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AR0130CSSC00SPBA0-DR1

Onsemi

AR0130CSSC00SPBA0-DR1 by Onsemi

AR0130CSSC00SPBA0-DR1 by Onsemi is an image sensor with 1280x960 resolution, 3.75um pixel size, and 82dB dynamic range. It operates at -30 to 70°C, with a supply voltage of 1.7-1.95V and a max current of 65mA. Ideal for applications requiring high-quality digital imaging in a compact form factor.

Median Price

$8.585

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$11.530

100+ parts

$8.950

1k+ parts

$7.960

10k+ parts

$6.730

15

$11.530

$8.950

$7.960

$6.730

DigiKey

USA . 912 parts In-Stock

1+ parts

-

100+ parts

$5.640

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912

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$5.640

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Flip Electronics (Authorized)

USA . 912 parts In-Stock

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912

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Distributors (In-Stock)

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Digiode

USA . 639 parts In-Stock

1+ parts

$10.954

100+ parts

-

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639

$10.954

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Vyrian

USA . 12,214 parts In-Stock

1+ parts

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12,214

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Flip Electronics

USA . 912 parts In-Stock

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912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 345 parts In-Stock

1+ parts

$0.596

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345

$0.596

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Northwest PG Solutions

USA . 726 parts In-Stock

1+ parts

$0.656

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726

$0.656

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Corohmni

South Africa . 110 parts In-Stock

1+ parts

$5.640

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110

$5.640

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Corphita

USA . 1,624 parts In-Stock

1+ parts

$10.377

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1,624

$10.377

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SupplyDigital Components

Austria . 8,317 parts In-Stock

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8,317

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TANS Electronics

Latvia . 2,865 parts In-Stock

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2,865

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Problanco Electronics

Mexico . 1,881 parts In-Stock

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1,881

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UHIMA Technologies

Türkiye . 954 parts In-Stock

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954

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Kulean Microsystems

USA . 583 parts In-Stock

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583

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Perfect Parts

USA . 202 parts In-Stock

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202

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Overview

Capture the world in stunning clarity with the AR0130CSSC00SPBA0-DR1 image sensor by Onsemi. Known for their quality and reliability, Onsemi delivers cutting-edge technology to transform your imaging experience. Ideal for applications ranging from security cameras to automotive systems, this image sensor offers unparalleled value and performance. With a pixel size of 3.75um and a dynamic range of 82dB, the AR0130CSSC00SPBA0-DR1 ensures crisp, detailed images in any environment. Upgrade your imaging solutions with Onsemi's advanced technology today.

Feature Benefit Bullets

Pixel Size (um) 3.75

Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications that require detailed and sharp images.

Maximum Supply Voltage 1.95 V

The high maximum supply voltage provides flexibility in power supply options and can accommodate various voltage requirements in different applications.

Master Clock 50 MHz

The high master clock frequency allows for fast data readout and processing, making this image sensor suitable for applications that require real-time imaging.

Body Width 11.43 inch

The compact body width makes this image sensor easy to integrate into different devices and systems without taking up much space.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high sensitivity, making them a popular choice for various imaging applications.

Package Shape or Style SQUARE

The square package shape allows for easier integration and alignment during assembly, ensuring proper positioning for optimal image capture.

Minimum Supply Voltage 1.7 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices that use this image sensor.

Maximum Operating Temperature 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making this image sensor suitable for outdoor and industrial applications.

Horizontal Pixel 1280

The high number of horizontal pixels allows for high-resolution images to be captured with fine details, making this image sensor ideal for applications that require precision imaging.

Output Range 0.40-1.50V

The wide output range provides flexibility in signal processing and can accommodate different voltage levels in various systems, allowing for versatile use of this image sensor.

Output Type DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and interfacing with other digital components, making it easier to integrate this image sensor into digital systems.

Minimum Operating Temperature -30 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making this image sensor suitable for outdoor and automotive applications.

Maximum Operating Current 65 mA

The low maximum operating current helps in conserving power and reducing heat generation, making this image sensor energy-efficient and suitable for battery-powered devices.

Housing PLASTIC

The plastic housing is lightweight and durable, providing protection to the internal components and making the image sensor suitable for portable and ruggedized devices.

Dynamic Range 82 dB

The high dynamic range allows for capturing images with a wide range of brightness levels, ensuring accurate representation of scenes with both dark and bright areas.

Vertical Pixel 960

The high number of vertical pixels enables capturing high-resolution images with intricate details, making this image sensor suitable for applications that require detailed vertical imaging.

Body Length/Diameter 11.43 mm

The compact body length/diameter makes this image sensor easy to handle and install, allowing for seamless integration into different devices and systems.

Optical Format (inch) 1/3

The 1/3 inch optical format is commonly used in camera sensors and provides a good balance between sensor size and image quality, making this image sensor suitable for a wide range of imaging applications.

Termination Type SOLDER

Solder termination allows for secure and reliable connections during assembly, ensuring long-term performance and durability in different operating conditions.

Output Interface Type 2-WIRE INTERFACE

The 2-wire interface simplifies communication with external devices and controllers, enabling easy integration of this image sensor into various systems and platforms.

Frame Rate 60 fps

The high frame rate of 60 frames per second allows for capturing smooth and fluid motion in video recording, making this image sensor suitable for applications that require high-speed imaging.

Array Type FRAME

The frame array type allows for capturing images in a sequential manner, ensuring efficient data readout and processing, making this image sensor suitable for applications that require continuous imaging.

Mounting Feature SURFACE MOUNT

The surface mounting feature simplifies the installation and integration of this image sensor on PCBs and other surfaces, allowing for easy assembly in various devices and systems.

Technical Specifications

Image Sensors AR0130CSSC00SPBA0-DR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5 TO 3.1 V

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

1.535 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

82 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

Housing:

PLASTIC

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

65 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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