Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M50FLW040AK5G from STMicroelectronics is a 4Mb NOR Flash memory with a synchronous operating mode and a supply voltage of 3.3V. It features an access time of 11 ns, operates b/w -20 °C to 85 °C, and comes in a compact chip carrier package. Ideal for embedded applications requiring fast data storage and retrieval.
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Vyrian
Digiode
Anansix
IDEA Electronic Components Group
$2.839
$2.555
MKK Technologies
$5.339
DigiPath Technology Company
AZTECH Wire
$13.160
Authorized Procurement Solutions
QUARKTWIN TECHNOLOGY LTD
A-Z Elektronik GmbH
Metaverse IC Inc.
Corphita
Kepictronics
Alle Elektronik GmbH
Parana Technologies
$3.395
Assy Fe
Microchip USA
Plastic/epoxy materials provide robust protection against environmental factors, enhancing durability.
Surface mount technology allows for a compact design, enabling higher density in circuit boards.
Rectangular packaging facilitates efficient use of space on PCB, optimizing layout design.
Synchronous operation enables faster data access and improved overall performance.
Operating at 3.3V provides compatibility with a wide range of systems, ensuring flexibility.
Using a 3.3V supply reduces power consumption, enhancing energy efficiency.
Shorter signal paths with more terminals improve data integrity and signal quality.
Chip carrier style offers better thermal performance and facilitates easy mounting.
Operating at elevated temperatures ensures reliability in demanding environments.
512Kx8 organization allows for efficient memory addressing and management.
Low temperature operation expands the range of applications in various environments.
Multiple sectors offer flexibility in memory management and data allocation.
Matte tin finish provides excellent solderability and corrosion resistance.
Quad terminal positioning optimizes space and ensures stable connections on the PCB.
Compact seated height aids in the design of low-profile devices.
Narrow width enhances compatibility with various electronic designs.
Support for a minimum supply voltage of 3V increases versatility in power supply requirements.
NOR type architecture allows for faster read times and random access, beneficial for many applications.
The optimal length allows for integration into compact designs without sacrificing performance.
A programming voltage of 3V simplifies interfacing with most microcontrollers.
CMOS technology ensures low power consumption and high integration density.
Parallel communication enables faster data throughput, enhancing overall performance.
J bend terminals provide secure installation and reliable connections.
Low supply current minimizes device heating and energy usage, making it eco-friendly.
A capacity of 524288 words allows for significant data storage, suitable for various applications.
8-bit memory width supports efficient data handling and interface with microcontrollers.
1.27 mm terminal pitch is standard for many circuit designs, simplifying compatibility.
512K word capacity supports substantial data requirements for embedded applications.
User-friendly command interface simplifies integration into various systems.
This feature allows the system to monitor memory status effectively, ensuring data integrity.
Supporting a maximum voltage of 3.6V ensures compatibility with a wide array of devices.
High memory density provides ample storage for complex applications and systems.
Flash type memory offers quick data writing and erasing capabilities, enhancing performance.
Extremely low standby current prolongs battery life in portable applications.
Fast access time of 11 ns enhances speed in data retrieval, improving system responsiveness.
Flash Memory M50FLW040AK5G attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
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Data Polling:
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Power Supplies (V):
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Ready or Busy:
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M50FLW040AK5G Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Packaging - Standard Pkg Label Chg 20/Feb/2019
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Vishay Sprague
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
FDV303N
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
Hy Electronic
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LM358MX
Onsemi
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Vicor
S71WS256PC0HH3YR0
Spansion
FLASH; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA84,10X12,32;
AT45DB041E-SHN-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
S25FL128SAGNFI001
Infineon Technologies
S25FL128SAGNFI001 by Infineon Technologies is a NOR type flash memory with 32Mx4 organization, operating at up to 133MHz clock frequency. It offers 100000 write/erase cycles and supports SPI serial bus type, making it ideal for industrial applications requiring high endurance and fast data transfer speeds.
W25Q16JLSNIG
Winbond Electronics
W25Q16JLSNIG by Winbond Electronics is a 16Mb flash memory IC with synchronous operation, 104 MHz clock frequency, and 2.7-3.6V supply voltage range. It is ideal for industrial applications requiring high-speed data storage in a compact small outline package.
S29GL064S70TFI040
Infineon's S29GL064S70TFI040 is an 8MX8 flash memory with a memory density of 67108864 bit. Operating at 3V, it offers a max access time of 70 ns and operates in industrial temperature grades. This parallel memory chip is suitable for applications requiring high-speed data storage and retrieval in harsh environments.
S25FL128SAGMFIG01
S25FL128SAGMFIG01 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type, and 100000 write/erase cycles. It is ideal for industrial applications requiring high-speed data storage in small outline packages.
S29AL008J70TFI020
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
S29GL512P10TFIR10
Cypress Semiconductor's S29GL512P10TFIR10 is a 512M NOR flash memory with 3.3V supply, operating from -40 to 85°C. Featuring asynchronous mode, it has a page size of 8/16 words and sector size of 128K words. Ideal for industrial applications requiring fast access times and high memory density.
AT45DB641E-MHN-Y
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1;
S29GL256P90TFIR20
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HTSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
AT45DB081D-SSU
Atmel
Atmel's AT45DB081D-SSU is a 8Mx1 NOR type Flash Memory with SPI serial bus, offering 8388608 bit memory density. It operates at 3V, supports up to 66MHz clock frequency, and has a max endurance of 100K Write/Erase cycles. Ideal for industrial applications requiring reliable non-volatile data storage.
S25FL128LAGMFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Type: NOR TYPE;
SST25VF016B-50-4C-QAF
Microchip Technology
SST25VF016B-50-4C-QAF by Microchip is a 16Mx1 NOR type flash memory with 3V/3.3V supply, 50MHz clock frequency, and SPI serial bus for applications requiring high-speed data storage in small outline packages. Operating at temperatures from 0 to 70°C, it offers software write protection and endurance of 100k cycles.
MT25QU256ABA8E12-1SIT
Micron Technology
Micron Technology's MT25QU256ABA8E12-1SIT is a 256MX1 flash memory IC with 268M words capacity. Operating at 166 MHz, it has a thin profile grid array package suitable for industrial applications. With synchronous operation and serial interface, this CMOS technology chip operates b/w -40 to 85 °C, making it ideal for high-speed data storage needs.
S71WS256PC0HH3YR0 by Infineon Technologies is a 16MX16 flash memory with synchronous operation. It has a package style of GRID ARRAY, THIN PROFILE, FINE PITCH and can operate in temperatures ranging from -25 to 85 °C. This memory IC is commonly used in applications requiring high-density storage and fast access times.
S25FL128SAGMFI011
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
SDSDQAF3-064G-I
Western Digital
SDSDQAF3-064G-I by Western Digital is a Flash Memory chip with 64GX8 organization and MLC NAND type technology. It operates in ASYNCHRONOUS mode, has a memory density of 549755813888 bit, and can withstand temperatures from -25 to 85 °C. Ideal for applications requiring high-speed data storage in compact devices.
S25FL512SAGBHI210
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 8 mm;
MT29F2G01ABAGDWB-IT:GTR
FLASH; Programming Voltage (V): 3.3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Type: SLC NAND TYPE;
SST39VF020-70-4I-WHE
SST39VF020-70-4I-WHE by Microchip: 256KX8 NOR Flash Memory with 3V supply, 70ns access time, and 100k Write/Erase cycles. Ideal for industrial applications requiring high-speed data storage in a compact package. Operates asynchronously with 32 terminals in a small outline, thin profile design.
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M50FLW040AN5
STMicroelectronics
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK5TG
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
M50FLW040AK1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 60 mA;
M50FLW040AN1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: TOP;
M50FLW040AN1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK5P
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Data Polling: NO;
M50FLW040AN5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
M50FLW040AK5TP
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AN1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512K;
M50FLW040AN1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M50FLW040AN1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
M50FLW040AK1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Position: QUAD;
M50FLW040AK5T
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 8;
M50FLW040AK1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Sector Size (Words): 4K,64K;
M50FLW040AK1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
M50FLW040AK5
M50FLW040AN1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
Supply Digital Components
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12,000 In-Stock
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