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NGTB20N120LWG

Onsemi

NGTB20N120LWG by Onsemi

NGTB20N120LWG by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 40A. It has a nominal turn-off time of 485ns and is ideal for motor control applications due to its single configuration with built-in diode. The transistor operates at a max temperature of 150 °C, making it suitable for high-power applications.

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Digiode

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AZTECH Wire

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Ampacity Inc.

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Component Stockers USA

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

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Kulean Microsystems

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SupplyDigital Components

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Overview

Discover the NGTB20N120LWG by Onsemi, a top-quality Insulated Gate Bipolar Transistor that exceeds expectations in motor control applications. With a robust design and built-in diode, this N-channel transistor offers exceptional performance and reliability. Experience seamless operation and enhanced power dissipation with this cutting-edge component. Trust Onsemi's reputation for excellence and elevate your projects with the NGTB20N120LWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, allowing for easy handling and long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are commonly used in high-power applications due to their higher efficiency and lower on-state resistance, making them a good choice for motor control.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and provides protection against reverse current flow, enhancing the overall performance of the motor control system.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, this IGBT offers high reliability and efficient performance in controlling the speed and direction of motors.

Maximum Power Dissipation (Abs): 192 W

With a high maximum power dissipation, this IGBT can handle high power levels effectively, ensuring stable operation under heavy load conditions.

Maximum Operating Temperature: 150 °C

The IGBT can operate at high temperatures up to 150 °C, allowing for reliable performance in harsh industrial environments.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating makes the IGBT suitable for high-voltage applications, providing a wide range of operating capabilities.

Maximum Collector Current (IC): 40 A

With a high maximum collector current rating, this IGBT can handle substantial current flow, making it ideal for motor control applications that require high current levels.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB20N120LWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

485 ns

Nominal Turn On Time (ton):

110 ns

Trade Compliance

NGTB20N120LWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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