Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M50FLW040AK1T from STMicroelectronics is a 4Mbit NOR Flash memory with a synchronous operating mode and a supply voltage of 3.3V. It features fast access times of 11ns, operates in temperatures from 0 °C to 70 °C, and is ideal for embedded applications. Its compact chip carrier design ensures efficient surface mounting in various electronic devices.
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$9.067
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$5.765
The durable plastic/epoxy material ensures longevity and reliability in various environmental conditions.
Surface mount technology allows for compact designs, saving space on circuit boards and improving manufacturing efficiency.
The rectangular shape is advantageous for standard PCB layouts and easy integration into existing designs.
Synchronous operation provides faster access times and improves overall data transfer rates.
Operating at a nominal voltage of 3.3V is standard for many applications, ensuring compatibility with common devices.
Utilizing a 3.3V power supply reduces power consumption and is suitable for low-voltage applications.
32 terminals facilitate efficient data communication, allowing for high-speed processing in compact designs.
The chip carrier packaging enhances thermal performance, which is essential for high-speed applications.
A maximum operating temperature of 70 °C ensures reliable performance in a wide range of environments.
The memory organization allows for efficient data management and retrieval, making it suitable for various applications.
Operating at a minimum temperature of 0 °C expands the use case scenarios in diverse applications, even in cooler climates.
The existence of multiple sectors enhances data organization and management, allowing for better control of memory usage.
The tin-lead terminal finish provides good solderability and is suitable for long-lasting connections.
Quad terminal positioning promotes robust electrical performance and greater flexibility in board layout.
The low profile design allows for optimized placement in compact systems and helps reduce overall device size.
A width of 11.43 mm makes it compatible with a variety of PCB layouts and space-saving designs.
The ability to operate at a minimum of 3V increases flexibility for a range of power supply options.
NOR type memory is known for its fast random access times, making it ideal for code storage and retrieval.
With a compact length of 13.97 mm, it supports specialized and dense electronic designs.
A programming voltage of 3V simplifies interfacing with many standard microcontrollers, facilitating easier integration.
Commercial temperature grading ensures reliability in moderate environmental conditions, suitable for everyday applications.
CMOS technology offers lower power consumption, making it ideal for battery-powered applications.
Parallel interface allows for higher data throughput, appealing to high-performance applications.
J bend terminal form enhances mechanical stability when mounted to a PCB.
Flexible sector sizes accommodate varying application needs, optimizing both performance and memory usage.
The low maximum supply current of 60 mA indicates efficient power consumption, beneficial for energy-sensitive applications.
With 524,288 words of memory, it provides ample storage for various data applications.
An 8-bit memory width aligns well with common data sizes in modern computing, enhancing compatibility.
The 1.27 mm terminal pitch is standard for many components, ensuring compatibility with existing PCB designs.
Offering a memory code of 512K makes it versatile for applications such as firmware storage and configurations.
The presence of a command user interface simplifies user interaction and control over memory operations.
The ready/busy feature provides necessary status feedback, improving the efficiency of memory access and data management.
Operating up to 3.6V ensures compatibility with high-voltage systems while maintaining reliable performance.
A top boot block configuration allows for simpler firmware retrieval during system startup.
The high memory density of 4194304 bits is advantageous for applications requiring substantial storage capacity in a compact form.
As a flash memory IC, it allows for fast data retention and erasure, offering superiority over traditional memory technologies.
Extremely low standby current reduces power consumption when not in active use, ideal for energy-efficient applications.
A maximum access time of 11 ns ensures swift data retrieval, boosting overall system performance.
Flash Memory M50FLW040AK1T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
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M50FLW040AK1T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99WT1G
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
BAV99
Formosa Microsemi
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
Vishay Telefunken
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
LL4148-GS08
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CDSOT23-SM712
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
S29GL512P10TFIR10
Cypress Semiconductor
Cypress Semiconductor's S29GL512P10TFIR10 is a 512M NOR flash memory with 3.3V supply, operating from -40 to 85°C. Featuring asynchronous mode, it has a page size of 8/16 words and sector size of 128K words. Ideal for industrial applications requiring fast access times and high memory density.
W25Q32JVZPIQ
Winbond Electronics
W25Q32JVZPIQ by Winbond Electronics is a 33554432-bit FLASH memory IC with 4MX8 organization. It operates at up to 133 MHz clock frequency, suitable for industrial applications. With a small outline package and synchronous mode, it offers fast and reliable data storage solutions.
M25P16-VMW6G
Micron Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Maximum Seated Height: 2.5 mm;
S25FL256SAGMFI011
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SST39VF1601-70-4C-B3KE
SST39VF1601-70-4C-B3KE by Microchip Technology is a 16Mbit NOR flash memory with a rectangular package and a package style of grid array. It operates asynchronously at a nominal voltage of 3V and has a max operating temperature of 70°C. This flash memory is commonly used in applications that require high-density storage and fast access times.
AT45DB161E-SSHD2B-T
Silicon Labs
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
S25FL128SAGNFI011
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
SST39VF1601-70-4C-EKE
SST39VF1601-70-4C-EKE by Microchip is a 3V NOR flash memory with 1Mx16 organization, 512 sectors, and 2K sector size. It operates in asynchronous mode with a max access time of 70ns. Ideal for applications requiring high endurance, such as embedded systems and industrial automation.
AT25SF041B-SSHD-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
IS25LP256D-JLLE
Integrated Silicon Solution
IS25LP256D-JLLE by Integrated Silicon Solution is a 32MX8 NOR flash memory with 133 MHz clock frequency. Operating at -40 to 105 °C, it offers 100000 Write/Erase Cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact form factor.
AT45DB641E-MHN2B-T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
MT25QU512ABB1EW9-0SIT
Micron Technology's MT25QU512ABB1EW9-0SIT is a 512M NOR flash memory with 536870912-bit density. Operating at 166 MHz, it has a supply voltage range of 1.7V to 2V and temperature tolerance from -40°C to 85°C. Ideal for industrial applications requiring high-speed synchronous operation in small outline packages.
AT45DB641E-SHN-B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.29 mm;
IS21ES08G-JCLI-TR
IS21ES08G-JCLI-TR by Integrated Silicon Solution is an 8GX8 flash memory with 68719476736 bit density. Operating at 3.3V, it features a very thin profile grid array package and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed synchronous flash memory with parallel interface.
S29GL128S90TFI020
Infineon Technologies
S29GL128S90TFI020 by Infineon Technologies is a 16MX8 NAND flash memory with 128 sectors and 3-STATE output. Operating at 3V, it offers fast access time of 90ns for applications requiring high endurance of 100,000 Write/Erase cycles. With a compact design and low standby current of 0.0001A, it is ideal for space-constrained devices needing reliable non-volatile storage.
MX25L3233FM1I-08G
Macronix
Macronix MX25L3233FM1I-08G is a 32Mb NOR Flash Memory with SPI interface. It operates at 133MHz clock frequency, has 100K Write/Erase cycles endurance, and supports hardware/software write protection. Ideal for industrial applications requiring high-speed data storage in compact form factor.
MT25QU02GCBB8E12-0AAT
MT25QU02GCBB8E12-0AAT by Micron Technology is a 256MX8 flash memory with 166 MHz clock frequency, operating at 1.8V. It features a thin profile grid array package suitable for industrial applications requiring high-speed synchronous operation and reliable data storage in harsh environments.
AT25SF041-SSHD-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8;
MX25R6435FM2JL0
FLASH; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Programming Voltage (V): 1.8;
S25FL128LAGNFV010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M50FLW040AN5
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK5TG
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
M50FLW040AK1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 60 mA;
M50FLW040AN1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: TOP;
M50FLW040AN1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK5P
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Data Polling: NO;
M50FLW040AN5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
M50FLW040AK5TP
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AN1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512K;
M50FLW040AN1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M50FLW040AK5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AN1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
M50FLW040AK5T
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 8;
M50FLW040AK1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Sector Size (Words): 4K,64K;
M50FLW040AK1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
M50FLW040AK5
M50FLW040AN1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
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