Loading...

M50FLW080AN5G

STMicroelectronics

M50FLW080AN5G by STMicroelectronics

M50FLW080AN5G from STMicroelectronics is a 1M x 8 NOR Flash memory with a 3.3V supply, ideal for high-speed applications. It features an access time of 11 ns and operates in a temperature range of -20 °C to 85 °C. This compact, surface-mount device is perfect for embedded systems requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 24,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,100

-

-

-

-

Vyrian

USA . 6,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,843

-

-

-

-

Digiode

USA . 4,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,484

-

-

-

-

Anansix

USA . 580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

580

-

-

-

-

Inventory MP

USA . 54 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54

-

-

-

-

Bristol Electronics

USA . 54 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,061 parts In-Stock

1+ parts

$2.784

100+ parts

-

1k+ parts

$2.506

10k+ parts

-

2,061

$2.784

-

$2.506

-

MKK Technologies

India . 448 parts In-Stock

1+ parts

$5.235

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$5.235

-

-

-

DigiPath Technology Company

USA . 448 parts In-Stock

1+ parts

$5.235

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$5.235

-

-

-

AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$19.810

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$19.810

-

-

-

Corphita

USA . 3,867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,867

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 2,374 parts In-Stock

1+ parts

-

100+ parts

$3.329

1k+ parts

-

10k+ parts

-

2,374

-

$3.329

-

-

Kepictronics

USA . 2,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

-

-

-

-

Microchip USA

USA . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

498

-

-

-

-

Overview

Unlock the potential of your next project with the M50FLW080AN5G from STMicroelectronics—a leading name in innovative technology! This high-quality NOR Flash memory offers exceptional reliability and performance for a wide range of applications, from consumer electronics to industrial systems. With its compact design and low power consumption, it seamlessly fits into any device while enhancing speed and efficiency. Choose STMicroelectronics for advanced solutions that deliver unmatched value and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this flash memory reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration into modern circuit boards, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout space on PCBs, facilitating compact designs in electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance by allowing for faster data transactions compared to asynchronous modes.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3V is standard, providing compatibility with a wide range of electronic systems, thus increasing usability.

Power Supplies (V): 3.3

The consistent power supply requirement simplifies design and power management for end products.

No. of Terminals: 40

A higher number of terminals allows for more complex configurations and greater connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The thin profile allows for space-saving designs, making it suitable for compact electronic gadgets.

Maximum Operating Temperature: 85 °C

An operational temperature up to 85 °C extends the potential applications in high-temperature environments.

Organization: 1MX8

The organization allows for efficient data storage and retrieval, optimizing performance.

Minimum Operating Temperature: -20 °C

This wide temperature range ensures functionality in diverse environments, making it versatile for various applications.

No. of Sectors/Size: 48, 13

Having multiple sectors enables the efficient management and organization of data, improving data access speeds.

Terminal Position: DUAL

Dual terminal positioning enables better electrical connections and layout flexibility on circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height helps in maintaining a compact profile, beneficial for small devices.

Width: 10 mm

A moderate width ensures compatibility with various PCB designs while maximizing space efficiency.

Minimum Supply Voltage (Vsup): 3 V

The capability to operate at a minimum voltage of 3V enhances the device's adaptability to different power sources.

Peak Reflow Temperature: 260 °C

The peak reflow temperature indicates the component's suitability for modern soldering processes, ensuring robust manufacturing.

Type: NOR TYPE

NOR type allows for faster read speeds, making this flash memory ideal for applications requiring quick data access.

Length: 18.4 mm

This length is tailored for efficient footprint on PCBs, providing a balance between size and functionality.

Programming Voltage (V): 3

The programming voltage of 3V is suitable for low power applications, enhancing energy efficiency.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher integration density, which is ideal for mobile applications.

Parallel or Serial: PARALLEL

Parallel interfacing allows for faster data transfer rates, significantly improving system performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy handling during assembly and provides good solder flow properties.

Sector Size (Words): 4K, 64K

Having two different sector sizes provides flexibility in managing various data sizes effectively.

Maximum Supply Current: 60 mA

A maximum supply current of 60 mA is relatively low, contributing to extended battery life in portable devices.

No. of Words: 1048576 words

With over 1 million words of storage, this product is well-suited for applications demanding ample memory.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and compatibility with most microcontrollers.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports compact component placements, enhancing layout efficiency on circuit boards.

No. of Words Code: 1M

1 million words of code storage capability makes it an optimal choice for applications requiring substantial memory.

Command User Interface: YES

A command user interface allows for straightforward control of memory operations, simplifying integration in various systems.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a range of digital circuit designs.

Memory Density: 8388608 bit

With 8 Mbit of memory density, this flash memory can store significant amounts of data, catering to complex applications.

Memory IC Type: FLASH

Being a FLASH type memory allows for quick rewriting and erasing of data, enhancing flexibility in data management.

Maximum Standby Current: 0.0001 Amp

A very low standby current helps in minimizing energy consumption when not in active use, ideal for battery-powered devices.

Maximum Access Time: 11 ns

A quick access time of 11 ns improves system responsiveness, essential for high-performance applications.

Technical Specifications

Flash Memory M50FLW080AN5G attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G40

Length:

18.4 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

48,13

No. of Terminals:

40

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP40,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M50FLW080AN5G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20