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M50FLW040AK1

STMicroelectronics

M50FLW040AK1 by STMicroelectronics

M50FLW040AK1 from STMicroelectronics is a 4Mbit NOR Flash memory with a synchronous operating mode and a supply voltage of 3.3V. It features a fast access time of 11ns, operates in temperatures from 0 °C to 70 °C, and comes in a compact chip carrier package. Ideal for embedded applications, it offers reliable data storage with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,391 parts In-Stock

1+ parts

-

100+ parts

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2,391

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Digiode

USA . 1,088 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,088

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Vyrian

USA . 1,014 parts In-Stock

1+ parts

-

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1,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,810 parts In-Stock

1+ parts

$4.494

100+ parts

-

1k+ parts

$4.045

10k+ parts

-

1,810

$4.494

-

$4.045

-

MKK Technologies

India . 2,175 parts In-Stock

1+ parts

$8.451

100+ parts

-

1k+ parts

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10k+ parts

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2,175

$8.451

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DigiPath Technology Company

USA . 2,175 parts In-Stock

1+ parts

$8.451

100+ parts

-

1k+ parts

-

10k+ parts

-

2,175

$8.451

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Corphita

USA . 3,586 parts In-Stock

1+ parts

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3,586

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Parana Technologies

USA . 812 parts In-Stock

1+ parts

-

100+ parts

$5.374

1k+ parts

-

10k+ parts

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812

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$5.374

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Overview

Elevate your projects with the M50FLW040AK1 flash memory from STMicroelectronics, a trusted leader in innovation. This high-performance NOR flash solution delivers exceptional speed and efficiency, ideal for demanding applications such as automotive, industrial control, and consumer electronics. Enjoy seamless data management, enhanced reliability, and energy savings, making it the perfect choice to unlock your designs’ full potential while benefiting from ST's commitment to quality and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable yet lightweight, ensuring long-lasting performance in various applications.

Surface Mount: YES

Enables compact design and efficient use of PCB space, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

Standard shape allows for easy integration with existing designs and equipment.

Operating Mode: SYNCHRONOUS

Provides faster data access and improved performance compared to asynchronous modes.

Nominal Supply Voltage / Vsup (V): 3.3

Low power consumption aligns with energy-efficient designs, contributing to overall device longevity.

Power Supplies (V): 3.3

Standard voltage requirement simplifies power supply design for embedded systems.

No. of Terminals: 32

Adequate connections for robust functionality while maintaining a compact footprint.

Package Style (Meter): CHIP CARRIER

Facilitates easy handling and mounting, enhancing production efficiency.

Maximum Operating Temperature: 70 °C

Suitable for commercial applications where moderate heat is expected, ensuring reliability.

Organization: 512KX8

Design supports efficient data structure and memory management for applications.

Minimum Operating Temperature: 0 °C

Versatile operation in a range of environments, suitable for various consumer electronics.

No. of Sectors/Size: 48,5

Provides adequate segmentation for organizing data, improving data management and performance.

Terminal Finish: TIN LEAD

Offers good solderability for reliable connections, enhancing long-term durability.

Terminal Position: QUAD

Ensures proper alignment and connection for high-performance integration into devices.

Maximum Seated Height: 3.56 mm

Compact height profile fits well in space-constrained designs.

Width: 11.43 mm

Narrow profile supports high-density PCB layouts, ideal for miniaturized applications.

Minimum Supply Voltage (Vsup): 3 V

Provides flexibility in supply configurations, ensuring compatibility with a variety of circuits.

Type: NOR TYPE

Enables fast random access to memory, ideal for execute-in-place applications.

Length: 13.97 mm

Compact size aids in design scalability for various electronic products.

Programming Voltage (V): 3

Simplifies programming requirements, making it user-friendly for developers.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, balancing performance and cost effectively.

Technology: CMOS

Supports low power consumption and high-speed operation, enhancing overall efficiency.

Parallel or Serial: PARALLEL

Facilitates faster data transfer rates, benefiting applications requiring high-speed data access.

Terminal Form: J BEND

Allows for easy insertion into PCBs, enhancing assembly efficiency.

Sector Size (Words): 4K,64K

Flexible sector sizes support various use cases, making it adaptable for different applications.

Maximum Supply Current: 60 mA

Low maximum current draw improves energy efficiency especially in battery-operated devices.

No. of Words: 524288 words

Provides substantial memory capacity for storing applications and data, suitable for diverse uses.

Memory Width: 8

8-bit architecture simplifies data handling and processing, improving performance.

Terminal Pitch: 1.27 mm

Standard pitch facilitates compatibility with various PCB designs for easy integration.

No. of Words Code: 512K

Indicates generous data storage capacity, supporting intensive applications.

Command User Interface: YES

User-friendly command set simplifies integration and development processes for engineers.

Ready or Busy: YES

Clear status indication streamlines operations and helps in efficient error handling.

Maximum Supply Voltage (Vsup): 3.6 V

Flexibility in power supply options allows for compatibility with various system designs.

Boot Block: TOP

Facilitates booting processes in embedded systems, providing quick device start-up.

Memory Density: 4194304 bit

High memory density supports complex applications, ideal for advanced computing needs.

Memory IC Type: FLASH

Non-volatile storage ensures data retention in power-off conditions, enhancing data safety.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current minimizes energy consumption in idle states, prolonging battery life.

Maximum Access Time: 11 ns

Fast access times ensure quick data retrieval, enhancing system responsiveness and performance.

Technical Specifications

Flash Memory M50FLW040AK1 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

48,5

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

3.56 mm

Sector Size (Words):

4K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M50FLW040AK1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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