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NGTB30N135IHR1WG

Onsemi

NGTB30N135IHR1WG by Onsemi

NGTB30N135IHR1WG by Onsemi is an N-CHANNEL IGBT with 1350V VCEsat, 60A IC, and 394W power dissipation. Ideal for power control applications, it features a built-in diode and operates b/w -40 to 175 °C.

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Vyrian

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Digiode

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 1,092 parts In-Stock

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TANS Electronics

Latvia . 7,502 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Problanco Electronics

Mexico . 2,573 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Corohmni

South Africa . 310 parts In-Stock

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UHIMA Technologies

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Overview

Unleash the power of your devices with the NGTB30N135IHR1WG by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-notch quality products that are designed to enhance performance and reliability. This Insulated Gate Bipolar Transistor (IGBT) is perfect for power control applications, offering a maximum VCEsat of 3V and a maximum collector-emitter voltage of 1350V. With a nominal turn-off time of 443ns and a maximum power dissipation of 394W, this transistor provides unparalleled efficiency and durability. Upgrade your electronics today with the NGTB30N135IHR1WG and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance.

Maximum VCEsat: 3 V

Low VCEsat minimizes power loss and improves efficiency of the transistor.

Package Shape: RECTANGULAR

Offers easy mounting and installation in various electronic devices.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and reliable connection in circuit boards.

Nominal Turn Off Time (toff): 443 ns

Fast turn-off time ensures quick and efficient switching operations.

No. of Terminals: 3

Simplified connection setup with only three terminals.

Maximum Power Dissipation (Abs): 394 W

Capable of handling high power dissipation, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Ensures secure mounting and heat dissipation for optimal performance.

Maximum Operating Temperature: 175 °C

Wide operating temperature range suitable for various environments.

Maximum Collector-Emitter Voltage: 1350 V

High voltage rating for robust performance in high-power applications.

Transistor Element Material: SILICON

Silicon material ensures reliable and efficient transistor operation.

Maximum Gate-Emitter Voltage: 20 V

Safe operating voltage for gate-emitter protection.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without performance degradation.

Maximum Collector Current (IC): 60 A

High collector current rating for handling large currents in power circuits.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Optimal gate-emitter threshold voltage for efficient switching and control.

Terminal Finish: Matte Tin (Sn) - annealed

Durable and reliable terminal finish for long-lasting performance.

Terminal Position: SINGLE

Simplified terminal layout for easy connection and installation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB30N135IHR1WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1350 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

443 ns

Maximum VCEsat:

3 V

Trade Compliance

NGTB30N135IHR1WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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