Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M50FLW040AK5T from STMicroelectronics is a 4Mbit NOR Flash memory with a 3.3V supply, featuring a fast access time of 11 ns. It operates in synchronous mode and supports parallel interface for efficient data transfer. Ideal for embedded applications, it offers robust performance across -20 °C to 85 °C.
Median Price
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Vyrian
1+ parts
100+ parts
1k+ parts
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Anansix
Digiode
IDEA Electronic Components Group
$3.254
$2.929
MKK Technologies
$6.119
DigiPath Technology Company
Corphita
Parana Technologies
$3.891
This durable material ensures protection from environmental factors, making the product suitable for various applications.
Surface mount capability allows for a compact design, ideal for modern electronic devices with space constraints.
The rectangular shape facilitates efficient board layout and soldering processes.
Synchronous operation provides higher data transfer rates, enhancing performance in high-speed applications.
The standard 3.3V operation is compatible with most modern electronic circuits and microcontrollers.
Uniform power supply requirements ensure ease of integration into existing systems.
With 32 terminals, this memory chip can easily integrate into various circuit designs while providing multiple connections.
Chip carrier packaging offers robustness and good thermal performance, making it suitable for high-reliability applications.
High operating temperature capability ensures reliability and performance in demanding environments.
The organization provides a balanced structure for both read and write operations, optimizing efficiency.
This wide temperature range enables operation in a variety of environments, from cold to warm applications.
A higher number of sectors allows for better management of data, making it convenient for various applications.
The tin-lead finish ensures reliable solderability and durability, contributing to longevity and performance.
Quad terminal position offers flexibility in layout design, allowing for optimal circuit integration.
A low profile contributes to space-saving designs in applications where height is a constraint.
A compact width fits well into tight spaces on PCB layouts, ideal for miniaturized electronics.
The range of supply voltage allows for compatibility with a variety of power sources.
NOR flash memory is well-suited for applications requiring high-speed random access and efficient reading.
The overall dimensions contribute to a compact form factor that is essential for small devices.
The low programming voltage minimizes power consumption and enhances the device's reliability.
CMOS technology offers low power consumption and high speed, making this product energy-efficient.
Parallel data access enables faster reading and writing speeds, enhancing overall device performance.
J-bend terminals facilitate easier handling and soldering during assembly, improving the production process.
Flexible sector sizes allow for optimal data organization depending on application needs.
Reasonable current requirements ensure low power consumption, extending battery life in portable devices.
A large word count enhances storage capacity, catering to complex applications needing substantial memory.
An 8-bit width is generally compatible with a variety of microcontrollers, making integration simpler.
Standard pitch allows for compatibility with commonly used PCBs and components.
The capacity of 512K words provides ample space for firmware and data storage in embedded applications.
A command user interface simplifies interaction with the memory, enhancing programming capabilities.
A ready/busy signal indicates the status of the device, facilitating better control in multi-tasking systems.
This extended voltage capability allows for flexibility in power supply choices, ensuring compatibility.
A top boot block enables efficient firmware storage and retrieval, making device updates more manageable.
High memory density supports demanding applications, providing significant space for data storage in compact form.
Flash memory allows for greater data retention and faster erase times, crucial for modern applications.
A very low standby current ensures energy efficiency, particularly important for battery-powered devices.
Fast access time provides rapid response and high performance, which enhances the user experience in real-time applications.
Flash Memory M50FLW040AK5T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
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Ready or Busy:
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M50FLW040AK5T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317BD2TG
Onsemi
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
New Jersey Semiconductor Products
Mde Semiconductor
Formosa Microsemi
MT25QU256ABA8E12-1SIT/TR
Micron Technology
FLASH; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Programming Voltage (V): 1.8;
AT25SF041B-SSHD-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
M25P40-VMN6TPB
Numonyx
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
SST39SF040-70-4C-PHE
Silicon Storage Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
S25FL256SAGMFI003
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
S29GL064S70BHI040
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 4MX16;
S29GL032N90TFI040
Infineon Technologies
S29GL032N90TFI040 by Infineon Technologies is a 32Mb NOR flash memory with 2MX16 organization, operating at 3V. It features an industrial temperature grade, parallel interface, and offers fast access time of 90ns. Ideal for applications requiring high-speed data storage in harsh environments.
S29JL032J70TFI310
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
S25FL128SAGNFI003
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SDINBDG4-16G-XI1
Sandisk
FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 137438953472 bit; Programming Voltage (V): 3.3;
MT29F16G08ABACAWP-ITZ:C
MT29F16G08ABACAWP-ITZ:C by Micron Technology is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85 °C. It has a memory density of 17179869184 bit and is suitable for industrial applications requiring reliable, high-speed data storage in compact devices.
S25FL064LABNFI040
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE;
S25FL128LAGMFV010
S25FL128LAGMFV010 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus, and 100000 write/erase cycles. It operates at -40 to 105 °C, suitable for industrial applications requiring high endurance and fast data transfer. The small outline package with dual terminals and hardware/software write protection makes it ideal for compact electronic devices.
W25Q256JVEIM
Winbond Electronics
Winbond Electronics' W25Q256JVEIM is a NOR type Flash Memory with 32MX8 organization, SPI serial bus type, and 133 MHz clock frequency. Ideal for industrial applications, it offers 100000 write/erase cycles endurance and operates at temperatures ranging from -40 to 85 °C.
SDINBDG4-16G-I1
FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; No. of Words Code: 16G;
AT45DB081E-SSHN-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 4.925 mm;
S25FL127SABMFI101
S25FL127SABMFI101 by Infineon Technologies is a NOR type flash memory with a capacity of 16MX8 and a memory density of 134217728 bits. It operates in synchronous mode with a max clock frequency of 108 MHz and has a min data retention time of 20 years. This flash memory is commonly used in industrial applications requiring high endurance and reliable data storage.
S29AL016J70TFI010
S29AL016J70TFI010 by Infineon Technologies is a 1MX16 NOR flash memory with 3V supply, operating from -40 to 85°C. It features asynchronous mode, 70ns access time, and 30mA max supply current. Ideal for industrial applications requiring fast data access and reliable non-volatile storage in a compact form factor.
MT29F2G08ABAGAWP-IT:G
Micron Technology's MT29F2G08ABAGAWP-IT:G is an industrial-grade SLC NAND flash memory with 256Mx8 organization, operating from -40 to 85°C. It offers a memory density of 2147483648 bits and operates in asynchronous mode. Ideal for applications requiring high reliability and performance in harsh environments.
S29GL128P90FFIR20
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 110 mA;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M50FLW040AN5
STMicroelectronics
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK5TG
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
M50FLW040AK1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 60 mA;
M50FLW040AN1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: TOP;
M50FLW040AN1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK5P
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Data Polling: NO;
M50FLW040AN5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
M50FLW040AK5TP
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AN1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512K;
M50FLW040AN1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M50FLW040AK5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AN1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
M50FLW040AK1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Position: QUAD;
M50FLW040AK1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Sector Size (Words): 4K,64K;
M50FLW040AK1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
M50FLW040AK5
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 8;
M50FLW040AN1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
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