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M50FLW040AK1TP

STMicroelectronics

M50FLW040AK1TP by STMicroelectronics

M50FLW040AK1TP from STMicroelectronics is a 4Mbit NOR Flash memory with a 3.3V supply, featuring a fast access time of 11 ns. It operates in synchronous mode and supports parallel interface for efficient data transfer. Ideal for embedded applications, it offers robust performance in commercial temperature ranges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,008 parts In-Stock

1+ parts

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4,008

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Digiode

USA . 1,878 parts In-Stock

1+ parts

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1,878

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Anansix

USA . 952 parts In-Stock

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952

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,132 parts In-Stock

1+ parts

$5.110

100+ parts

-

1k+ parts

$4.599

10k+ parts

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1,132

$5.110

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$4.599

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MKK Technologies

India . 671 parts In-Stock

1+ parts

$9.608

100+ parts

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671

$9.608

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DigiPath Technology Company

USA . 671 parts In-Stock

1+ parts

$9.608

100+ parts

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671

$9.608

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Parana Technologies

USA . 172 parts In-Stock

1+ parts

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$6.109

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172

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$6.109

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Corphita

USA . 125 parts In-Stock

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125

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Overview

Elevate your designs with the M50FLW040AK1TP from STMicroelectronics, a trusted leader in semiconductor technology. This high-performance flash memory solution is perfect for applications demanding reliability and speed, offering seamless data access with its synchronous operation. With ST's commitment to quality, you can trust this component to enhance efficiency while reducing power consumption, providing exceptional value for your projects across various industries. Experience innovation at its best!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for compact design and enhances the device's performance in high-density applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on circuit boards, facilitating easier integration into various applications.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates, resulting in enhanced performance for applications requiring fast access speeds.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V makes this flash memory compatible with most modern electronic systems, ensuring broad applicability.

Power Supplies (V): 3.3

Operating at 3.3V contributes to lower power consumption and heat generation, ideal for energy-efficient designs.

No. of Terminals: 32

Having 32 terminals allows for a compact arrangement while providing sufficient connections for integration into various projects.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances thermal performance and electrical characteristics, catering to high-performance applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this device is suitable for a wide range of environmental conditions, ensuring consistent performance.

Organization: 512KX8

The memory organization of 512KX8 ensures ample capacity for diverse applications, offering flexibility in data storage.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C guarantees functionality in typical indoor environments, making it versatile for various applications.

No. of Sectors/Size: 48,5

Having multiple sectors allows for better data management and flexibility in memory allocation for complex applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and ensures reliable connections, which is crucial for robust performance.

Terminal Position: QUAD

Quad terminal positioning facilitates better electrical connections and minimizes signal integrity issues, enhancing overall reliability.

Maximum Seated Height: 3.56 mm

A low maximum seated height allows for a compact design, which is beneficial for space-sensitive applications.

Width: 11.43 mm

A width of 11.43 mm provides a balance between density and board layout flexibility for integration into various circuit designs.

Minimum Supply Voltage (Vsup): 3 V

The capability to operate at a minimum voltage of 3V allows for compatibility with low-power circuits, enhancing overall design versatility.

Type: NOR TYPE

As a NOR type memory, it offers random access capabilities, making it suitable for applications requiring quick data retrieval.

Length: 13.97 mm

The compact length of 13.97 mm enhances layout options on PCBs, facilitating easier integration in tight spaces.

Programming Voltage (V): 3

A programming voltage of 3V makes the device easy to integrate within standard voltage systems, enhancing compatibility.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures stable performance in typical usage scenarios, enhancing reliability.

Technology: CMOS

CMOS technology allows for lower power operation, making this flash memory suitable for battery-powered applications.

Parallel or Serial: PARALLEL

Parallel interface provides higher data throughput, making this device suitable for applications demanding high-speed data access.

Terminal Form: J BEND

J bend terminal form enhances PCB mounting strength and solder connection reliability, ensuring durability in the assembly.

Sector Size (Words): 4K,64K

Offering multiple sector sizes provides flexibility in memory management, accommodating various application needs.

Maximum Supply Current: 60 mA

A maximum supply current of 60 mA enables powerful performance while keeping power usage manageable for most applications.

No. of Words: 524288 words

With 524288 words, this flash memory provides substantial data storage capacity to meet the requirements of modern applications.

Memory Width: 8

An 8-bit memory width ensures compatibility with a wide range of data bus architectures, enhancing integration options.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easier soldering, improving manufacturability and assembly efficiency.

No. of Words Code: 512K

The memory configuration of 512K words enhances storage capacity, catering to applications with substantial data needs.

Command User Interface: YES

The presence of a command user interface facilitates straightforward data access and control, improving usability in complex systems.

Ready or Busy: YES

The 'Ready or Busy' feature enhances system reliability by allowing the host to know the operational status of the memory device.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V confirms that the device can operate safely within standard voltage limits, ensuring reliability.

Boot Block: TOP

A top boot block configuration allows for quick access to boot code, supporting efficient system startup processes.

Memory Density: 4194304 bit

With a memory density of 4194304 bits, this device offers large storage potential suitable for diverse applications.

Memory IC Type: FLASH

As a FLASH memory IC, it provides non-volatile storage, ensuring data persistence even when power is disconnected.

Maximum Standby Current: 0.0001 Amp

A very low maximum standby current minimizes power consumption in idle states, increasing overall energy efficiency.

Maximum Access Time: 11 ns

An access time of 11 ns ensures rapid data retrieval, making this memory suitable for high-speed applications.

Technical Specifications

Flash Memory M50FLW040AK1TP attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

48,5

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

3.56 mm

Sector Size (Words):

4K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

NO

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M50FLW040AK1TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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