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M50LPW002K1T

STMicroelectronics

M50LPW002K1T by STMicroelectronics

M50LPW002K1T from STMicroelectronics is a 256Kx8 NOR Flash memory with a 3.3V supply, featuring a max access time of 11 ns and operating temp range of 0 °C to 70 °C. Ideal for synchronous applications, it supports parallel interface and offers efficient data storage solutions. Its compact chip carrier design ensures easy integration in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,887 parts In-Stock

1+ parts

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3,887

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Anansix

USA . 2,199 parts In-Stock

1+ parts

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1k+ parts

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2,199

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Vyrian

USA . 935 parts In-Stock

1+ parts

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935

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,353 parts In-Stock

1+ parts

$3.141

100+ parts

-

1k+ parts

$2.827

10k+ parts

-

2,353

$3.141

-

$2.827

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MKK Technologies

India . 950 parts In-Stock

1+ parts

$5.906

100+ parts

-

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950

$5.906

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DigiPath Technology Company

USA . 950 parts In-Stock

1+ parts

$5.906

100+ parts

-

1k+ parts

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950

$5.906

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Corphita

USA . 4,413 parts In-Stock

1+ parts

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4,413

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Parana Technologies

USA . 961 parts In-Stock

1+ parts

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100+ parts

$3.755

1k+ parts

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961

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$3.755

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Overview

Unlock a world of possibilities with the M50LPW002K1T Flash Memory from STMicroelectronics, a trusted leader in innovative electronic solutions. Designed for efficiency and reliability, this compact memory chip is perfect for applications ranging from consumer electronics to industrial automation. Experience rapid data access, low power consumption, and exceptional durability, all backed by ST's commitment to quality. Elevate your projects with unmatched performance and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, making it suitable for modern electronics.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space usage on PCBs, facilitating larger memory integration.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster data transfer rates, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal voltage of 3.3V is standard for many devices, enhancing compatibility.

Power Supplies (V): 3.3

Dual power supply requirement ensures stability and reliable operation under various conditions.

No. of Terminals: 32

The availability of 32 terminals facilitates efficient connections and flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides excellent heat dissipation and mechanical stability.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C makes this chip suitable for a variety of applications.

Organization: 256KX8

This organization signifies a well-structured memory distribution, optimizing read/write operations.

Minimum Operating Temperature: 0 °C

This range allows operation in a wider array of environments, from room temperature to mildly cold conditions.

No. of Sectors/Size: 1,2,1,3

Diverse sector size improves memory management and flexibility for different use cases.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and reliability in connections.

Terminal Position: QUAD

Quad terminal positioning allows for efficient signal routing and minimizes space on PCBs.

Maximum Seated Height: 3.56 mm

A compact seated height contributes to space-saving designs in electronic devices.

Width: 11.455 mm

The width is optimized for space-efficient layouts in modern electronics.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum voltage of 3V provides versatility across various applications.

Type: NOR TYPE

NOR memory allows for fast random access, making it ideal for code storage.

Length: 13.995 mm

The length complements compact design strategies, fitting well in limited PCB spaces.

Programming Voltage (V): 3

Standard programming voltage contributes to compatibility with commonly used programming equipment.

Temperature Grade: COMMERCIAL

This grade indicates reliability in typical commercial temperature ranges, suitable for many consumer applications.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, benefiting battery-operated devices.

Parallel or Serial: PARALLEL

Parallel data transfer allows for high-speed operations, enhancing overall system responsiveness.

Terminal Form: J BEND

J bend terminals provide ease of soldering and a secure connection to the PCB.

Sector Size (Words): 16K,8K,32K,64K

Flexible sector sizes enable optimized data storage and management based on specific application requirements.

Maximum Supply Current: 60 mA

A maximum supply current of 60 mA is manageable for most applications, ensuring efficiency.

No. of Words: 262144 words

The capacity of 262,144 words allows for significant data storage, suitable for a variety of applications.

Memory Width: 8

An 8-bit memory width aligns with standard data processing and communication protocols.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm ensures compatibility with a wide range of circuit board layouts.

No. of Words Code: 256K

256K word code indicates substantial memory capacity for efficient software and data storage.

Command User Interface: YES

The presence of a user interface allows easier control and management of memory operations.

Ready or Busy: YES

This feature provides feedback on memory status, ensuring effective task management during operations.

Maximum Supply Voltage (Vsup): 3.6 V

The upper voltage limit of 3.6V supports stable operation in a variety of electronic environments.

Boot Block: TOP

Top boot block configuration supports quicker boot processes in embedded systems.

Memory Density: 2097152 bit

A density of 2,097,152 bits supports a broad range of applications requiring substantial storage.

Memory IC Type: FLASH

As a flash memory IC, it offers non-volatile storage, retaining data even without power.

Maximum Standby Current: 0.0001 Amp

Low standby current minimizes power consumption, ideal for battery-operated applications.

Maximum Access Time: 11 ns

An access time of only 11 ns ensures quick data retrieval, enhancing system performance.

Technical Specifications

Flash Memory M50LPW002K1T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Additional Features:

TOP BOOT BLOCK

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

1,2,1,3

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

3.56 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.455 mm

Trade Compliance

M50LPW002K1T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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