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KAI-08051-AAA-JP-BA

Onsemi

KAI-08051-AAA-JP-BA by Onsemi

Onsemi's KAI-08051-AAA-JP-BA is a 5.5x5.5 um pixel size image sensor with 3364H x 2520V resolution and 66 dB dynamic range. Ideal for applications requiring high-quality imaging in industrial cameras, surveillance systems, and medical devices due to its superior performance and rectangular package style.

Median Price

$1,001.725

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$747.600

100+ parts

$702.740

1k+ parts

$657.890

10k+ parts

-

3

$747.600

$702.740

$657.890

-

Verical

USA . 3 parts In-Stock

1+ parts

$1,001.725

100+ parts

$941.625

1k+ parts

$881.513

10k+ parts

-

3

$1,001.725

$941.625

$881.513

-

DigiKey

USA . 3 parts In-Stock

1+ parts

$1,001.730

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$1,001.730

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 137 parts In-Stock

1+ parts

$714.258

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$714.258

-

-

-

Vyrian

USA . 2,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,779

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,605 parts In-Stock

1+ parts

$676.665

100+ parts

-

1k+ parts

-

10k+ parts

-

1,605

$676.665

-

-

-

Corohmni

South Africa . 168 parts In-Stock

1+ parts

$751.850

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$751.850

-

-

-

Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$751.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$751.850

-

-

-

TANS Electronics

Latvia . 4,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,329

-

-

-

-

Problanco Electronics

Mexico . 3,814 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,814

-

-

-

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SupplyDigital Components

Austria . 3,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,173

-

-

-

-

Kulean Microsystems

USA . 1,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,576

-

-

-

-

UHIMA Technologies

Türkiye . 613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

613

-

-

-

-

Overview

Unlock the power of cutting-edge imaging technology with the KAI-08051-AAA-JP-BA by Onsemi. As a leader in image sensor technology, Onsemi delivers superior quality and reliability in every product. The KAI-08051-AAA-JP-BA offers exceptional performance in a variety of applications, from industrial to medical imaging. Experience unparalleled value, benefits, and advantages with this top-of-the-line image sensor, providing customers with high-quality images and reliable operation every time.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Sufficient pixel size for capturing clear and detailed images.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for improved performance and signal strength.

Body Width: 29 inch

Compact size for easy integration into various devices or systems.

Power Supplies (V): 15

Optimal power supply for efficient operation of the image sensor.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensor technology offers high quality image capture.

Package Shape or Style: RECTANGULAR

Rectangular shape facilitates easy handling and installation of the image sensor.

Minimum Supply Voltage: 14.5 V

Provides flexibility in power input options while maintaining performance.

Maximum Operating Temperature: 70 °C

Wide operating temperature range suitable for various environments.

Horizontal Pixel: 3364

High horizontal pixel count for sharp and detailed image output.

Minimum Operating Temperature: -50 °C

Allows for operation in extreme low temperature conditions.

Dynamic Range: 66 dB

Good dynamic range for capturing both bright and dark areas in a scene.

Vertical Pixel: 2520

Generous vertical pixel count for capturing fine details in images.

Body Length/Diameter: 40 mm

Compact and sleek design for easy integration and space-saving.

Optical Format (inch): 4/3

Common optical format for compatibility with various lenses and systems.

Termination Type: SOLDER

Secure solder termination for reliable electrical connections.

Array Type: INTERLINE

Interline array design for efficient light sensitivity and image capture.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting for easy and secure installation in devices or systems.

Technical Specifications

Image Sensors KAI-08051-AAA-JP-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29 inch

Body Length/Diameter:

40 mm

Dynamic Range:

66 dB

Horizontal Pixel:

3364

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2520

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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