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M50FLW040AN1P

STMicroelectronics

M50FLW040AN1P by STMicroelectronics

M50FLW040AN1P from STMicroelectronics is a 4Mbit NOR Flash memory with a 3.3V supply, featuring a fast access time of 11 ns and operating in synchronous mode. It comes in a compact SOIC package, ideal for space-constrained applications. With 40 terminals and commercial temperature grade, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,187 parts In-Stock

1+ parts

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2,187

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Anansix

USA . 2,034 parts In-Stock

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2,034

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Digiode

USA . 987 parts In-Stock

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987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,303 parts In-Stock

1+ parts

$3.007

100+ parts

-

1k+ parts

$2.706

10k+ parts

-

2,303

$3.007

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$2.706

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MKK Technologies

India . 2,293 parts In-Stock

1+ parts

$5.654

100+ parts

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2,293

$5.654

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DigiPath Technology Company

USA . 2,293 parts In-Stock

1+ parts

$5.654

100+ parts

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2,293

$5.654

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Parana Technologies

USA . 1,478 parts In-Stock

1+ parts

-

100+ parts

$3.595

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1,478

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$3.595

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Corphita

USA . 770 parts In-Stock

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770

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Overview

Unlock exceptional performance with the M50FLW040AN1P from STMicroelectronics—a leader in innovative technology. This high-quality flash memory offers unparalleled reliability and efficiency, making it ideal for a wide range of applications, from consumer electronics to industrial systems. With its compact design and synchronous operation, you'll enjoy faster data access, reduced power consumption, and seamless integration into your projects, ultimately enhancing your product's value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape is efficient for layout optimization on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates and improves overall performance.

Nominal Supply Voltage / Vsup: 3.3 V

Standard operating voltage ensures compatibility with a broad range of devices.

Power Supplies (V): 3.3

Consistent power requirements simplify power supply designs.

No. of Terminals: 40

A higher number of terminals allows for greater connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style minimizes board space usage while maintaining performance.

Maximum Operating Temperature: 70 °C

The ability to operate at elevated temperatures increases reliability in harsh environments.

Organization: 512KX8

This memory organization allows for efficient data handling and storage management.

Minimum Operating Temperature: 0 °C

The minimum operating temperature range ensures performance in diverse environmental conditions.

No. of Sectors/Size: 48,5

A well-defined sector layout enables efficient data management and fast access times.

Terminal Position: DUAL

Dual terminal positioning enhances soldering reliability and connection stability.

Maximum Seated Height: 1.2 mm

Low seated height contributes to reduced overall device thickness, proving beneficial for slim designs.

Width: 10 mm

A reasonable width facilitates better layout on printed circuit boards.

Minimum Supply Voltage (Vsup): 3 V

Flexibility in supply voltage ensures compatibility with various systems.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance improves integration with modern soldering processes.

Type: NOR TYPE

NOR flash provides fast read speeds and random access, ideal for code storage applications.

Length: 18.4 mm

Compact length improves integration into smaller device form factors.

Programming Voltage (V): 3

Standard programming voltage simplifies circuit design and potential manufacturing processes.

Temperature Grade: COMMERCIAL

Commercial temperature grade validation ensures reliable operation in everyday environments.

Technology: CMOS

CMOS technology facilitates low power consumption, making it energy-efficient.

Parallel or Serial: PARALLEL

Parallel architecture enhances data throughput and system performance.

Terminal Form: GULL WING

Gull wing terminals enhance ease of soldering and improve electrical connections.

Sector Size (Words): 4K,64K

Flexible sector sizes allow for versatile data storage strategies and efficient memory management.

Maximum Supply Current: 60 mA

Relatively low supply current facilitates energy savings and extends battery life in portable devices.

No. of Words: 524288 words

Ample storage capacity supports a variety of applications, from simple to complex data tasks.

Memory Width: 8

An 8-bit memory width strikes a balance between performance and complexity for many applications.

Terminal Pitch: 0.5 mm

Tight terminal pitch enables higher density of components on a PCB, ideal for miniaturization.

No. of Words Code: 512K

512K word code ensures substantial storage capability for various memory-hungry applications.

Command User Interface: YES

Integrated command interface simplifies user interaction and improves programmability.

Ready or Busy: YES

The ready or busy status provides real-time feedback on memory operation, enhancing control.

Maximum Supply Voltage (Vsup): 3.6 V

Slightly higher maximum supply voltage provides flexibility in power supply design.

Boot Block: TOP

The top boot block arrangement allows easier firmware updates and enhances reliability.

Memory Density: 4194304 bit

High memory density enables extensive data storage within a compact physical footprint.

Memory IC Type: FLASH

Flash memory type supports fast read/write operations, making it suitable for applications requiring frequent data updates.

Maximum Standby Current: 0.0001 Amp

Very low standby current ensures energy efficiency, crucial for battery-powered devices.

Maximum Access Time: 11 ns

Fast access time improves system response rates, allowing for high-performance applications.

Technical Specifications

Flash Memory M50FLW040AN1P attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G40

Length:

18.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

48,5

No. of Terminals:

40

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP40,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M50FLW040AN1P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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