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NGTB50N60FL2WG

Onsemi

NGTB50N60FL2WG by Onsemi

NGTB50N60FL2WG by Onsemi is an N-CHANNEL IGBT with 600V VCE, 100A IC, and 417W Pd. It operates up to 175 °C making it ideal for high-power applications like motor drives and inverters.

Median Price

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Lifecycle Status

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4

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Vyrian

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AZTECH Wire

Italy . 83 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Overview

Unlock the power of innovation with the NGTB50N60FL2WG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. With a maximum power dissipation of 417W and a maximum collector-emitter voltage of 600V, this N-CHANNEL IGBT is perfect for a wide range of applications. From motor drives to solar inverters, this product offers unparalleled performance and reliability. Trust Onsemi to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their superior performance and efficiency compared to P-channel IGBTs, making this product a good choice for high power applications.

Maximum Power Dissipation (Abs): 417 W

With a high maximum power dissipation rating of 417 W, this IGBT can handle high power levels without overheating, ensuring reliability in demanding applications.

Maximum Operating Temperature: 175 °C

The high operating temperature of 175 °C allows this IGBT to operate in harsh environments without compromising performance, making it suitable for a wide range of applications.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating of 600 V enables this IGBT to handle high voltage levels, making it suitable for use in power electronics and industrial applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V ensures reliable and stable operation of this IGBT, making it ideal for applications where precise control is required.

Maximum Collector Current (IC): 100 A

With a high collector current rating of 100 A, this IGBT can handle large current flows, making it suitable for high-power switching applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The low gate-emitter threshold voltage of 6.5 V allows for efficient switching of this IGBT, leading to reduced power losses and improved efficiency in power electronic systems.

Terminal Finish: Tin (Sn)

The tin terminal finish provides good solderability and ensures reliable electrical connections, making this IGBT easy to use in manufacturing processes and applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB50N60FL2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Trade Compliance

NGTB50N60FL2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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