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AR0331SRSC00SUCA0-DPBR1

Onsemi

AR0331SRSC00SUCA0-DPBR1 by Onsemi

Onsemi's AR0331SRSC00SUCA0-DPBR1 is a 2.2x2.2 um CMOS image sensor with 2048x1536 pixels, offering a dynamic range of 100 dB and sensitivity of 1.9 V/lx.s. It operates at temperatures from -30 to 85 °C, with a max supply voltage of 1.95 V and frame rate of 60 fps, suitable for digital current output applications in various imaging systems.

Median Price

$23.776

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Arrow

USA . 239 parts In-Stock

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$23.731

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$20.369

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$19.854

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Verical

USA . 239 parts In-Stock

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$23.820

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$20.446

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$19.928

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239

$23.820

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$19.928

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Digiode

USA . 208 parts In-Stock

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$22.544

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Vyrian

USA . 2,887 parts In-Stock

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Flip Electronics

USA . 1,920 parts In-Stock

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Native Components

USA . 775 parts In-Stock

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$1.839

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$1.839

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Northwest PG Solutions

USA . 502 parts In-Stock

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$2.023

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AZTECH Wire

Italy . 573 parts In-Stock

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$19.640

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Corphita

USA . 591 parts In-Stock

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$21.358

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Corohmni

South Africa . 396 parts In-Stock

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$23.731

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 8,352 parts In-Stock

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Problanco Electronics

Mexico . 4,704 parts In-Stock

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TANS Electronics

Latvia . 2,381 parts In-Stock

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UHIMA Technologies

Türkiye . 747 parts In-Stock

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SupplyDigital Components

Austria . 476 parts In-Stock

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Overview

Capture stunning images with the AR0331SRSC00SUCA0-DPBR1 Image Sensor by Onsemi. Known for their high-quality products, Onsemi delivers cutting-edge technology for a wide range of applications. This image sensor boasts a 100 dB dynamic range and 2.2x2.2 pixel size, providing exceptional clarity and detail. With a maximum frame rate of 60 fps and a compact square package shape, this sensor is perfect for applications requiring fast and precise imaging. Elevate your photography or machine vision projects with the unmatched performance of the AR0331SRSC00SUCA0-DPBR1.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Small pixel size allows for high resolution images to be captured with fine details.

Maximum Supply Voltage: 1.95 V

Low operating voltage helps in reducing power consumption and increasing efficiency.

Master Clock: 48 MHz

High clock frequency enables fast processing of image data for real-time applications.

Body Width: 10 inch

Compact body width makes it suitable for various applications with space constraints.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology provides high sensitivity and low noise for quality image capture.

Package Shape or Style: SQUARE

Square package shape allows for easy mounting and integration into devices.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures reliable operation even with fluctuating power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for use in various environmental conditions.

Horizontal Pixel: 2048

High horizontal pixel count results in high-resolution images with detailed information.

Output Range: -22-22mA

Wide output range allows for capturing a wide range of light intensities accurately.

Output Type: DIGITAL CURRENT

Digital current output simplifies interfacing with other components and systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance in cold environments.

Maximum Operating Current: 358 mA

High operating current allows for capturing high-quality images quickly.

Dynamic Range: 100 dB

Wide dynamic range enables capturing both bright and dark areas in the scene accurately.

Vertical Pixel: 1536

High vertical pixel count results in high-resolution images with detailed information.

Body Length/Diameter: 10 mm

Compact body length or diameter allows for easy integration into various devices.

Spectral Response (nm): 350-1150

Wide spectral response range captures a broad range of colors accurately.

Optical Format (inch): 1/3

Common optical format allows for easy replacement or upgrade in existing systems.

Termination Type: SOLDER

Solder termination type ensures secure connection for reliable operation.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity with other devices for easy integration.

Frame Rate: 60 fps

High frame rate allows for capturing fast-moving objects or events smoothly.

Array Type: FRAME

Frame array type enables capturing full-frame images for detailed analysis.

Sensitivity (V/lx.s): 1.9 V/lx.s

High sensitivity allows for capturing images in low light conditions with great detail.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure installation on PCBs for various applications.

Technical Specifications

Image Sensors AR0331SRSC00SUCA0-DPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO REQUIRES 2.8V NOMINAL SUPPLY

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

2048

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

358 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

1.9 V/lx.s

Sensors or Transducers Type:

Spectral Response (nm):

350-1150

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1536

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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