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SST26WF016B-104I/SN

Microchip Technology

SST26WF016B-104I/SN by Microchip Technology

SST26WF016B-104I/SN by Microchip: 16MX1 organization, 104 MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring NOR flash memory with 100000 write/erase cycles endurance and 1.8V programming voltage.

Median Price

$2.058

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4 parts In-Stock

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$0.960

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4

$0.960

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Verical

USA . 50 parts In-Stock

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-

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$3.156

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$3.156

10k+ parts

$3.156

50

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$3.156

$3.156

$3.156

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.620

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$1.620

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Vyrian

USA . 3,717 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 27 parts In-Stock

1+ parts

$0.820

100+ parts

$0.800

1k+ parts

$0.795

10k+ parts

-

27

$0.820

$0.800

$0.795

-

Bastille Electronics

Australia . 15,164 parts In-Stock

1+ parts

$1.620

100+ parts

$1.539

1k+ parts

$1.462

10k+ parts

$1.442

15,164

$1.620

$1.539

$1.462

$1.442

Continental Prestige Electronics

USA . 4,437 parts In-Stock

1+ parts

$1.620

100+ parts

-

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$1.588

4,437

$1.620

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$1.588

Argo Parts USA

USA . 369 parts In-Stock

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$1.620

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369

$1.620

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Ampacity Inc.

Singapore . 27 parts In-Stock

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$1.780

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27

$1.780

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Aztec Data Supply Inc.

USA . 476 parts In-Stock

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$2.340

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$2.340

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Corohmni

South Africa . 72 parts In-Stock

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$5.096

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Microchip USA

USA . 1,624 parts In-Stock

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$10.920

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$10.920

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AZTECH Wire

Italy . 776 parts In-Stock

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$14.980

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$14.980

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Lixinc

USA . 8,111 parts In-Stock

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QualityLine Systems

Poland . 3,327 parts In-Stock

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Marpe Global Electronics

Taiwan . 2,044 parts In-Stock

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XL Components Corporation

Australia . 1,833 parts In-Stock

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iodParts Technologies Inc.

India . 295 parts In-Stock

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Overview

Unlock endless possibilities with the Microchip Technology SST26WF016B-104I/SN Flash Memory. Known for its high-quality manufacturing, this product offers unparalleled value and benefits. Perfect for a wide range of applications, from automotive to industrial, the SST26WF016B-104I/SN provides reliable performance and endurance with 100,000 write/erase cycles. Say goodbye to limitations and explore the world of opportunities with this innovative memory solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the flash memory chip, ensuring it can withstand environmental conditions and physical handling.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in reducing power consumption and heat generation, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this flash memory chip can function reliably in various industrial environments without risk of overheating.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the flash memory chip efficient and reliable for data storage.

Endurance: 100000 Write/Erase Cycles

With a high endurance of 100,000 write/erase cycles, this flash memory chip offers long-term reliability and durability for storing and accessing data multiple times.

Technical Specifications

Flash Memory SST26WF016B-104I/SN attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

1.8

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

SST26WF016B-104I/SN Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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