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S25FL128SAGNFI003

Infineon Technologies

S25FL128SAGNFI003 by Infineon Technologies

S25FL128SAGNFI003 by Infineon Technologies is a NOR flash memory with 32MX4 organization, SPI serial bus type, and 133 MHz clock frequency. It operates at -40 to 85°C, has a 3V nominal voltage, and offers 100000 write/erase cycles. Ideal for industrial applications requiring high endurance and reliable data storage in compact devices.

Median Price

$2.758

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

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$2.480

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5

$2.480

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Newark

USA . 2,409 parts In-Stock

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$2.650

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$2.650

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$2.650

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$2.650

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Chip1Stop

Japan . 2,001 parts In-Stock

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$2.890

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$2.890

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DigiKey

USA . 18,568 parts In-Stock

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$3.990

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$3.451

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$3.178

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$3.073

18,568

$3.990

$3.451

$3.178

$3.073

Mouser Electronics

USA . 8,697 parts In-Stock

1+ parts

$3.990

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$3.460

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$3.180

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$2.950

8,697

$3.990

$3.460

$3.180

$2.950

Flip Electronics (Authorized)

USA . 11,449 parts In-Stock

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Future Electronics

Canada . 7,500 parts In-Stock

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$2.290

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Avnet

USA . 2,500 parts In-Stock

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$2.471

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Verical

USA . 2,500 parts In-Stock

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$2.867

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Rochester

USA . 302 parts In-Stock

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$2.090

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$1.870

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$1.760

302

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$1.870

$1.760

RS (Exports)

UK . 97 parts In-Stock

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$3.315

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Distributors (In-Stock)

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Digiode

USA . 172 parts In-Stock

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$2.508

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Nova Conductors

Japan . 800 parts In-Stock

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$4.044

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Sensible Micro Corp

USA . 28,164 parts In-Stock

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Cyclops Electronics Ltd

UK . 11,616 parts In-Stock

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Flip Electronics

USA . 10,423 parts In-Stock

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IBS Electronics

USA . 10,000 parts In-Stock

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$3.240

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Chip Stock

USA . 6,880 parts In-Stock

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Vyrian

USA . 4,688 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,842 parts In-Stock

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Bristol Electronics

USA . 109 parts In-Stock

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Semi Source

USA . 32 parts In-Stock

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32

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Distributors (Availability)

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Advanced Electronics

New Zealand . 52 parts In-Stock

1+ parts

$2.153

100+ parts

$2.045

1k+ parts

$2.045

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52

$2.153

$2.045

$2.045

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Corohmni

South Africa . 236 parts In-Stock

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$2.174

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$2.174

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Semicontronic

India . 3,546 parts In-Stock

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$2.200

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$2.145

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$2.134

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3,546

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$2.134

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Modulus Dynamics

Lithuania . 5,237 parts In-Stock

1+ parts

$2.342

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$2.248

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$2.155

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Corphita

USA . 857 parts In-Stock

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$2.376

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Aztec Data Supply Inc.

USA . 153 parts In-Stock

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$2.649

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Argo Parts USA

USA . 4,207 parts In-Stock

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$4.044

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Netroflash

USA . 500 parts In-Stock

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$4.044

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Perfect Parts

USA . 38,892 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,808 parts In-Stock

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Metaverse IC Inc.

Canada . 13,520 parts In-Stock

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RC Electronics

USA . 8,000 parts In-Stock

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$3.460

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$3.160

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$3.070

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$3.070

Robosynatics

Brazil . 4,274 parts In-Stock

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$4.486

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$4.395

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$4.395

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$4.395

Lucentia Tech

USA . 4,274 parts In-Stock

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$4.486

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$4.395

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$4.395

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$4.395

Continental Prestige Electronics

USA . 3,100 parts In-Stock

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$2.620

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,921 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Kepictronics

USA . 84 parts In-Stock

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Overview

Unleash the power of reliable and high-quality Flash Memory with the S25FL128SAGNFI003 by Infineon Technologies. Designed with precision and expertise, this product offers unmatched performance in a wide range of applications. From industrial automation to consumer electronics, this Flash Memory is the perfect solution for your storage needs. With a focus on durability and efficiency, Infineon Technologies ensures that every customer receives exceptional value and benefits from their products. Upgrade to the S25FL128SAGNFI003 today and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, making it suitable for various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and more efficient performance.

Nominal Supply Voltage / Vsup (V): 3

Stable supply voltage ensures consistent and reliable operation of the flash memory.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables the flash memory to function in different conditions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for energy-efficient performance.

Endurance: 100000 Write/Erase Cycles

High endurance allows for frequent read and write operations without compromising the reliability of the flash memory.

Serial Bus Type: SPI

Serial Peripheral Interface (SPI) communication ensures compatibility with a wide range of devices, making it versatile and easy to integrate.

Technical Specifications

Flash Memory S25FL128SAGNFI003 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128SAGNFI003 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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