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KAI-01150-FBA-JB-B2

Onsemi

KAI-01150-FBA-JB-B2 by Onsemi

KAI-01150-FBA-JB-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1280x720 resolution, and 64 dB dynamic range. It is ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.

Median Price

$161.948

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

$148.920

100+ parts

$139.980

1k+ parts

$131.050

10k+ parts

-

4

$148.920

$139.980

$131.050

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DigiKey

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Verical

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$174.975

1k+ parts

$163.813

10k+ parts

-

4

-

$174.975

$163.813

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 92 parts In-Stock

1+ parts

$164.682

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$164.682

-

-

-

Vyrian

USA . 3,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,166

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4 parts In-Stock

1+ parts

$139.720

100+ parts

-

1k+ parts

-

10k+ parts

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4

$139.720

-

-

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Corphita

USA . 1,681 parts In-Stock

1+ parts

$156.015

100+ parts

-

1k+ parts

-

10k+ parts

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1,681

$156.015

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-

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Corohmni

South Africa . 320 parts In-Stock

1+ parts

$173.350

100+ parts

-

1k+ parts

-

10k+ parts

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320

$173.350

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-

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TANS Electronics

Latvia . 7,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,093

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Kulean Microsystems

USA . 2,767 parts In-Stock

1+ parts

-

100+ parts

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2,767

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Problanco Electronics

Mexico . 1,092 parts In-Stock

1+ parts

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1,092

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SupplyDigital Components

Austria . 721 parts In-Stock

1+ parts

-

100+ parts

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721

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UHIMA Technologies

Türkiye . 599 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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599

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Overview

Capture stunning images with the KAI-01150-FBA-JB-B2 by Onsemi, a top-quality image sensor designed to deliver exceptional performance in a variety of applications. As a leading manufacturer in the industry, Onsemi ensures reliability and innovation in every product they create. Ideal for use in security cameras, industrial inspection systems, and medical imaging devices, this image sensor offers unmatched value, providing customers with clear, detailed images and superior functionality. Upgrade your imaging system today with the KAI-01150-FBA-JB-B2 and experience the difference.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Small pixel size allowing for high resolution images to be captured with fine detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage providing more power to the sensor for better performance.

Body Width: 20.07 inch

Compact size making it suitable for integration into various devices and applications.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors are known for their high-quality image output, making this sensor a reliable choice for imaging applications.

Body Height: 3.33 mm

Low profile design for easy integration into slim devices or systems.

Package Shape or Style: RECTANGULAR

Standard rectangular shape for easy mounting and compatibility with existing designs.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage ensuring efficient power consumption and extended battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allowing the sensor to function in various environmental conditions.

Horizontal Pixel: 1280

High horizontal pixel count for detailed and sharp image capture.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature enabling the sensor to work in cold environments without issues.

Dynamic Range: 64 dB

Good dynamic range ensuring accurate representation of both dark and bright areas in an image.

Vertical Pixel: 720

Sufficient vertical pixel count for high-resolution image capture in a 16:9 aspect ratio.

Body Length/Diameter: 33.02 mm

Longer body providing space for the sensor components without compromising on the compact design.

Optical Format (inch): 1/2

Standard optical format for compatibility with a wide range of lenses and imaging systems.

Termination Type: SOLDER

Solder-based termination for secure connections and reliable performance in the long run.

Array Type: INTERLINE

Interline array type for efficient image capture and minimal noise in the output.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature for easy and secure installation in various electronic devices and systems.

Technical Specifications

Image Sensors KAI-01150-FBA-JB-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Height:

3.33 mm

Body Length/Diameter:

33.02 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1280

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/2

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

720

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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