Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36LLR8760D1ZAQE by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
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The use of plastic/epoxy material provides a reliable and durable package that can withstand various environmental conditions, ensuring product longevity.
Surface mount technology allows for a compact design and easier integration into modern circuit boards, which is essential for space-constrained applications.
The rectangular shape of the package aids in efficient layout design, allowing for better board space utilization.
Asynchronous operation allows for flexible data access without the need for clock synchronization, which can simplify system design.
Combining FLASH and PSRAM in one chip offers improved performance and versatile memory solutions for a wide range of applications.
A nominal supply voltage of 1.8 V is ideal for power-sensitive applications, contributing to energy efficiency and lower heat generation.
The requirement for a 1.8 V power supply ensures compatibility with low-power devices, making it suitable for mobile and battery-operated applications.
With 88 terminals, the device supports a wide range of data connections, enhancing its functionality and integration possibilities.
The grid array low profile design minimizes the overall footprint while allowing for high pin density, making it ideal for space-constrained solutions.
Operating up to 85 °C ensures reliability in harsher environments, making it suitable for industrial and automotive applications.
An organization of 16M x 16 bits provides a balanced memory structure that can handle various data types efficiently.
With a minimum operating temperature of -25 °C, the device can function in colder environments, expanding its application range.
The tin-silver-copper finish enhances solderability and reliability in connections, ensuring better performance in assembly processes.
Bottom terminal positioning facilitates easier mounting on circuit boards, optimizing design efficiency.
A maximum seated height of 1.4 mm is advantageous for designs requiring compact components, reducing spatial requirements.
At 8 mm wide, the design remains efficient and compact, making it suitable for modern electronic devices.
A low minimum supply voltage of 1.7 V allows for a wider range of operation over different devices and power conditions.
The 10 mm length allows for effective placement within tight spaces, ensuring compatibility with compact designs.
CMOS technology offers high-speed operation and low power consumption, making it suitable for a variety of applications from consumer electronics to industrial uses.
Ball terminal form enhances the reliability of connections and allows for effective heat dissipation, crucial for performance.
A maximum supply current of 52 mA provides ample power for high-performance applications while maintaining efficiency.
With 16,777,216 words of storage, this memory IC can handle substantial data loads, making it ideal for complex applications.
A memory width of 16 bits balances performance and efficiency, suitable for diverse data handling requirements.
The 0.8 mm terminal pitch allows for compact and dense layouts, fitting well into modern PCB designs.
Supporting a storage capacity of 16M words ensures it can meet substantial data processing and storage needs.
With a maximum supply voltage of 1.95 V, this IC can operate safely within a defined voltage range, enhancing stability and performance.
The high memory density of 268,435,456 bits offers significant data storage capabilities, suitable for high-performance applications.
Categorized as a memory circuit, this IC is designed specifically for efficient data storage and retrieval, critical for demanding applications.
A maximum standby current of only 0.00011 A minimizes energy consumption in idle states, making it a green choice for energy-sensitive applications.
Other Function Memory ICs M36LLR8760D1ZAQE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36LLR8760D1ZAQE Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
CRCW06031K00FKEAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06031K00FKEAHP is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.33 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 75 V.
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Crimson Semiconductor
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
Bytesonic Electronics
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
Lite-on Semiconductor
M36W216B85ZA1
STMicroelectronics
M36W216B85ZA1 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features a 16-bit width and operates within -0 °C to 70 °C, making it ideal for commercial applications in compact electronics. With 1M words capacity, it's perfect for data storage needs.
MR25H10CDF
Everspin Technologies
MR25H10CDF by Everspin Technologies is a synchronous memory IC with a capacity of 128Kx8 and a memory density of 1,048,576 bits. It operates at a nominal voltage of 3V and has a max operating temperature of 85°C. This memory circuit is commonly used in industrial applications requiring reliable and high-performance data storage.
TMS2564-45JDL
Texas Instruments
TMS2564-45JDL by Texas Instruments is an 8KX8 MOS memory IC with 65536 bit density and 450 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a DUAL terminal position. Ideal for applications requiring fast data retrieval in commercial temperature environments.
DS6207-5
Analog Devices
DS6207-5 by Analog Devices is a CMOS Memory Circuit with 384-bit memory density. It operates b/w 0 °C to 70°C, suitable for commercial applications. The IC has 5 terminals in a special shape package, ideal for various memory functions.
M36P0R9070E0ZACF
M36P0R9070E0ZACF by STMicroelectronics is a versatile memory IC featuring 32M words of mixed FLASH+PSRAM with a max access time of 70 ns. It operates asynchronously at a nominal voltage of 1.8V, suitable for compact applications. Its thin profile and grid array design enhance space efficiency in electronic devices.
47L04-I/SN
Microchip Technology
47L04-I/SN by Microchip Technology is a small outline memory IC with 512x8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is suitable for industrial applications requiring a memory density of 4096 bit, max access time of 400 ns, and operating temperature range from -40 to 85°C.
DS2502P-E48/TR
Dallas Semiconductor
Other Memory ICs;
SAA4955HL
Philips Semiconductors
Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE; Terminal Pitch: .8 mm;
DS1653S
Analog Devices' DS1653S is a CMOS memory circuit with 16 terminals, operating at 0-70 °C. It has a supply voltage of 5V and is surface-mountable in a small outline package. Ideal for commercial applications requiring reliable memory storage solutions.
M36W108B120ZN1
M36W108B120ZN1 from STMicroelectronics is a mixed memory IC featuring 1M x 8 organization with Flash+SRAM technology. It operates asynchronously at voltages b/w 2.7V and 3.6V, with a max access time of 120 ns. Ideal for commercial applications, it supports surface mount in a very thin profile package.
MT29C4G48MAYBBAKS-48IT
Micron Technology
Micron Technology's MT29C4G48MAYBBAKS-48IT is a 512MX8 memory IC with 4294967296-bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Suitable for industrial applications, this very thin profile chip has a max temp of 85°C and terminal pitch of 0.8mm.
SN74LS600ADW
SN74LS600ADW by Texas Instruments is a 16KX1 memory circuit IC with TTL technology. Operating at 5V, it has 16384-bit memory density and functions in asynchronous mode. This small outline package is ideal for applications requiring reliable memory storage in commercial temperature environments.
47L16-E/ST
47L16-E/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for automotive applications due to its thin profile, wide temperature range (-40 to 125°C), and high memory density of 16384 bits.
TACT2153-28FN
TACT2153-28FN by Texas Instruments is a 1KX11 memory circuit IC with 11264-bit memory density. It features a max access time of 25ns, operates b/w 0°C to 70°C, and has a terminal pitch of 1.27mm. This chip carrier package is ideal for applications requiring fast data retrieval in commercial-grade temperature environments.
SNC54LS170W
SNC54LS170W by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL IC with 16 terminals and a supply voltage of 5V. Its ceramic package can operate b/w -55°C to 125°C, making it suitable for military-grade applications requiring reliable memory functions in harsh environments. This rectangular flatpack IC is surface mountable and ideal for use in rugged electronic systems where high temperature tolerance and durability are essential.
M36W216BI70ZA6T
M36W216BI70ZA6T by STMicroelectronics is a low-profile, asynchronous mixed memory IC featuring 16Mbit density and operates b/w -40 °C to 85 °C. It supports a nominal voltage of 3V with a max access time of 70ns. Ideal for industrial applications requiring reliable flash and SRAM storage.
DS2401
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Shape: ROUND; Nominal Supply Voltage / Vsup (V): 5; Power Supplies (V): 3/5;
M36W216B100ZA6T
M36W216B100ZA6T from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features 1M x 16 organization and operates in temperatures ranging from -40 °C to 85 °C. Ideal for industrial applications, it offers high-density storage in a compact package.
M36W108T100ZN6T
M36W108T100ZN6T by STMicroelectronics is a 1MX8 memory IC with 8388608 bit memory density. Operating in asynchronous mode, it has a supply voltage range of 2.7V to 3.6V and temperature grade of industrial. With a package style of grid array, it is suitable for applications requiring high-density memory storage in industrial environments.
TMS27C32-20NL
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36L0R7050T0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M36L0R7050B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36L0R7040B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M36L0R7040T0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 8M;
M36L0R7050L1ZAME
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
M36L0R7040B0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
M36L0R7050B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words;
M36L0R7050T0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B88;
M36L0R7050B0ZAQT
M36L0R7040T0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
M36L0R7040T0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36L0R7050L1ZAMF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36L0R7050T0ZAQE
M36L0R7050B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
M36L0R7050T0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
M36L0R7050U1ZAMF
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36L0R7050U1ZAME
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36L0R7040B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
M36L0R7040B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M36L0R7040T0ZAQF
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