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S25FL256SAGNFI010

Infineon Technologies

S25FL256SAGNFI010 by Infineon Technologies

S25FL256SAGNFI010 by Infineon is a NOR flash memory with 64Mx4 organization, operating at 133MHz. It has a small outline package style and can withstand industrial temperatures. Ideal for applications requiring high-speed data storage in compact devices.

Median Price

$3.173

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 676 parts In-Stock

1+ parts

$2.445

100+ parts

$2.321

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676

$2.445

$2.321

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Chip1Stop

Japan . 74 parts In-Stock

1+ parts

$2.760

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74

$2.760

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Arrow

USA . 1,516 parts In-Stock

1+ parts

$3.066

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1,516

$3.066

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Newark

USA . 261 parts In-Stock

1+ parts

$3.280

100+ parts

$3.280

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$3.280

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261

$3.280

$3.280

$3.280

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Element14

Singapore . 348 parts In-Stock

1+ parts

$3.980

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348

$3.980

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Farnell

UK . 348 parts In-Stock

1+ parts

$4.291

100+ parts

$4.099

1k+ parts

$3.996

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348

$4.291

$4.099

$3.996

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DigiKey

USA . 1,542 parts In-Stock

1+ parts

$4.960

100+ parts

$4.281

1k+ parts

$3.998

10k+ parts

$3.939

1,542

$4.960

$4.281

$3.998

$3.939

Mouser Electronics

USA . 122 parts In-Stock

1+ parts

$4.960

100+ parts

$4.290

1k+ parts

$3.930

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122

$4.960

$4.290

$3.930

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Verical

USA . 1,516 parts In-Stock

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1,516

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Future Electronics

Canada . 676 parts In-Stock

1+ parts

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$2.780

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676

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$2.780

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Rochester

USA . 634 parts In-Stock

1+ parts

-

100+ parts

$2.610

1k+ parts

$2.340

10k+ parts

$2.200

634

-

$2.610

$2.340

$2.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 176 parts In-Stock

1+ parts

$2.840

100+ parts

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176

$2.840

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Chip Stock

USA . 8,188 parts In-Stock

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8,188

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IBS Electronics

USA . 676 parts In-Stock

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$3.899

10k+ parts

$3.380

676

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$3.899

$3.380

Vyrian

USA . 613 parts In-Stock

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613

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Distributors (Availability)

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Semicontronic

India . 469 parts In-Stock

1+ parts

$2.590

100+ parts

$2.525

1k+ parts

$2.512

10k+ parts

-

469

$2.590

$2.525

$2.512

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Corphita

USA . 343 parts In-Stock

1+ parts

$2.691

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343

$2.691

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Modulus Dynamics

Lithuania . 6,148 parts In-Stock

1+ parts

$3.138

100+ parts

$3.012

1k+ parts

$2.887

10k+ parts

-

6,148

$3.138

$3.012

$2.887

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Aztec Data Supply Inc.

USA . 4,689 parts In-Stock

1+ parts

$3.267

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4,689

$3.267

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Argo Parts USA

USA . 2,278 parts In-Stock

1+ parts

$4.278

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2,278

$4.278

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.278

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$4.192

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1,000

$4.278

$4.192

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$4.776

100+ parts

$4.537

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$4.537

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15

$4.776

$4.537

$4.537

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Corohmni

South Africa . 183 parts In-Stock

1+ parts

$4.880

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183

$4.880

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Continental Prestige Electronics

USA . 418 parts In-Stock

1+ parts

$5.400

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$3.900

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418

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$3.900

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QUARKTWIN TECHNOLOGY LTD

USA . 21,223 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,405 parts In-Stock

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Lixinc

USA . 4,521 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,966 parts In-Stock

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Assy Fe

Spain . 1,393 parts In-Stock

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Kepictronics

USA . 1,389 parts In-Stock

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1,389

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Glotronic Ltd.

UK . 811 parts In-Stock

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811

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Futuretech Components

Singapore . 676 parts In-Stock

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676

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Overview

Upgrade your device's storage with the S25FL256SAGNFI010 by Infineon Technologies. Known for its high-quality Flash Memory products, Infineon offers a reliable solution for various applications. With a durable plastic/epoxy body and synchronous operation mode, this memory chip ensures optimal performance. Experience faster data transfer speeds, enhanced reliability, and seamless integration with this cutting-edge technology. Invest in the best and elevate your device's capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package durable and resistant to environmental factors, ensuring the longevity of the flash memory product.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer speeds and better coordination between the memory and the controller, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3

A 3V supply voltage is common and compatible with various systems, making this flash memory versatile in its applications.

Write Protection: HARDWARE/SOFTWARE

The ability to protect data through hardware or software mechanisms adds an extra layer of security to prevent accidental data loss or unauthorized access.

Endurance: 100000 Write/Erase Cycles

With a high endurance rating, this flash memory can handle a large number of write and erase cycles, ensuring reliable and long-lasting performance.

Technical Specifications

Flash Memory S25FL256SAGNFI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256SAGNFI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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