Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M50FLW080AN5G from STMicroelectronics is a 1M x 8 NOR Flash memory with a 3.3V supply, ideal for high-speed applications. It features an access time of 11 ns and operates in a temperature range of -20 °C to 85 °C. This compact, surface-mount device is perfect for embedded systems requiring reliable data storage.
Median Price
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Vyrian
Digiode
Anansix
Inventory MP
Bristol Electronics
IDEA Electronic Components Group
$2.784
$2.506
MKK Technologies
$5.235
DigiPath Technology Company
AZTECH Wire
$19.810
Corphita
Authorized Procurement Solutions
Parana Technologies
$3.329
Kepictronics
Microchip USA
The use of plastic/epoxy ensures durability and resistance to environmental factors, making this flash memory reliable for various applications.
Surface mount capability allows for easy integration into modern circuit boards, saving space and improving assembly efficiency.
The rectangular shape optimizes layout space on PCBs, facilitating compact designs in electronic devices.
Synchronous operation enhances performance by allowing for faster data transactions compared to asynchronous modes.
A nominal supply voltage of 3.3V is standard, providing compatibility with a wide range of electronic systems, thus increasing usability.
The consistent power supply requirement simplifies design and power management for end products.
A higher number of terminals allows for more complex configurations and greater connectivity options.
The thin profile allows for space-saving designs, making it suitable for compact electronic gadgets.
An operational temperature up to 85 °C extends the potential applications in high-temperature environments.
The organization allows for efficient data storage and retrieval, optimizing performance.
This wide temperature range ensures functionality in diverse environments, making it versatile for various applications.
Having multiple sectors enables the efficient management and organization of data, improving data access speeds.
Dual terminal positioning enables better electrical connections and layout flexibility on circuit boards.
A low seated height helps in maintaining a compact profile, beneficial for small devices.
A moderate width ensures compatibility with various PCB designs while maximizing space efficiency.
The capability to operate at a minimum voltage of 3V enhances the device's adaptability to different power sources.
The peak reflow temperature indicates the component's suitability for modern soldering processes, ensuring robust manufacturing.
NOR type allows for faster read speeds, making this flash memory ideal for applications requiring quick data access.
This length is tailored for efficient footprint on PCBs, providing a balance between size and functionality.
The programming voltage of 3V is suitable for low power applications, enhancing energy efficiency.
CMOS technology contributes to lower power consumption and higher integration density, which is ideal for mobile applications.
Parallel interfacing allows for faster data transfer rates, significantly improving system performance.
The gull wing terminal form facilitates easy handling during assembly and provides good solder flow properties.
Having two different sector sizes provides flexibility in managing various data sizes effectively.
A maximum supply current of 60 mA is relatively low, contributing to extended battery life in portable devices.
With over 1 million words of storage, this product is well-suited for applications demanding ample memory.
An 8-bit memory width allows for efficient data handling and compatibility with most microcontrollers.
The 0.5 mm terminal pitch supports compact component placements, enhancing layout efficiency on circuit boards.
1 million words of code storage capability makes it an optimal choice for applications requiring substantial memory.
A command user interface allows for straightforward control of memory operations, simplifying integration in various systems.
A maximum supply voltage of 3.6 V ensures compatibility with a range of digital circuit designs.
With 8 Mbit of memory density, this flash memory can store significant amounts of data, catering to complex applications.
Being a FLASH type memory allows for quick rewriting and erasing of data, enhancing flexibility in data management.
A very low standby current helps in minimizing energy consumption when not in active use, ideal for battery-powered devices.
A quick access time of 11 ns improves system responsiveness, essential for high-performance applications.
Flash Memory M50FLW080AN5G attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
Maximum Access Time:
Command User Interface:
Data Polling:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Sectors/Size:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Programming Voltage (V):
Qualification:
Maximum Seated Height:
Sector Size (Words):
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Toggle Bit:
Type:
Width:
M50FLW080AN5G Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Assembly/Origin - Tray Pkg Label Chgs 8/Oct/2020
PCN Packaging - Standard Pkg Label Chg 20/Feb/2019
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
ROHM
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
1554216004
Molex
WIRE AND CABLE;
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
Sangdest Microelectronics (Nanjing)
1N4148WS
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
LM358AN
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
Temic Semiconductors
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
MT29F16G08ABACAWP-ITZ:C
Micron Technology
MT29F16G08ABACAWP-ITZ:C by Micron Technology is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85 °C. It has a memory density of 17179869184 bit and is suitable for industrial applications requiring reliable, high-speed data storage in compact devices.
S29AL008J70TFI010
Infineon Technologies
Infineon's S29AL008J70TFI010 is a 512Kx16 NOR flash memory with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, 524288 words, and parallel interface. Ideal for industrial applications requiring fast access time of 70ns and low standby current of 0.000005Amp.
AM29F010B-70JF
Advanced Micro Devices
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; No. of Words: 131072 words;
S29GL512P11FFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; No. of Words Code: 32M;
S25FL128LAGNFV010
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
MTFC8GAKAJCN-4MITTR
Micron Technology's MTFC8GAKAJCN-4MITTR is a 8GX8 MLC NAND flash memory with 68719476736 bit density. It operates in synchronous mode at up to 52 MHz clock frequency, suitable for industrial applications. The package style is grid array with very thin profile and fine pitch, making it ideal for compact electronic devices.
MX25R6435FZNIL0
Macronix
Macronix's MX25R6435FZNIL0 is a 64Mb Flash Memory with synchronous operation, 1.8V supply voltage, and 33MHz clock frequency. Ideal for industrial applications requiring high-speed data storage in compact devices due to its small outline package and serial interface.
W25Q256JVFIQ
Winbond Electronics
W25Q256JVFIQ by Winbond Electronics is a NOR flash memory with 32MX8 organization, operating at 133 MHz. It features a 3.3V programming voltage and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed synchronous operation in compact designs.
S25FL128SAGMFI011
S25FL128SAGMFI011 by Infineon Technologies is a NOR type Flash Memory with 32MX4 organization, operating at 133 MHz clock frequency. It has a 100000 write/erase cycle endurance and supports SPI serial bus type. Ideal for industrial applications requiring high-speed synchronous operation and reliable data storage in compact devices.
MT29F8G08ABABAWP-ITX:B
Micron Technology's MT29F8G08ABABAWP-ITX:B is an 8Gb SLC NAND flash memory with 3.3V supply voltage, operating from -40 to 85°C. It has a memory density of 8.58 Gb and is suitable for industrial applications requiring high reliability and performance in a surface-mount package.
MT25QL256ABA1EW9-0SIT
Micron Technology's MT25QL256ABA1EW9-0SIT is a 256Mbit flash memory with synchronous operation at 133MHz. It has a small outline package, operates in industrial temperature range (-40 to 85 °C), and uses serial interface. Ideal for applications requiring high-speed data storage in compact devices.
S25FL128SAGMFIG01
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
S25FL256SAGNFI000
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Programming Voltage (V): 3;
SDINBDG4-32G-I1
Western Digital
SDINBDG4-32G-I1 by Western Digital is a 32GX8 MLC NAND flash memory with 3000 Write/Erase Cycles. Operating at 200 MHz, it has a memory density of 274877906944 bit and supports synchronous mode. Ideal for applications requiring high-speed data storage in compact devices.
JS28F640J3F75A
Micron Technology's JS28F640J3F75A is a 64Mb NOR flash memory with 4MX16 organization, operating at -40 to 85°C. It features a parallel interface, 4194304 words capacity, and peak reflow temp of 260°C. Ideal for industrial applications requiring fast access times and reliable data storage.
MT29F2G01ABAGDWB-IT:GTR
FLASH; Programming Voltage (V): 3.3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Type: SLC NAND TYPE;
AT45DB321D-SU-SL955
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
S29JL032J70TFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
KLMAG1JETD-B0410
Samsung
FLASH; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 137438953472 bit;
THGBMJG6C1LBAU7
Kioxia Holdings
THGBMJG6C1LBAU7 by Kioxia Holdings is an 8GX8 flash memory IC with 68719476736 bit memory density. It operates b/w -40 to 105 °C, suitable for industrial applications. With a terminal pitch of 0.5 mm and package style GRID ARRAY, it's ideal for compact electronic devices.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M50FLW040AN5
STMicroelectronics
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK5TG
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
M50FLW040AK1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 60 mA;
M50FLW040AN1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: TOP;
M50FLW040AN1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK5P
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Data Polling: NO;
M50FLW040AN5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
M50FLW040AK5TP
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AN1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512K;
M50FLW040AN1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M50FLW040AK5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AN1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
M50FLW040AK1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Position: QUAD;
M50FLW040AK5T
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 8;
M50FLW040AK1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Sector Size (Words): 4K,64K;
M50FLW040AK1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
M50FLW040AK5
M50FLW040AN1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
Supply Digital Components
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