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NGTB25N120LWG

Onsemi

NGTB25N120LWG by Onsemi

NGTB25N120LWG by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 50A max collector current, and 192W max power dissipation. Ideal for motor control applications due to its single configuration with built-in diode and fast turn-off time of 475ns.

Median Price

$1.800

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,729 parts In-Stock

1+ parts

$1.800

100+ parts

$1.760

1k+ parts

$1.730

10k+ parts

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2,729

$1.800

$1.760

$1.730

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Distributors (In-Stock)

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Digiode

USA . 1,163 parts In-Stock

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$1.710

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1,163

$1.710

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Vyrian

USA . 2,944 parts In-Stock

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2,944

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Fibra_Brandt Electronic GMBH

Germany . 13 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,422 parts In-Stock

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$1.530

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$1.530

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Corphita

USA . 2,165 parts In-Stock

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$1.620

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2,165

$1.620

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Corohmni

South Africa . 69 parts In-Stock

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$1.800

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69

$1.800

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AZTECH Wire

Italy . 922 parts In-Stock

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$11.850

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922

$11.850

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Component Stockers USA

USA . 795 parts In-Stock

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$99.990

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795

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 24,146 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,737 parts In-Stock

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SupplyDigital Components

Austria . 6,568 parts In-Stock

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TANS Electronics

Latvia . 5,900 parts In-Stock

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Problanco Electronics

Mexico . 5,452 parts In-Stock

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Kulean Microsystems

USA . 4,486 parts In-Stock

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Kepictronics

USA . 1,040 parts In-Stock

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Metaverse IC Inc.

Canada . 1,040 parts In-Stock

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Perfect Parts

USA . 460 parts In-Stock

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460

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UHIMA Technologies

Türkiye . 458 parts In-Stock

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458

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Overview

Enhance your motor control applications with the NGTB25N120LWG from Onsemi. As a leading manufacturer in insulated gate bipolar transistors, Onsemi guarantees top-notch quality and reliability. This N-CHANNEL transistor with a built-in diode offers superior performance, providing customers with efficient power dissipation of up to 192W. With a maximum collector-emitter voltage of 1200V and a fast turn-off time of 475ns, this transistor is perfect for various motor control tasks. Trust Onsemi to deliver technology that exceeds expectations and adds value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient control of current flow, providing better performance in motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency.

Nominal Turn Off Time (toff): 475 ns

Fast turn off time allows for quick switching and precise control of the transistor.

Maximum Power Dissipation (Abs): 192 W

Can handle high power dissipation, making it suitable for applications that require high power output.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments, increasing its versatility and reliability.

Maximum Collector-Emitter Voltage: 1200 V

Can handle high voltage levels, making it suitable for a wide range of applications.

Maximum Gate-Emitter Voltage: 20 V

Ideal voltage rating for gate control, ensuring safe and efficient operation.

Maximum Collector Current (IC): 50 A

Can handle high currents, making it suitable for applications that require high power output.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Optimal threshold voltage for gate control, ensuring reliable switching.

Case Connection: COLLECTOR

Simplifies circuit design by directly connecting to the collector terminal.

Nominal Turn On Time (ton): 117 ns

Fast turn on time allows for quick response and precise control of the transistor.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB25N120LWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

475 ns

Nominal Turn On Time (ton):

117 ns

Trade Compliance

NGTB25N120LWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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