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UJA1023T/2R04,512

NXP Semiconductors

UJA1023T/2R04,512 by NXP Semiconductors

NXP Semiconductors UJA1023T/2R04,512 is an Automotive IC with 16 terminals. It operates b/w -40 to 125°C and supports power supplies from 5.5V to 27V. The package is a small outline rectangular shape made of plastic/epoxy, suitable for surface mount applications in automotive temperature grade environments.

Median Price

$1.948

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$1.948

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Vyrian

USA . 3,733 parts In-Stock

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Digiode

USA . 2,371 parts In-Stock

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Anansix

USA . 233 parts In-Stock

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One Stop Electronics

USA . 614 parts In-Stock

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$0.500

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Aranea Global

USA . 1,000 parts In-Stock

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$1.909

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$1.833

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$1.833

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AZTECH Wire

Italy . 806 parts In-Stock

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$8.187

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QUARKTWIN TECHNOLOGY LTD

USA . 23,734 parts In-Stock

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UNI Independent Distributors

Spain . 6,847 parts In-Stock

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Corphita

USA . 4,922 parts In-Stock

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Microchip USA

USA . 4,571 parts In-Stock

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Overview

Unleash the power of innovation with the UJA1023T/2R04,512 by NXP Semiconductors. This high-quality Automotive IC is designed to revolutionize your automotive applications with its cutting-edge technology and reliability. With NXP Semiconductors' reputation for excellence in the industry, you can trust that this product is built to last. Experience seamless integration, improved performance, and enhanced efficiency like never before. Upgrade your automotive systems today and unlock a world of possibilities with the UJA1023T/2R04,512.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to temperature variations, making this product suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on circuit boards, saving space and assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design that fits well within automotive electronic systems.

Power Supplies (V): 5.5/27

Supports a wide range of power supply voltages, making it versatile for different automotive applications.

No. of Terminals: 16

Sufficient number of terminals allow for connectivity to other components in the automotive system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, enabling compact automotive electronic designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in various automotive environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold climates or during cold engine starts.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and connection options.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance in harsh automotive environments.

Maximum Supply Current (Isup): 7.5 mA

Low maximum supply current helps in reducing power consumption and improving efficiency of the automotive system.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections on the circuit board for enhanced reliability.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for compact spacing of terminals on the circuit board, enabling high-density designs.

Technical Specifications

Automotive ICs UJA1023T/2R04,512 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5.5/27

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

7.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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