Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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AR0134CSSM25SUEA0-TPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and a master clock of 50MHz. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
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Native Components
Smaller pixel size allows for higher resolution images to be captured with more detail.
Higher maximum supply voltage ensures stable and consistent performance of the image sensor.
Fast master clock speed enables quick and efficient operation of the image sensor.
Compact body width makes the image sensor suitable for integration into various devices and systems.
CMOS sensor type offers low power consumption and high image quality, making it a reliable choice for imaging applications.
Slim body height allows for easy integration and placement of the image sensor.
Square package shape provides a convenient and uniform form factor for mounting and installation.
Low minimum supply voltage ensures energy efficiency and extended battery life in portable devices.
High maximum operating temperature allows the image sensor to withstand challenging environmental conditions.
High horizontal pixel count enables capturing wide and detailed images with clarity.
Wide output range provides flexibility in signal transmission and processing.
Digital current output type ensures accurate and reliable data transmission from the image sensor.
Low minimum operating temperature allows the image sensor to function effectively in cold environments.
Durable terminal finish ensures secure connections and longevity of the image sensor.
High maximum operating current supports the sensor in handling complex imaging tasks efficiently.
Wide dynamic range allows the sensor to capture both bright and dark areas accurately in the same image.
Vertical pixel count complements the horizontal resolution for capturing high-quality images with balanced aspect ratios.
Compact body length/diameter ensures the image sensor can fit into tight spaces or slim devices.
Common optical format that is widely supported and compatible with various imaging systems.
High data rate enables fast and efficient transfer of image data for real-time processing and analysis.
Solder termination provides a reliable and secure connection for the image sensor.
2-wire interface simplifies connectivity and communication with external devices or systems.
High frame rate ensures smooth and fluid motion capture for video recording or live imaging applications.
Single frame array design simplifies image processing and reduces complexity in data handling.
Surface mount capability allows for easy and secure attachment of the image sensor to PCBs or mounting surfaces.
Image Sensors AR0134CSSM25SUEA0-TPBR attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
JESD-609 Code:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Terminal Finish:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 29/Jan/2021
PCN Assembly/Origin - Update 05/Nov/2020
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Electronic Devices
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
AR0234CSSC28SUKA0-CR
AR0234CSSC28SUKA0-CR by Onsemi is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive, surveillance, and industrial systems.
11KAI-04070-QBA-JD-BA
The Onsemi 11KAI-04070-QBA-JD-BA is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 70.5dB dynamic range. Ideal for applications requiring high-resolution imaging in industrial cameras or machine vision systems due to its rectangular package style and through-hole mounting feature.
AR0144ATSM20XUEA0-TPBR
Onsemi's AR0144ATSM20XUEA0-TPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. Ideal for surface mount applications, it features a square package style and solder termination type.
AR0231AT7C00XUD20-E
IMAGE SENSOR,CMOS;
KAF-09000-ABA-DP-AE
Onsemi's KAF-09000-ABA-DP-AE is a 3056x3056 full-frame CCD image sensor with 12x12 um pixel size. It operates b/w -60 to 60 °C and offers a dynamic range of 84 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
KAI-16070-FXA-JD-AE
KAI-16070-FXA-JD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging at a max supply voltage of 15.5 V and operating temperatures ranging from -50 to 70 °C.
NOIM2SM9600A-QDC
NOIM2SM9600A-QDC by Onsemi is a 3840x2500 CMOS image sensor with 2.4x2.4 um pixel size, ideal for high-resolution imaging applications. It operates at 1.6-2V, with a master clock of 62 MHz and offers a dynamic range of 54 dB. The sensor has an SPI interface, supports up to 62 Mbps data rate, and can achieve a frame rate of 20 fps in a compact square package suitable for surface mounting.
OVM7690-R20A
Omnivision Technologies
Image Sensors;
KAI-0340-ABB-CP-AE-D
IMAGE SENSOR,CCD;
AR0234CSSC00SUKA0-CP
The Onsemi AR0234CSSC00SUKA0-CP image sensor features 1920x1200 resolution, 3x3 um pixel size, and a 54 MHz master clock. Ideal for applications requiring high-quality digital imaging with a frame rate of up to 120 fps.
MT9V138C12STC-DR
Onsemi's MT9V138C12STC-DR is a 5.60x5.60 um CMOS image sensor with 680H x 512V pixels, operating at 30 fps. It has a max supply voltage of 1.9V and a dynamic range of 74.8 dB, suitable for digital imaging applications in various industries.
OV02680-H47A
OV02680-H47A by Omnivision Technologies is an image sensor with 1.75x1.75 um pixel size, ideal for applications requiring high-resolution imaging. Operating at temperatures from -30 to 85 °C, it offers a resolution of 1616x1216 pixels and runs on a power supply of 1.58V.
TC217-30
TC217-30 by Texas Instruments is an image sensor with 11.7X9 um pixel size, 1134 horizontal pixels, and 486 vertical pixels. It operates b/w -30 to 85 °C with a dynamic range of 73 dB. Ideal for applications requiring high sensitivity and precise imaging in various environments.
AR0147ATSC00XUEA0-TPBR
Onsemi's AR0147ATSC00XUEA0-TPBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and uses a digital output interface. Ideal for applications requiring high-resolution imaging with low light sensitivity.
MT9T031C12STC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3.30V; Body Height: 2.25 mm;
MT9D115W00STCK25AC1-750
MT9D115W00STCK25AC1-750 by Onsemi is an image sensor with 1.75um pixel size, 1600x1200 resolution, and 85MHz master clock. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range and frame rate of 15fps.
ASX340AT2C00XPED0-DRBR1
ASX340AT2C00XPED0-DRBR1 by Onsemi is a 5600x5600 pixel CMOS image sensor with a 27 MHz master clock and 1/4 inch optical format. It operates b/w -40 to 85 °C, has a dynamic range of 87 dB, and outputs digital voltage in the range of 0.84-1.96V. Ideal for applications requiring high-resolution imaging at up to 60 fps with a sensitivity of 16.5 V/lx.s.
AR0330CS1C12SPKA0-CP
The Onsemi AR0330CS1C12SPKA0-CP is a 1/3 inch CMOS image sensor with 2304x1296 pixels. It operates at 27 MHz with a dynamic range of 69.5 dB and outputs digital voltage from 0.40-1.40V. Ideal for applications requiring high-resolution imaging and fast frame rates up to 60 fps, it features a compact square package suitable for surface mounting.
MT9V128IA3XTC-TP
MT9V128IA3XTC-TP by Onsemi is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.8 dB and operating at up to 105°C. Ideal for applications requiring a digital voltage output interface, such as frame arrays in surveillance cameras or industrial imaging systems.
MT9M012D00STM
Onsemi's MT9M012D00STM image sensor features 2.2x2.2 um pixel size, 41 MHz master clock, and 1280x720 resolution. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high sensitivity and frame rate capabilities.
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AR0147ATSC00XUEA0-DPBR
Onsemi's AR0147ATSC00XUEA0-DPBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and outputs digital voltage. Ideal for applications requiring high-resolution imaging at up to 60 fps.
AR0147ATSC00XUEA0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; JESD-609 Code: e1; Maximum Operating Temperature: 110 Cel;
AR0147ATSC00XUEA0-TRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Vertical Pixel: 968; Minimum Supply Voltage: 1.14 V;
AR0134CSSM00SUEA0-DRBR
Onsemi's AR0134CSSM00SUEA0-DRBR is a 1/3" CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. Ideal for applications requiring high-speed digital current output at up to 60fps frame rate, such as surveillance cameras and industrial machine vision systems.
AR0134CSSM00SUEA0-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -22-22mA; Minimum Operating Temperature: -30 Cel;
AR0134CSSM00SUEA0-TPBR
AR0134CSSM00SUEA0-TPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70°C, has a max supply voltage of 1.95V, and uses a digital current output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
AR0134CSSM00SUEA0-TRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -22-22mA; Master Clock: 50 MHz;
AR0130CSSM00SPCA0-DRBR1
The Onsemi AR0130CSSM00SPCA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and features a master clock of 50MHz. Ideal for applications requiring high-resolution imaging in devices such as surveillance cameras and industrial inspection systems.
AR0134CSSM00SUEA0-DPBR1
The Onsemi AR0134CSSM00SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and has a master clock frequency of 50MHz. This sensor is commonly used in applications such as digital cameras, surveillance systems, and automotive imaging.
AR0144CSSM20SUKA0-CPBR
Onsemi's AR0144CSSM20SUKA0-CPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. Ideal for surface mount applications, it features a solder termination type and 2-wire interface for seamless integration in various imaging systems.
AR0135CS2M00SUEA0-DPBR2
Onsemi's AR0135CS2M00SUEA0-DPBR2 is a 1/3 inch CMOS image sensor with a 9mm square package. It features solder termination, frame array type, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact spaces like mobile devices and security cameras.
AR0141CS2C00SUEA0-DR
The Onsemi AR0141CS2C00SUEA0-DR is a CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 50 MHz master clock. It operates b/w -30 to 70 °C and has a dynamic range of 79 dB. Ideal for applications requiring high-resolution imaging at fast frame rates like surveillance cameras or industrial machine vision systems.
AR0141CS2M00SUEA0-DPBR
The Onsemi AR0141CS2M00SUEA0-DPBR image sensor features a pixel size of 3x3 um, operates at a max supply voltage of 1.95V, and has a master clock speed of 50 MHz. Ideal for applications requiring high-resolution imaging such as surveillance cameras, automotive vision systems, and industrial inspection equipment.
AR0135CS2M00SUEA0-DRBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-1.50V; JESD-609 Code: e1;
AR0134CSSM00SPCA0-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.4-1.5V; Array Type: FRAME;
AR0130CSSC00SPCA0-DPBR2
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -22-22mA; Termination Type: SOLDER;
AR0135AT2M25XUEA0-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Length/Diameter: 9 mm; Body Height: 1.4 mm; Optical Format (inch): 1/3;
AR0132AT6M00XPEA0-TPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-1.50V; Termination Type: SOLDER;
AR0135AT2M00XUEA0-TPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: SQUARE; Output Range: 0.40-2.5V; Termination Type: SOLDER;
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