Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M50FLW040AK5 from STMicroelectronics is a 512Kx8 NOR Flash memory with a synchronous operating mode, ideal for embedded applications. It operates at 3.3V, features a max access time of 11ns, and supports temperatures from -20 °C to 85 °C. This compact chip carrier design ensures efficient performance in various electronic devices.
Median Price
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4
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Anansix
1+ parts
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Vyrian
Digiode
Quantum Digital Technology
IDEA Electronic Components Group
$4.136
$3.723
MKK Technologies
$7.778
DigiPath Technology Company
A-Z Elektronik GmbH
Corphita
Alle Elektronik GmbH
Parana Technologies
$4.946
The use of durable plastic/epoxy material ensures reliability and protection against environmental factors.
Surface mount technology allows for compact design and efficient use of PCB space.
The rectangular shape contributes to easy integration into various applications and PCB layouts.
Synchronous operation improves data transfer speed and efficiency.
Compatible with standard voltage levels, ideal for a range of applications.
Optimized for low power consumption, enhancing battery life for portable devices.
A sufficient number of terminals provides good connectivity options for various implementations.
Chip carrier style aids in thermal management and ease of assembly.
High temperature tolerance makes it suitable for robust applications.
The 512Kx8 organization provides a significant amount of data storage for diverse applications.
Wide temperature range allows for operation in harsh environments.
Flexible sector organization supports efficient memory management.
Tin lead finish ensures good solderability and reliability in connections.
Quad terminal position provides enhanced signal integrity and lower inductance.
Low profile minimizes space requirements in design, allowing for more compact devices.
Compact width facilitates easier integration into various form factors.
The ability to operate at lower voltages is beneficial for battery powered applications.
NOR type allows for faster random access to memory, making it suitable for code storage.
Compact length aids in fitting more components in tighter spaces.
Standard programming voltage supports compatibility with common programming interfaces.
CMOS technology enhances performance and reduces power consumption.
Parallel access improves data read/write speeds and overall device performance.
J-bend terminal form provides ease of integration and improves handling during assembly.
Varied sector sizes allow for efficient memory use tailored to application needs.
Moderate supply current ensures compatibility with low power designs.
The large word count offers ample storage capacity for applications requiring significant memory.
8-bit memory width is suitable for standard data processing in various applications.
Standard terminal pitch simplifies PCB design and component placement.
512K words of memory capacity allows for storage of substantial data sets.
User-friendly command interface enhances ease of use and integration into projects.
Status indication improves reliability in timing-sensitive applications.
Supports a range of supply voltages, accommodating versatile application requirements.
Top boot block allows for quick startup and operation, enhancing user experience.
High memory density offers a significant amount of storage in a compact package.
Flash memory type supports non-volatile storage, making it suitable for a wide range of applications.
Extremely low standby current contributes to reduced power consumption in idle states.
Fast access time ensures quick data retrieval and improved overall system performance.
Flash Memory M50FLW040AK5 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
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M50FLW040AK5 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Nexperia
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
LL4148
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
LM317T/NOPB
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
W25Q80DVSNIGT
Winbond Electronics
W25Q80DVSNIGT by Winbond Electronics is a 1MX8 Flash Memory with 104 MHz clock frequency. Operating at 3V, it has an industrial temperature grade and serial interface. Ideal for applications requiring high-speed data storage in compact devices.
W25Q80DVUXIE
W25Q80DVUXIE by Winbond Electronics is a 1MX8 NOR flash memory with 104 MHz clock frequency, SPI serial bus type, and 100000 write/erase cycles endurance. It operates at -40 to 85 °C and is suitable for applications requiring high-speed data storage in compact devices.
S25FL256LAGNFI010
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
S71WS256PC0HH3YR0
S71WS256PC0HH3YR0 by Infineon Technologies is a 16MX16 flash memory with synchronous operation. It has a package style of GRID ARRAY, THIN PROFILE, FINE PITCH and can operate in temperatures ranging from -25 to 85 °C. This memory IC is commonly used in applications requiring high-density storage and fast access times.
S25FL512SAGMFIR11
Infineon's S25FL512SAGMFIR11 is a 64MX8 NOR Flash Memory with 133 MHz clock frequency, SPI serial bus, and 100000 write/erase cycles. It operates at -40 to 85 °C, ideal for industrial applications requiring high endurance and fast data transfer. The small outline package with gull wing terminals makes it suitable for space-constrained designs.
MX30LF4G18AC-TI
Macronix
MX30LF4G18AC-TI by Macronix is a 3V SLC NAND Flash Memory with 512KX8 organization. Operating in industrial temperature range of -40 to 85 °C, it has 524288 words capacity and supports parallel interface. Suitable for applications requiring high reliability and fast data access.
AM29F800BB-55EF
Advanced Micro Devices
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Current: 60 mA;
AM29F010B-70JF
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000005 Amp;
S29GL128P11FFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M25P40-VMN6P
Micron Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
S29GL128S90TFI020
S29GL128S90TFI020 by Infineon Technologies is a 16MX8 NAND flash memory with 128 sectors and 3-STATE output. Operating at 3V, it offers fast access time of 90ns for applications requiring high endurance of 100,000 Write/Erase cycles. With a compact design and low standby current of 0.0001A, it is ideal for space-constrained devices needing reliable non-volatile storage.
M29W160ET70N6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
S29GL512P11FFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; No. of Words Code: 32M;
AT25SF128A-SHB-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
AT45DB081E-SSHN-T
Renesas Electronics
Renesas Electronics AT45DB081E-SSHN-T is a 1MX8 NOR Flash Memory with 3.9mm width, SPI serial bus type, and 133MHz clock frequency. Ideal for industrial applications requiring high endurance of 100K write/erase cycles in a compact small outline package.
AT25XE041B-MAHN-T
Renesas Electronics AT25XE041B-MAHN-T is a 4Mbit serial flash memory with synchronous operation, 85MHz clock frequency, and 1.8V programming voltage. Ideal for industrial applications requiring high-speed data storage in a compact 3x2mm package with -40 to 85°C operating temperature range.
S34ML01G100TFI000
Skyhigh Memory
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
S29GL01GS10DHI010
S29GL01GS10DHI010 by Infineon Technologies is a 128Mx8 NAND flash memory with 1K sectors, operating at 3V. It features a 32-word page size, 100,000 write/erase cycles endurance, and asynchronous mode. Ideal for applications requiring high-density data storage in devices with low power consumption.
AT45DB161D-SU-SL955
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
M25P16-VMF6P
Numonyx
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 25 MHz;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M50FLW040AN5
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK5TG
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
M50FLW040AK1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Current: 60 mA;
M50FLW040AN1TG
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: TOP;
M50FLW040AN1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK5P
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Data Polling: NO;
M50FLW040AN5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 40; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AK1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;
M50FLW040AK5TP
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AK1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M50FLW040AN1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512K;
M50FLW040AN1G
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M50FLW040AK5G
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M50FLW040AN1TP
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
M50FLW040AK1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Position: QUAD;
M50FLW040AK5T
FLASH; Temperature Grade: OTHER; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 8;
M50FLW040AK1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Sector Size (Words): 4K,64K;
M50FLW040AK1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
M50FLW040AN1P
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
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