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AR0135CS2C00SUEA0-DRBR

Onsemi

AR0135CS2C00SUEA0-DRBR by Onsemi

The Onsemi AR0135CS2C00SUEA0-DRBR image sensor features 3.75um pixel size, 50MHz master clock, and 1280x960 resolution. Ideal for digital cameras, surveillance systems, and automotive applications due to its high dynamic range of 71.1dB and frame rate of 54fps.

Median Price

$27.120

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

AR0135CS2C00SUEA0-DRBR by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,123 parts In-Stock

1+ parts

$27.120

100+ parts

$21.637

1k+ parts

-

10k+ parts

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2,123

$27.120

$21.637

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Chip1Stop

Japan . 2,467 parts In-Stock

1+ parts

$105.000

100+ parts

$49.400

1k+ parts

$32.900

10k+ parts

-

2,467

$105.000

$49.400

$32.900

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Flip Electronics (Authorized)

USA . 2,600 parts In-Stock

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2,600

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Verical

USA . 2,600 parts In-Stock

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$19.119

2,600

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$19.119

Distributors (In-Stock)

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Digiode

USA . 497 parts In-Stock

1+ parts

$20.615

100+ parts

-

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497

$20.615

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Vyrian

USA . 1,561 parts In-Stock

1+ parts

$21.700

100+ parts

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1,561

$21.700

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Flip Electronics

USA . 5,300 parts In-Stock

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5,300

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Distributors (Availability)

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Corphita

USA . 963 parts In-Stock

1+ parts

$19.530

100+ parts

-

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963

$19.530

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Corohmni

South Africa . 65 parts In-Stock

1+ parts

$22.660

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65

$22.660

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Perfect Parts

USA . 14,427 parts In-Stock

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14,427

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Kulean Microsystems

USA . 7,801 parts In-Stock

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7,801

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TANS Electronics

Latvia . 5,976 parts In-Stock

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5,976

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SupplyDigital Components

Austria . 3,725 parts In-Stock

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3,725

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GreenTree Electronics

Israel . 2,597 parts In-Stock

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2,597

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Authorized Procurement Solutions

USA . 2,497 parts In-Stock

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2,497

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Northwest PG Solutions

USA . 1,683 parts In-Stock

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1,683

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UHIMA Technologies

Türkiye . 957 parts In-Stock

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957

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Native Components

USA . 892 parts In-Stock

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892

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Problanco Electronics

Mexico . 772 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0135CS2C00SUEA0-DRBR image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. This sensor, belonging to the Image Sensors category, offers unparalleled value to customers with its high resolution, wide dynamic range, and fast frame rate. Whether used in automotive cameras, security systems, or industrial applications, this sensor guarantees exceptional performance and superior image quality. Trust Onsemi to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um): 3.75

A smaller pixel size allows for higher resolution images to be captured, making this sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage: 1.95 V

The higher maximum supply voltage ensures stable and reliable operation of the image sensor, reducing the risk of voltage-related issues.

Master Clock: 50 MHz

A high master clock frequency of 50 MHz allows for fast and efficient data readout, enabling real-time image processing and high frame rates.

Body Width: 9 inch

The compact body width of 9 inches makes this image sensor suitable for applications requiring a small form factor and easy integration into devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption, high sensitivity, and fast readout speeds, making them a popular choice for various imaging applications.

Package Shape or Style: SQUARE

The square package shape provides a convenient and standardized form factor for easy mounting and integration into electronic devices.

Minimum Supply Voltage: 1.7 V

The lower minimum supply voltage ensures energy efficiency and extends the battery life of devices using this image sensor.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C allows for reliable performance in a wide range of environmental conditions.

Horizontal Pixel: 1280

The high horizontal pixel count of 1280 results in detailed and high-resolution images, making this sensor ideal for applications requiring precise imaging.

Output Range: 0.40-1.50V

The wide output voltage range of 0.40-1.50V allows for flexibility in signal processing and compatibility with various electronic systems.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and communication with other digital components, enhancing overall system integration.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance for long-lasting and reliable connections.

Maximum Operating Current: 90 mA

The moderate maximum operating current of 90 mA ensures efficient power consumption and minimizes heat generation, leading to improved overall reliability.

Dynamic Range: 71.1 dB

The high dynamic range of 71.1 dB enables the sensor to capture a wide range of light intensities accurately, resulting in high-quality and detailed images.

Vertical Pixel: 960

The vertical pixel count of 960 ensures good image resolution in the vertical direction, complementing the high horizontal pixel count for overall image quality.

Body Length/Diameter: 9 mm

The compact body length/diameter of 9 mm further enhances the sensor's small form factor and ease of integration into various electronic devices.

Optical Format (inch): 1/3

The 1/3 inch optical format provides a standard size for compatibility with a wide range of lenses and optical systems, making this sensor versatile for different applications.

Termination Type: SOLDER

The solder termination type ensures secure and reliable electrical connections, essential for stable data transmission and signal integrity.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connection and communication between the image sensor and external systems, enabling easy integration and control.

Frame Rate: 54 fps

The high frame rate of 54 frames per second allows for smooth and continuous video recording or fast-moving object tracking, making this sensor suitable for dynamic imaging applications.

Array Type: FRAME

The frame array type organizes the pixels in a grid pattern, providing a structured layout for efficient data readout and processing, contributing to overall image quality.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the integration of the image sensor onto circuit boards, reducing assembly time and complexity for electronic device manufacturers.

Technical Specifications

Image Sensors AR0135CS2C00SUEA0-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.39 mm

Body Length/Diameter:

9 mm

Dynamic Range:

71.1 dB

Frame Rate:

54 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

90 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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