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M50FLW040AK5P

STMicroelectronics

M50FLW040AK5P by STMicroelectronics

M50FLW040AK5P from STMicroelectronics is a 4Mb NOR Flash memory with a synchronous operating mode and a supply voltage of 3.3V. It features an access time of 11 ns, operates in temperatures from -20 °C to 85 °C, and comes in a compact chip carrier package. Ideal for embedded applications, it offers reliable data storage with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,125 parts In-Stock

1+ parts

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100+ parts

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1,125

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Vyrian

USA . 1,122 parts In-Stock

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1k+ parts

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1,122

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Digiode

USA . 271 parts In-Stock

1+ parts

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271

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,794 parts In-Stock

1+ parts

$5.295

100+ parts

-

1k+ parts

$4.765

10k+ parts

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1,794

$5.295

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$4.765

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MKK Technologies

India . 1,883 parts In-Stock

1+ parts

$9.956

100+ parts

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10k+ parts

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1,883

$9.956

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DigiPath Technology Company

USA . 1,883 parts In-Stock

1+ parts

$9.956

100+ parts

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10k+ parts

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1,883

$9.956

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Parana Technologies

USA . 1,690 parts In-Stock

1+ parts

-

100+ parts

$6.330

1k+ parts

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1,690

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$6.330

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Corphita

USA . 1,124 parts In-Stock

1+ parts

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1,124

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Overview

Unlock limitless possibilities with the M50FLW040AK5P Flash Memory from STMicroelectronics! This high-performance component ensures reliability and efficiency, making it perfect for a variety of applications—from consumer electronics to industrial devices. With its robust design and advanced technology, customers benefit from swift data access, energy efficiency, and exceptional durability. Trust in STMicroelectronics for top-notch quality and innovation that propels your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental stress, making this product reliable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration into compact electronic designs, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, facilitating efficient layout design and assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Designed to operate at a nominal voltage of 3.3V, this product is compatible with most modern digital circuits, ensuring seamless integration.

Power Supplies (V): 3.3

Single power supply requirement simplifies the design and reduces the overall component count in electronic devices.

No. of Terminals: 32

With 32 terminals, this chip offers a balance between complexity and capability, enabling adequate connectivity for a variety of applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides enhanced thermal performance and reliability, making it suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

The ability to operate at elevated temperatures ensures reliability in demanding environments such as automotive and industrial applications.

Organization: 512KX8

This memory organization provides a good balance of capacity and accessibility, allowing for efficient data retrieval and storage.

Minimum Operating Temperature: -20 °C

Operating in low temperatures makes this product versatile for use in both indoor and outdoor applications without compromising performance.

No. of Sectors/Size: 8

Having 8 sectors allows for organized data management and efficient memory utilization, which is beneficial for applications requiring structured storage.

Terminal Finish: MATTE TIN

Matte tin finish offers excellent solderability and resistance to corrosion, ensuring long-term reliability and stability in electronic assemblies.

Terminal Position: QUAD

Quad-terminal positioning enhances electrical performance by reducing inductance, which helps in achieving faster signal integrity.

Maximum Seated Height: 3.56 mm

Compact height allows for streamlined designs, making it easier to fit into space-restricted applications.

Width: 11.43 mm

Optimized width allows for high-density designs, enabling efficient use of PCB space.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum voltage of just 3V provides flexibility in various power supply designs, increasing compatibility with a wider range of devices.

Type: NOR TYPE

NOR type memory provides fast random access times, making it ideal for applications that require frequent read operations.

Length: 13.97 mm

The compact length contributes to its suitability for modern electronics, supporting efficient layout on circuit boards.

Programming Voltage (V): 3

A programming voltage of 3V aligns with standard digital logic levels, facilitating ease of use in various circuits.

Technology: CMOS

CMOS technology ensures low power consumption, enhancing overall system efficiency and increasing battery life in portable devices.

Parallel or Serial: PARALLEL

Parallel data transfer allows for higher data throughput, which is essential for applications requiring fast memory access.

Terminal Form: J BEND

J bend terminals ensure a secure connection during soldering, enhancing the reliability of the device once mounted.

Maximum Supply Current: 60 mA

The manageable maximum current requirement means it can perform effectively without excessive power load, ideal for efficient designs.

No. of Words: 524288 words

With the capability to store 524288 words, this memory provides ample storage for various applications, from consumer electronics to industrial systems.

Memory Width: 8

An 8-bit memory width balances performance and design simplicity, making it suitable for many embedded applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB layouts, easing design and assembly processes.

No. of Words Code: 512K

With a capacity of 512K words, this flash memory provides sufficient space for a variety of data storage applications.

Command User Interface: YES

The inclusion of a command user interface makes it easier for developers to integrate and control memory functions effectively.

Ready or Busy: YES

The ready or busy function enhances data integrity during operations, ensuring that the system can manage read/write statuses efficiently.

Maximum Supply Voltage (Vsup): 3.6 V

The capability to operate at a maximum of 3.6V provides flexibility in powering the device without risk of damage, making it versatile for various applications.

Memory Density: 4194304 bit

Having a memory density of 4194304 bits ensures ample storage efficacy, catering well to high-capacity application needs.

Memory IC Type: FLASH

As a FLASH memory IC, it allows for non-volatile storage, retaining data even when powered off, ideal for numerous applications where data persistence is crucial.

Maximum Standby Current: 0.0001 Amp

The extremely low standby current signifies efficient energy usage, making this device suitable for battery-operated devices to extend battery life.

Maximum Access Time: 11 ns

Fast access time of 11 ns ensures rapid data retrieval, making this memory an excellent choice for high-performance applications.

Technical Specifications

Flash Memory M50FLW040AK5P attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M50FLW040AK5P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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