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AR0135CS2C19SUEA0-DRBR1

Onsemi

AR0135CS2C19SUEA0-DRBR1 by Onsemi

The Onsemi AR0135CS2C19SUEA0-DRBR1 is a 1/3 inch CMOS image sensor with a square package shape. It features dimensions of 9mm x 9mm x 1.55mm and uses Tin/Silver/Copper terminal finish for soldering. Ideal for surface mount applications in various imaging devices due to its compact size and high-quality image capture capabilities.

Median Price

$36.641

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

AR0135CS2C19SUEA0-DRBR1 by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 205 parts In-Stock

1+ parts

-

100+ parts

$32.570

1k+ parts

$29.140

10k+ parts

$27.420

205

-

$32.570

$29.140

$27.420

Verical

USA . 205 parts In-Stock

1+ parts

-

100+ parts

$40.712

1k+ parts

$36.425

10k+ parts

$34.275

205

-

$40.712

$36.425

$34.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$24.323

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45

$24.323

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Digiode

USA . 1,655 parts In-Stock

1+ parts

$34.447

100+ parts

-

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1,655

$34.447

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-

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Vyrian

USA . 4,725 parts In-Stock

1+ parts

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4,725

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VNN

France . 2,997 parts In-Stock

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2,997

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Distributors (Availability)

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AZTECH Wire

Italy . 727 parts In-Stock

1+ parts

$11.694

100+ parts

-

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727

$11.694

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Corohmni

South Africa . 371 parts In-Stock

1+ parts

$23.359

100+ parts

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371

$23.359

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Ampacity Inc.

Singapore . 28 parts In-Stock

1+ parts

$30.820

100+ parts

-

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28

$30.820

-

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Corphita

USA . 2,292 parts In-Stock

1+ parts

$32.634

100+ parts

-

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2,292

$32.634

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TANS Electronics

Latvia . 4,082 parts In-Stock

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4,082

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SupplyDigital Components

Austria . 1,156 parts In-Stock

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1,156

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Problanco Electronics

Mexico . 870 parts In-Stock

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870

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UHIMA Technologies

Türkiye . 715 parts In-Stock

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715

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$23.836

1k+ parts

$23.106

10k+ parts

$22.620

100

-

$23.836

$23.106

$22.620

Kulean Microsystems

USA . 72 parts In-Stock

1+ parts

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72

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Overview

Capture the beauty of every moment with the AR0135CS2C19SUEA0-DRBR1 image sensor by Onsemi. Known for their exceptional quality and innovative technology, Onsemi delivers cutting-edge solutions in the field of image sensors. Ideal for a wide range of applications, this CMOS sensor offers unparalleled clarity and precision. Transform your projects with the superior performance and reliability of Onsemi's AR0135CS2C19SUEA0-DRBR1, bringing value and excellence to your creations.

Feature Benefit Bullets

Body Width: 9 inch

The 9 inch body width ensures a compact and space-saving design, making it suitable for small devices and tight spaces.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors provide high-quality image capture with low power consumption, making them ideal for battery-powered devices.

Body Height: 1.55 mm

With a height of 1.55 mm, this sensor can be easily integrated into slim devices without adding bulk.

Package Shape or Style: SQUARE

The square package shape offers efficient use of space and easy alignment during assembly, simplifying the manufacturing process.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The tin/silver/copper terminal finish provides good conductivity and reliability for long-lasting performance.

Body Length/Diameter: 9 mm

The 9 mm body length/diameter allows for a streamlined design while still providing sufficient space for sensor components.

Optical Format (inch): 1/3

The 1/3 inch optical format offers high resolution and sensitivity, resulting in clear and detailed images.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection, making installation and maintenance hassle-free.

Array Type: FRAME

The frame array type allows for simultaneous capture of multiple images, enhancing efficiency in image processing and analysis.

Mounting Feature: SURFACE MOUNT

The surface mounting feature enables easy and secure attachment to circuit boards, simplifying the installation process.

Technical Specifications

Image Sensors AR0135CS2C19SUEA0-DRBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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