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KAF-16200-FXA-CD-B1

Onsemi

KAF-16200-FXA-CD-B1 by Onsemi

Onsemi's KAF-16200-FXA-CD-B1 is a 6x6 um pixel size CCD image sensor with 4500 horizontal and 3600 vertical pixels. It offers a dynamic range of 69.3 dB, operates b/w 0 to 60 °C, and has a data rate of 24 Mbps. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.

Median Price

$2,351.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$2,351.660

100+ parts

$2,210.560

1k+ parts

$1,998.910

10k+ parts

$1,998.910

1

$2,351.660

$2,210.560

$1,998.910

$1,998.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 336 parts In-Stock

1+ parts

$2,234.077

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336

$2,234.077

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Vyrian

USA . 4,920 parts In-Stock

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4,920

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Distributors (Availability)

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AZTECH Wire

Italy . 356 parts In-Stock

1+ parts

$12.190

100+ parts

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356

$12.190

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Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$1,901.000

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1

$1,901.000

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Corphita

USA . 342 parts In-Stock

1+ parts

$2,116.494

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342

$2,116.494

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Corohmni

South Africa . 236 parts In-Stock

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$2,351.660

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236

$2,351.660

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Kulean Microsystems

USA . 7,715 parts In-Stock

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7,715

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SupplyDigital Components

Austria . 5,635 parts In-Stock

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5,635

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TANS Electronics

Latvia . 2,037 parts In-Stock

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2,037

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Problanco Electronics

Mexico . 1,353 parts In-Stock

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1,353

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UHIMA Technologies

Türkiye . 616 parts In-Stock

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616

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Overview

Capture stunning images with the KAF-16200-FXA-CD-B1 by Onsemi, a top-of-the-line image sensor that delivers unmatched quality. Manufactured by Onsemi, a trusted name in the industry, this CCD sensor is perfect for a wide range of applications. From professional photography to scientific imaging, this sensor offers exceptional value and performance. With a 6x6 pixel size and impressive dynamic range, this sensor provides crystal-clear images in any setting. Upgrade your imaging capabilities today with the KAF-16200-FXA-CD-B1 by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 6X6

Small pixel size allows for high resolution images with fine details.

Body Width: 35.81 inch

Compact design makes it suitable for applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture, making this product ideal for imaging applications.

Body Height: 4.92 mm

Low profile design enables easy integration into various systems.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for efficient placement and mounting within devices.

Minimum Supply Voltage: 14.5 V

Operates efficiently at a relatively low voltage, reducing power consumption.

Maximum Operating Temperature: 60 °C

Can withstand high temperatures, making it suitable for use in challenging environments.

Horizontal Pixel: 4500

High pixel count provides detailed and high-resolution horizontal images.

Minimum Operating Temperature: 0 °C

Works reliably even in low temperature conditions.

Housing: CERAMIC

Ceramic housing offers durability and protection for the internal components.

Dynamic Range: 69.3 dB

Wide dynamic range ensures accurate color representation and contrast in captured images.

Vertical Pixel: 3600

High pixel count offers detailed and high-resolution vertical images.

Body Length/Diameter: 38.6 mm

Compact size allows for easy integration and placement within devices.

Data Rate: 24 Mbps

High data rate enables fast and efficient transfer of image data.

Termination Type: SOLDER

Solder termination provides a reliable connection for seamless operation.

Array Type: FULL FRAME

Full-frame array ensures no cropping of images, capturing the entire scene.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature offers secure and stable mounting within devices.

Technical Specifications

Image Sensors KAF-16200-FXA-CD-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Body Width:

35.81 inch

Body Height:

4.92 mm

Body Length/Diameter:

38.6 mm

Data Rate:

24 Mbps

Dynamic Range:

69.3 dB

Horizontal Pixel:

4500

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3600

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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