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M50FLW040AN1

STMicroelectronics

M50FLW040AN1 by STMicroelectronics

M50FLW040AN1 from STMicroelectronics is a 4Mbit NOR Flash memory with a 3.3V supply, featuring a fast access time of 11 ns and operating in synchronous mode. It comes in a compact SOIC package, ideal for embedded applications. With 48 sectors and dual terminals, it ensures efficient data management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,430 parts In-Stock

1+ parts

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3,430

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Digiode

USA . 2,847 parts In-Stock

1+ parts

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1k+ parts

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2,847

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Anansix

USA . 458 parts In-Stock

1+ parts

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458

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,082 parts In-Stock

1+ parts

$2.518

100+ parts

-

1k+ parts

$2.266

10k+ parts

-

2,082

$2.518

-

$2.266

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MKK Technologies

India . 1,224 parts In-Stock

1+ parts

$4.735

100+ parts

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10k+ parts

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1,224

$4.735

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DigiPath Technology Company

USA . 1,224 parts In-Stock

1+ parts

$4.735

100+ parts

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1,224

$4.735

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Corphita

USA . 4,162 parts In-Stock

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4,162

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Parana Technologies

USA . 1,450 parts In-Stock

1+ parts

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100+ parts

$3.011

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1,450

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$3.011

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Overview

Elevate your designs with the M50FLW040AN1 flash memory from STMicroelectronics, a leader in innovation and reliability. This compact, high-performance NOR flash memory offers exceptional speed and low power consumption, perfect for diverse applications from automotive to consumer electronics. Its robust packaging ensures durability, while ST’s commitment to quality guarantees consistent performance. Choose M50FLW040AN1 for superior efficiency and peace of mind in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials help ensure reliability in various applications.

Surface Mount: YES

Designed for surface mounting, making it easier to integrate into compact PCB designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster performance and improved data transfer rates.

Nominal Supply Voltage / Vsup (V): 3.3

Standard supply voltage, compatible with most modern electronic systems.

Power Supplies (V): 3.3

Eliminates the need for additional power supply components, streamlining design.

No. of Terminals: 40

Ample terminal count allows for flexible connections and functions in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

Suitable for a wide range of operating environments, enhancing product versatility.

Organization: 512KX8

High organization capacity provides significant storage for various applications.

Minimum Operating Temperature: 0 °C

Allows operation in a variety of environments, enhancing overall usability.

No. of Sectors/Size: 48,5

Segmented memory structure facilitates better data management and organization.

Terminal Finish: TIN LEAD

Proven finish enhances solderability and durability of connections.

Terminal Position: DUAL

Offers flexibility in design allowing for various mounting configurations.

Maximum Seated Height: 1.2 mm

Low profile design enables it to fit into compact and slim devices.

Width: 10 mm

Narrow width is suited for multi-device setups in tight spaces.

Minimum Supply Voltage (Vsup): 3 V

ACapable of operating at lower voltages enhances compatibility across devices.

Type: NOR TYPE

NOR flash is known for fast read speeds and efficient random access.

Length: 18.4 mm

Compact length aids in fitting into smaller electronic designs.

Programming Voltage (V): 3

Standard programming voltage simplifies integration into existing systems.

Temperature Grade: COMMERCIAL

Commercial grade ensures reliability for general-purpose applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration capability.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer rates compared to serial.

Terminal Form: GULL WING

Gull wing form optimizes solder joint reliability in surface-mount applications.

Sector Size (Words): 4K,64K

Varied sector sizes provide flexibility for different memory usage patterns.

Maximum Supply Current: 60 mA

Moderate current requirement improves power efficiency for battery-operated devices.

No. of Words: 524288 words

Substantial word count supports a wide range of applications and data storage needs.

Memory Width: 8

Byte-wide access expedites data retrieval, enhancing read performance.

Terminal Pitch: 0.5 mm

Fine pitch allows for dense packing of memory chips on PCBs, saving space.

No. of Words Code: 512K

High capacity provides flexibility for various applications requiring extensive data storage.

Command User Interface: YES

User-friendly interface simplifies programming and data operations.

Ready or Busy: YES

Indicates the readiness of the memory, enhancing operational management.

Maximum Supply Voltage (Vsup): 3.6 V

Ensures stable operation under slightly higher voltage conditions.

Boot Block: TOP

Boot block configuration allows quick access for system startup routines.

Memory Density: 4194304 bit

High density supports complex applications needing substantial storage.

Memory IC Type: FLASH

Flash memory technology suitable for extensive rewritability and storage.

Maximum Standby Current: 0.0001 Amp

Very low standby current enhances energy efficiency in idle states.

Maximum Access Time: 11 ns

Rapid access time improves overall system performance, especially in high-speed applications.

Technical Specifications

Flash Memory M50FLW040AN1 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G40

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

48,5

No. of Terminals:

40

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP40,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M50FLW040AN1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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