S29GL128P11FFI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

110 ns

Alternate Memory Width:

8

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

128

No. of Terminals:

64

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.4 mm

Sector Size (Words):

128K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11 mm

Trade Compliance

S29GL128P11FFI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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