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UJA1076ATW/3V3,112

NXP Semiconductors

UJA1076ATW/3V3,112 by NXP Semiconductors

UJA1076ATW/3V3,112 by NXP Semiconductors is an automotive IC designed for robust performance with a temp range of -40 °C to 125 °C. It features a dual terminal layout and operates on power supplies from 4.5V to 28V. Ideal for automotive applications, it ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,905 parts In-Stock

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Anansix

USA . 2,083 parts In-Stock

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2,083

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Digiode

USA . 1,656 parts In-Stock

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One Stop Electronics

USA . 1,548 parts In-Stock

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$6.500

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Microchip USA

USA . 2,580 parts In-Stock

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$10.933

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2,580

$10.933

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AZTECH Wire

Italy . 133 parts In-Stock

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$14.770

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133

$14.770

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UNI Independent Distributors

Spain . 8,158 parts In-Stock

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Corphita

USA . 4,329 parts In-Stock

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Overview

Elevate your automotive designs with the UJA1076ATW/3V3,112 from NXP Semiconductors—where quality meets innovation. This robust automotive IC combines exceptional performance with energy efficiency, ensuring reliability in extreme conditions. Built to last and designed for a range of applications, it empowers engineers to create safer, smarter vehicles. Trust in NXP’s legacy of excellence to drive advancements that enhance your projects and elevate user experiences.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance against environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on PCBs, enhancing overall system integration.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy layout and optimization in circuit designs, yielding better thermal and electrical performance.

Power Supplies (V): 4.5/28

This wide voltage range supports diverse automotive systems, providing versatility in various electrical environments.

No. of Terminals: 32

A higher number of terminals enables numerous connections, allowing for complex functionalities in automotive applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for space-constrained applications in vehicles, optimizing real estate without compromising functionality.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand the thermal stresses typical in automotive environments, ensuring reliability.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures performance in extreme cold conditions, vital for automotive applications in varied climates.

Terminal Position: DUAL

Dual terminal position enables flexible circuit design and layout options, enhancing ease of integration into different systems.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this component offers reliability and durability essential for vehicle electronics.

Maximum Supply Current (Isup): 0.097 mA

A low supply current results in reduced power consumption, contributing to energy efficiency in automotive systems.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring robust connections and reliability in operation.

Terminal Pitch: 0.635 mm

A tight terminal pitch supports high-density mounting on PCBs, making it suitable for advanced automotive applications with space constraints.

Technical Specifications

Automotive ICs UJA1076ATW/3V3,112 attributes and parameters. Explore more Automotive ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Automotive Circuits

Maximum Supply Current (Isup):

.097 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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