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UJA1079TW/5V0,112

NXP Semiconductors

UJA1079TW/5V0,112 by NXP Semiconductors

UJA1079TW/5V0,112 by NXP Semiconductors is an automotive IC designed for robust performance with a supply voltage range of 4.5-28V. It features a dual terminal layout and operates in extreme temperatures from -40 °C to 125 °C. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,201 parts In-Stock

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Digiode

USA . 4,254 parts In-Stock

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Anansix

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Microchip USA

USA . 273 parts In-Stock

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One Stop Electronics

USA . 1,101 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 366 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Elevate your automotive design with the UJA1079TW/5V0,112 from NXP Semiconductors—a trusted leader in high-quality automotive ICs. Tailored for reliability and performance, this compact solution ensures seamless integration in diverse applications, from advanced driver assistance systems to energy-efficient control units. With exceptional temperature resilience and low power consumption, it guarantees longevity and efficiency, empowering your innovations while keeping safety at the forefront.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance against environmental factors, making this automotive IC reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on circuit boards, leading to compact designs in automotive applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout flexibility, making it easier to fit into various automotive designs.

Power Supplies (V): 4.5/28

A wide voltage range of 4.5 to 28V ensures compatibility with different automotive power systems, enhancing versatility.

No. of Terminals: 32

With 32 terminals, this IC can support a complex set of functionalities, making it suitable for advanced automotive applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to reduced weight and space requirements, which is critical in automotive engineering.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in high-heat automotive environments.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this IC suitable for extreme weather conditions, ensuring performance in all climates.

Terminal Position: DUAL

Dual terminal position enhances connectivity options, which can simplify circuit design and assembly.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, this temperature grade guarantees the IC's resilience to temperature fluctuations encountered in vehicles.

Maximum Supply Current (Isup): 10 mA

A maximum supply current of 10 mA denotes energy efficiency, promoting lower power consumption in automotive systems.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering, ensuring a reliable connection that can withstand automotive vibrations.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for compact design while maintaining solder joint integrity, suitable for modern automotive electronic designs.

Technical Specifications

Automotive ICs UJA1079TW/5V0,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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