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KAI-2020-ABA-CP-BA

Onsemi

KAI-2020-ABA-CP-BA by Onsemi

KAI-2020-ABA-CP-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, offering a max supply voltage of 15.5 V and a dynamic range of 68 dB. Ideal for applications requiring high-resolution imaging in environments with temperatures ranging from -50 to 70 °C.

Median Price

$1,611.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$1,330.980

100+ parts

$1,251.120

1k+ parts

$1,171.260

10k+ parts

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2

$1,330.980

$1,251.120

$1,171.260

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DigiKey

USA . 2 parts In-Stock

1+ parts

$1,611.260

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2

$1,611.260

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Verical

USA . 2 parts In-Stock

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$1,663.725

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2

$1,663.725

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Distributors (In-Stock)

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Digiode

USA . 934 parts In-Stock

1+ parts

$1,471.826

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934

$1,471.826

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Vyrian

USA . 1,904 parts In-Stock

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1,904

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$1,121.000

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$1,121.000

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Corphita

USA . 529 parts In-Stock

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$1,394.361

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529

$1,394.361

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Corohmni

South Africa . 128 parts In-Stock

1+ parts

$1,549.290

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128

$1,549.290

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Problanco Electronics

Mexico . 6,362 parts In-Stock

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6,362

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 3,546 parts In-Stock

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SupplyDigital Components

Austria . 706 parts In-Stock

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706

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UHIMA Technologies

Türkiye . 628 parts In-Stock

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628

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Kulean Microsystems

USA . 315 parts In-Stock

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Overview

Capture stunning images with the KAI-2020-ABA-CP-BA by Onsemi! As a leader in image sensor technology, Onsemi delivers top-notch quality and reliability. Ideal for a wide range of applications, this CCD image sensor offers exceptional performance and clarity. With a maximum supply voltage of 15.5V and a dynamic range of 68 dB, this sensor provides unmatched value and benefits to customers looking to elevate their imaging needs. Experience the advantages of Onsemi's KAI-2020-ABA-CP-BA and unlock a world of possibilities in image capture.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for capturing detailed and high-resolution images, making this image sensor ideal for applications requiring precise imaging.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage provides flexibility in power input, ensuring reliable operation and performance in varying voltage conditions.

Body Width: 20.32 inch

The compact body width makes this image sensor suitable for applications where space is limited, allowing for easy integration into different devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Being a CCD image sensor means that it offers high-quality image capture with low noise, making it a superior choice for imaging applications that require excellent image fidelity.

Body Height: 4.44 mm

The low body height makes this image sensor suitable for applications where slim design is essential, allowing for seamless integration without adding bulk.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers easy mounting and alignment within a device or system, enhancing the overall usability and convenience of the image sensor.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage requirement ensures efficient power usage and compatibility with various power sources, making this image sensor versatile and energy-efficient.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this image sensor can reliably function in a wide range of environmental conditions, making it suitable for diverse applications.

Horizontal Pixel: 1600

The high horizontal pixel count results in detailed and high-resolution images with precise imaging capabilities, making this image sensor ideal for demanding imaging applications.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature ensures that this image sensor can operate in extreme cold conditions, making it suitable for applications that require functionality in harsh environments.

Housing: CERAMIC

The ceramic housing provides durability and heat resistance, ensuring the longevity and stability of the image sensor even in challenging operating conditions.

Dynamic Range: 68 dB

With a high dynamic range, this image sensor can capture a wide range of brightness levels accurately, making it a reliable choice for applications that require precise imaging in varying light conditions.

Vertical Pixel: 1200

The high vertical pixel count enhances the image sensor's ability to capture detailed images with a high level of accuracy, making it suitable for applications that require sharp image reproduction.

Body Length/Diameter: 33.02 mm

The moderate body length/diameter provides a balance between compactness and functionality, ensuring that this image sensor can fit well in different devices or systems without compromising performance.

Termination Type: SOLDER

The solder termination type offers a secure and reliable connection, ensuring stable operation and performance of the image sensor in a variety of operating conditions.

Array Type: INTERLINE

The interline array type enables fast and efficient image capture, making this image sensor ideal for applications that require rapid imaging and processing capabilities.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature allows for easy and secure installation of the image sensor, ensuring stable positioning within a device or system for consistent and reliable performance.

Technical Specifications

Image Sensors KAI-2020-ABA-CP-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 DB

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

4.44 mm

Body Length/Diameter:

33.02 mm

Dynamic Range:

68 dB

Horizontal Pixel:

1600

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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